JPH029435U - - Google Patents
Info
- Publication number
- JPH029435U JPH029435U JP1988087517U JP8751788U JPH029435U JP H029435 U JPH029435 U JP H029435U JP 1988087517 U JP1988087517 U JP 1988087517U JP 8751788 U JP8751788 U JP 8751788U JP H029435 U JPH029435 U JP H029435U
- Authority
- JP
- Japan
- Prior art keywords
- bonding stage
- lead
- bonding
- tab tape
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087517U JPH029435U (cs) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087517U JPH029435U (cs) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029435U true JPH029435U (cs) | 1990-01-22 |
Family
ID=31312122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988087517U Pending JPH029435U (cs) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029435U (cs) |
-
1988
- 1988-06-30 JP JP1988087517U patent/JPH029435U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH029435U (cs) | ||
| JPH0142346Y2 (cs) | ||
| JPS587355U (ja) | リ−ドフレ−ム | |
| JPH0415239U (cs) | ||
| JPH0236053U (cs) | ||
| JPS60153543U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH01121929U (cs) | ||
| JPH0330433U (cs) | ||
| JPS62122359U (cs) | ||
| JPS5858354U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH0313754U (cs) | ||
| JPH0252339U (cs) | ||
| JPS6327045U (cs) | ||
| JPH0224548U (cs) | ||
| JPS5920633U (ja) | バンプ接合型半導体装置 | |
| JPH0249134U (cs) | ||
| JPH01156552U (cs) | ||
| JPH0192135U (cs) | ||
| JPS63164224U (cs) | ||
| JPS6361135U (cs) | ||
| JPS6033452U (ja) | 樹脂封止型半導体装置 | |
| JPH0186245U (cs) | ||
| JPH03124641U (cs) | ||
| JPH0474463U (cs) | ||
| JPS62166629U (cs) |