JPH0298654U - - Google Patents
Info
- Publication number
- JPH0298654U JPH0298654U JP787489U JP787489U JPH0298654U JP H0298654 U JPH0298654 U JP H0298654U JP 787489 U JP787489 U JP 787489U JP 787489 U JP787489 U JP 787489U JP H0298654 U JPH0298654 U JP H0298654U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic component
- main body
- leads
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP787489U JPH0298654U (2) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP787489U JPH0298654U (2) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298654U true JPH0298654U (2) | 1990-08-06 |
Family
ID=31213263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP787489U Pending JPH0298654U (2) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298654U (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02294055A (ja) * | 1989-05-08 | 1990-12-05 | Matsushita Electric Ind Co Ltd | Ｉｃパッケージ |
| JPH08125069A (ja) * | 1994-10-24 | 1996-05-17 | Nec Kyushu Ltd | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249355A (ja) * | 1984-05-24 | 1985-12-10 | Nec Corp | プラスチツクチツプキヤリアとその製造装置 |
-
1989
- 1989-01-26 JP JP787489U patent/JPH0298654U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249355A (ja) * | 1984-05-24 | 1985-12-10 | Nec Corp | プラスチツクチツプキヤリアとその製造装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02294055A (ja) * | 1989-05-08 | 1990-12-05 | Matsushita Electric Ind Co Ltd | Ｉｃパッケージ |
| JPH08125069A (ja) * | 1994-10-24 | 1996-05-17 | Nec Kyushu Ltd | 半導体装置 |
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