JPH0294591A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0294591A JPH0294591A JP24408088A JP24408088A JPH0294591A JP H0294591 A JPH0294591 A JP H0294591A JP 24408088 A JP24408088 A JP 24408088A JP 24408088 A JP24408088 A JP 24408088A JP H0294591 A JPH0294591 A JP H0294591A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- components
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線基板への部品実装法に係り、特に
両面実装基板に多リードピンを有する部品の搭載に好適
なプリント配線板実装法及びプリント配線基板に関する
。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for mounting components on a printed wiring board, and in particular to a method for mounting a printed wiring board and a printed circuit board suitable for mounting components having multiple lead pins on a double-sided mounting board. Regarding wiring boards.
４ＦＡＸ
従来、多ピン部品をプリント配線基板に実装する方法に
は、はんだペーストを用いたりフロはんだ接続法が用い
られる。この時のはんだ溶融法には、特公昭５８−４１
６７９号公報で示されるヒータチップ押付法が有る。従
来はプリント配線基板の一面にのみ部品を搭載していた
ため、基板をステージ上に置いて上面からヒータチップ
を押付はボンデングしていた。4FAX Conventionally, methods for mounting multi-pin components on printed wiring boards include the use of solder paste or the flow soldering connection method. The solder melting method used at this time was
There is a heater chip pressing method shown in Japanese Patent No. 679. Conventionally, components were mounted only on one side of a printed wiring board, so the board was placed on a stage and the heater chip was pressed and bonded from the top.
［発明が解決しようとする課題］
ところが部品実装の高密度化にともないプリント配線基
板の裏面にも部品が配置されるようになって、従来のよ
うに基板全体をステージ上に置いてボンディングするこ
とが出来ず基板端部を保持することになり、ボンディン
グ時に基板がたわむという問題があった。[Problem to be solved by the invention] However, as the density of component mounting increases, components are also placed on the back side of the printed wiring board, making it no longer possible to place the entire board on a stage and perform bonding as in the past. There was a problem that the edge of the substrate was held without being able to hold the substrate, causing the substrate to bend during bonding.
本発明の目的は上記問題点を解決し、基板、部品等に損
傷を与えないプリント配線板実装法及びプリント配線基
板を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a printed wiring board mounting method and a printed wiring board that do not damage the board, components, etc.
上記目的は、後付けする部品配置される位置と対応する
基板。裏面位置に部品の配置を行なわないようにするこ
とにより、達成される。The above purpose is to create a board that corresponds to the position where parts to be retrofitted are placed. This is achieved by not arranging components on the back side.
すなわち、後付は部品のリード部を加熱ブロックにてプ
リント配、腺基板に押付は接続する場合、プリント配線
基板裏面の部品が配置されていない位置を支えることが
出来、プリント配線基板のたわみを発生させることなく
ボンディングに必要十分な押付は荷重をかけることが出
来る。In other words, when retrofitting the lead part of a component by printing it on a heating block and connecting it to a gland board by pressing, it can support the position on the back of the printed wiring board where no components are placed, and prevents deflection of the printed wiring board. A sufficient pressing load can be applied for bonding without causing any occurrence of bonding.
以下、本発明の一実施例を第１〜第５図により説明する
。第１〜第３図に本発明になるプリント配線基板への部
品実装状態を示す。基板１の表面２及び３には多数個の
チップ部品４．４・・・と複数のリードピン５．５・・
・を有する多ピン部品６が搭載される。多ピン部品６の
リードピン５．５・・・が配置される基板１の裏面は部
品未配置領域７が形成される。第４図〜第５図に部品実
装手順を示す。An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. 1 to 3 show states in which components are mounted on a printed wiring board according to the present invention. On the surfaces 2 and 3 of the board 1 are a large number of chip components 4.4... and a plurality of lead pins 5.5...
A multi-pin component 6 having . A non-component area 7 is formed on the back surface of the substrate 1 where the lead pins 5, 5, . . . of the multi-pin component 6 are arranged. 4 and 5 show the component mounting procedure.
第４図に示すように、まず基板１の両面にチップ部品４
．４・・・を搭載接続する。次いで多ピン部品６を基板
１の所定位置に位置合わせし載置した後、基板裏面３の
部品未配置領域７を支持金具８で支持するとともに、リ
ードピン５．５・・・をヒータチップ９で加熱圧着して
リードピン５．５・・・と基板１の接続端子を接合する
。As shown in FIG. 4, first, chip parts 4 are placed on both sides of the board 1.
．． 4. Install and connect... Next, after aligning and placing the multi-pin component 6 at a predetermined position on the board 1, the non-component area 7 on the back surface 3 of the board is supported by the support fitting 8, and the lead pins 5, 5, etc. are supported by the heater chip 9. The lead pins 5, 5, . . . and the connection terminals of the substrate 1 are joined by heat and pressure bonding.
チップ部品４．４・・・及び多ビン部品６の接続端子と
の接続ははんだリフロ法によって行なう。Connection with the connection terminals of the chip components 4, 4, . . . and the multi-bin component 6 is performed by a solder reflow method.
本発明によれば、多ピン部品のリードピンを加熱圧着す
る場合のヒータチップ押付力による基板のたわみを、ヒ
ータチップ直下に位置する支持金具によって防止するこ
とが出来、多ピン部品の接続信頼性を向上させるととも
に、先付された隣接チップ部品への損傷を防止すること
が出来る。According to the present invention, when the lead pins of a multi-pin component are bonded under heat and pressure, the bending of the board due to the pressing force of the heater chip can be prevented by the support fitting located directly under the heater chip, and the connection reliability of the multi-pin component can be improved. At the same time, it is possible to prevent damage to adjacent chip components that have been previously attached.
第１図は本発明の一実施例の部品実装状態を示す断面図
、第２図は基板表面から見た平面図、第３図は基板裏面
から見た平面図、第４図、第５図は部品実装手順を示す
断面図である。
１・・・基板、４・・・チップ部品、６・・・多ピン部
品、７・・・部品未配置領域、８・・・支持金具、９・
・・ヒータチップ。
図面の浄書（内容に変更なし）
晃４国
第６０
乙 クピンｑあFig. 1 is a cross-sectional view showing a component mounting state of an embodiment of the present invention, Fig. 2 is a plan view seen from the front surface of the board, Fig. 3 is a plan view seen from the back side of the board, Figs. 4 and 5. FIG. 2 is a cross-sectional view showing a component mounting procedure. DESCRIPTION OF SYMBOLS 1... Board, 4... Chip component, 6... Multi-pin component, 7... Part-unplaced area, 8... Supporting metal fitting, 9...
...Heater chip. Engraving of drawings (no changes in content) Ko4koku No. 60 B Kupinqa
Claims (1)
有するプリント配線基板において、表面に実装される電
子部品の配置位置に対応する裏面部位置に電子部品を実
装しない配線パターンを設けたことを特徴とするプリン
ト配線基板。1. A printed wiring board having wiring patterns for mounting electronic components on both sides, characterized in that a wiring pattern on which no electronic components are mounted is provided on the back side corresponding to the placement position of the electronic components mounted on the front surface. printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24408088A JPH0294591A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24408088A JPH0294591A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294591A true JPH0294591A (en) | 1990-04-05 |
Family
ID=17113436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24408088A Pending JPH0294591A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0294591A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5918362A (en) * | 1997-02-04 | 1999-07-06 | Mitsubishi Electric Semiconductor Software Co., Ltd. | Jig for dual-side mounting PC boards |
-
1988
- 1988-09-30 JP JP24408088A patent/JPH0294591A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5918362A (en) * | 1997-02-04 | 1999-07-06 | Mitsubishi Electric Semiconductor Software Co., Ltd. | Jig for dual-side mounting PC boards |
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