JPS6237939U - - Google Patents

Info

Publication number
JPS6237939U
JPS6237939U JP1985130089U JP13008985U JPS6237939U JP S6237939 U JPS6237939 U JP S6237939U JP 1985130089 U JP1985130089 U JP 1985130089U JP 13008985 U JP13008985 U JP 13008985U JP S6237939 U JPS6237939 U JP S6237939U
Authority
JP
Japan
Prior art keywords
electronic component
conductive pattern
component device
substrate
insulating adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985130089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130089U priority Critical patent/JPS6237939U/ja
Publication of JPS6237939U publication Critical patent/JPS6237939U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案電子部品装置の一実施例を示す
断面図、第２図は本考案の一実施例の要部断面図
、第３図は本考案の一実施例で使用できるポリイ
ミド基板上の導電パターンの凸状部の形成工程図
、第４図〜第６図は夫々本考案の説明に供する線
図、第７図は従来例を示す断面図、第８図及び第
９図は夫々従来例の説明に供する線図、第１０図
及び第１１図は夫々従来例の要部拡大断面図であ
る。 １は半導体集積回路チツプ、２はボンデイング
パツド、３はパツシベーシヨン膜、４はポリイミ
ド基板、５は導電パターン、６は半田金属粒子、
７は絶縁性接着剤である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 導電パターンが設けられた基板と該基板上に配
    された電子部品とが導電性粒子を分散させた絶縁
    性接着剤を介して接続されてなる電子部品装置に
    おいて、上記導電パターンの上記電子部品の電極
    との接続部分を凸状に形成したことを特徴とする
    電子部品装置。
JP1985130089U 1985-08-27 1985-08-27 Pending JPS6237939U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130089U JPS6237939U (ja) 1985-08-27 1985-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130089U JPS6237939U (ja) 1985-08-27 1985-08-27

Publications (1)

Publication Number Publication Date
JPS6237939U true JPS6237939U (ja) 1987-03-06

Family

ID=31027254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130089U Pending JPS6237939U (ja) 1985-08-27 1985-08-27

Country Status (1)

Country Link
JP (1) JPS6237939U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227444A (ja) * 1988-03-07 1989-09-11 Sharp Corp 接続構造
WO1996036992A1 (fr) * 1995-05-18 1996-11-21 Hitachi, Ltd. Composant a semi-conducteur et fabrication dudit composant
WO1996042107A1 (fr) * 1995-06-13 1996-12-27 Hitachi Chemical Company, Ltd. Dispositif a semi-conducteurs, tableau de connexions servant a monter ce dispositif et son procede de fabrication
JP2007150374A (ja) * 1997-03-21 2007-06-14 Seiko Epson Corp 半導体装置及びフィルムキャリアテープ並びにこれらの製造方法
US12070224B2 (en) 2009-12-22 2024-08-27 Cook Medical Technologies Llc Medical devices with detachable pivotable jaws

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227444A (ja) * 1988-03-07 1989-09-11 Sharp Corp 接続構造
WO1996036992A1 (fr) * 1995-05-18 1996-11-21 Hitachi, Ltd. Composant a semi-conducteur et fabrication dudit composant
WO1996042107A1 (fr) * 1995-06-13 1996-12-27 Hitachi Chemical Company, Ltd. Dispositif a semi-conducteurs, tableau de connexions servant a monter ce dispositif et son procede de fabrication
US6223429B1 (en) 1995-06-13 2001-05-01 Hitachi Chemical Company, Ltd. Method of production of semiconductor device
JP2007150374A (ja) * 1997-03-21 2007-06-14 Seiko Epson Corp 半導体装置及びフィルムキャリアテープ並びにこれらの製造方法
US12070224B2 (en) 2009-12-22 2024-08-27 Cook Medical Technologies Llc Medical devices with detachable pivotable jaws

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