JPH0292934U - - Google Patents

Info

Publication number
JPH0292934U
JPH0292934U JP1989001052U JP105289U JPH0292934U JP H0292934 U JPH0292934 U JP H0292934U JP 1989001052 U JP1989001052 U JP 1989001052U JP 105289 U JP105289 U JP 105289U JP H0292934 U JPH0292934 U JP H0292934U
Authority
JP
Japan
Prior art keywords
package
chip
attached
solder bump
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989001052U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989001052U priority Critical patent/JPH0292934U/ja
Publication of JPH0292934U publication Critical patent/JPH0292934U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Description

【図面の簡単な説明】
第１図はこの考案による実施例の構成図、第２
図は第１図の実施例を採用したモジユールの構成
図、第３図と第４図はこの考案による他の実施例
の構成図、第５図〜第１５図は従来技術の説明図
、第１６図と第１７図はこの考案による他の実施
例の構成図である。 １……パツケージ、２……電極、３……ハンダ
バンプ、４……ＩＣチツプ、５……ワイヤ、６…
…カバー、７……板、８……突起部、９……ハン
ダペデスタル、１１……基板、１２……ピン、１
３……ＩＣチツプ、１４……ワイヤ、１５……電
極、１６……導体、１７……内部導体、１８……
電極、１９……パツケージ、２０……パツケージ
、２１……電極、２２……ハンダバンプ、２３…
…放熱器、２４……放熱器、３１……フリツプチ
ツプ。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ パツケージ１のＩＣチツプ４取付側の面Ａに
    取付けられる熱伝導性のよい板７と、 パツケージ１のＩＣチツプ４取付側の面Ａと反
    対側の面Ｂ上に格子状に配列された電極２と、 電極２に形成されるハンダバンプ３と、を備え
    ることを特徴とするチツプキヤリア型パツケージ
    。 ２ パツケージ１のＩＣチツプ４取付側の面Ａに
    取付けられる熱伝導率のよい板３と、 パツケージ１のＩＣチツプ４取付側の面Ａと反
    対側の面Ｂ上に格子状に配列された電極２と、 電極２に形成されるハンダバンプ３と、 ハンダバンプ３を形成した面上に設けられる突
    起部８とを備えることを特徴とするチツプキヤリ
    ア型パツケージ。 ３ パツケージ１のＩＣチツプ４取付側の面Ａに
    取付けられる熱伝導率のよい板３と、 パツケージ１のＩＣチツプ４取付側の面Ａと反
    対側の面Ｂ上に格子状に配列された電極２と、 電極２に形成されるハンダバンプ３とを備え、 ハンダバンプ３を基板１１側のハンダ９よりも
    高融点にしたことを特徴とするチツプキヤリア型
    パツケージ。
JP1989001052U 1989-01-09 1989-01-09 Pending JPH0292934U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001052U JPH0292934U (ja) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001052U JPH0292934U (ja) 1989-01-09 1989-01-09

Publications (1)

Publication Number Publication Date
JPH0292934U true JPH0292934U (ja) 1990-07-24

Family

ID=31200605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001052U Pending JPH0292934U (ja) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0292934U (ja)

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