JPH0310084A - ポリエーテルイミド基体の処理方法およびそれによって得られた物品 - Google Patents

ポリエーテルイミド基体の処理方法およびそれによって得られた物品

Info

Publication number
JPH0310084A
JPH0310084A JP2087593A JP8759390A JPH0310084A JP H0310084 A JPH0310084 A JP H0310084A JP 2087593 A JP2087593 A JP 2087593A JP 8759390 A JP8759390 A JP 8759390A JP H0310084 A JPH0310084 A JP H0310084A
Authority
JP
Japan
Prior art keywords
polyetherimide
substrate
metal
treated
electrolessly deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2087593A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329864B2 (2
Inventor
Donald Franklin Foust
ドナルド・フランクリン・フォースト
William V Dumas
ウィリアム・ビンセント・ドウマス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPH0310084A publication Critical patent/JPH0310084A/ja
Publication of JPH0329864B2 publication Critical patent/JPH0329864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1355—Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2087593A 1989-04-03 1990-04-03 ポリエーテルイミド基体の処理方法およびそれによって得られた物品 Granted JPH0310084A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/331,715 US4999251A (en) 1989-04-03 1989-04-03 Method for treating polyetherimide substrates and articles obtained therefrom
US331715 1989-04-03

Publications (2)

Publication Number Publication Date
JPH0310084A true JPH0310084A (ja) 1991-01-17
JPH0329864B2 JPH0329864B2 (2) 1991-04-25

Family

ID=23295069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2087593A Granted JPH0310084A (ja) 1989-04-03 1990-04-03 ポリエーテルイミド基体の処理方法およびそれによって得られた物品

Country Status (4)

Country Link
US (1) US4999251A (2)
EP (1) EP0391201B1 (2)
JP (1) JPH0310084A (2)
DE (1) DE69003981T2 (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06158334A (ja) * 1992-08-03 1994-06-07 General Electric Co <Ge> ポリピロメリトイミド表面への金属被覆の密着性を改善する方法
JP2002293965A (ja) * 2001-03-29 2002-10-09 Ube Ind Ltd 表面処理方法および金属薄膜を有するポリイミドフィルム
JP2006233231A (ja) * 2005-02-21 2006-09-07 Sekisui Chem Co Ltd 樹脂シートの製造方法、絶縁基板用樹脂シート、絶縁基板、及び多層基板
WO2006129526A1 (ja) * 2005-06-03 2006-12-07 Mitsui Chemicals, Inc. ポリイミドフィルム、ポリイミド金属積層体及びその製造方法
WO2008143190A1 (ja) * 2007-05-22 2008-11-27 Okuno Chemical Industries Co., Ltd. 樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤
JP2012045745A (ja) * 2010-08-25 2012-03-08 Sumitomo Metal Mining Co Ltd 金属化ポリイミドフィルム、およびその評価方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5498440A (en) * 1992-01-21 1996-03-12 General Electric Company Adhesion of electroless coating to resinous articles
US5229169A (en) * 1992-01-21 1993-07-20 General Electric Company Adhesion of electroless coatings to resinous articles by treatment with permanganate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
US5897368A (en) * 1997-11-10 1999-04-27 General Electric Company Method of fabricating metallized vias with steep walls
DE10121561A1 (de) * 2001-05-03 2002-11-07 Heidelberger Druckmasch Ag Bebilderung und Löschung einer Druckform aus Polymermaterial mit Imid-Gruppen
DK175025B1 (da) * 2002-09-26 2004-05-03 Inst Produktudvikling Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres
US20050239295A1 (en) * 2004-04-27 2005-10-27 Wang Pei-L Chemical treatment of material surfaces
US8524854B2 (en) * 2009-12-31 2013-09-03 Sabic Innovative Plastics Ip B.V. Chloro-substituted polyetherimides having improved relative thermal index
IN2015DN02777A (2) * 2012-12-31 2015-09-04 Sabic Innovative Plastics Ip
WO2015010198A1 (en) 2013-07-24 2015-01-29 National Research Council Of Canada Process for depositing metal on a substrate
US10377860B2 (en) 2013-09-13 2019-08-13 Sabic Global Technologies B.V. Polyetherimides, methods of manufacture, and articles formed therefrom
US9382382B2 (en) 2013-09-13 2016-07-05 Sabic Global Technologies B.V. Polyetherimides, methods of manufacture, and articles formed therefrom
US20210102296A1 (en) * 2019-10-07 2021-04-08 State Research Institute Center For Physical Sciences And Technology Method for increasing surface adhesion in polyetherimide substrates
DE102023120007A1 (de) * 2023-07-27 2025-01-30 Biconex Gmbh Verfahren zur Beschichtung von Kunststoffformkörpern und Mittel zur Realisierung einer mikrostrukturierten Oberfläche der Kunststoffformkörper

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE792310A (fr) * 1971-12-08 1973-06-05 Kalle Ag Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides
DE2239908C3 (de) * 1972-08-14 1979-12-13 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Basismaterial zur Herstellung gedruckter Schaltungen
US4054693A (en) * 1974-11-07 1977-10-18 Kollmorgen Technologies Corporation Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition
JPS5874351A (ja) * 1981-10-30 1983-05-04 東レ株式会社 銅蒸着ポリエステルフイルム
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
US4610895A (en) * 1984-02-01 1986-09-09 Shipley Company Inc. Process for metallizing plastics
US4629636A (en) * 1984-06-07 1986-12-16 Enthone, Incorporated Process for treating plastics with alkaline permanganate solutions
US4592852A (en) * 1984-06-07 1986-06-03 Enthone, Incorporated Composition and process for treating plastics with alkaline permanganate solutions
WO1987000391A1 (en) * 1985-06-24 1987-01-15 Enthone, Incorporated Process for conditioning the surface of plastic substrates prior to metal plating
DE3530617A1 (de) * 1985-08-23 1987-02-26 Schering Ag Konditionierungsmittel fuer die behandlung von basismaterialien
US4775449A (en) * 1986-12-29 1988-10-04 General Electric Company Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
DE3708214A1 (de) * 1987-03-12 1988-09-22 Schering Ag Verfahren zur haftfesten metallisierung von kunststoffen
US4842946A (en) * 1987-09-28 1989-06-27 General Electric Company Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06158334A (ja) * 1992-08-03 1994-06-07 General Electric Co <Ge> ポリピロメリトイミド表面への金属被覆の密着性を改善する方法
JP2002293965A (ja) * 2001-03-29 2002-10-09 Ube Ind Ltd 表面処理方法および金属薄膜を有するポリイミドフィルム
JP2006233231A (ja) * 2005-02-21 2006-09-07 Sekisui Chem Co Ltd 樹脂シートの製造方法、絶縁基板用樹脂シート、絶縁基板、及び多層基板
WO2006129526A1 (ja) * 2005-06-03 2006-12-07 Mitsui Chemicals, Inc. ポリイミドフィルム、ポリイミド金属積層体及びその製造方法
WO2008143190A1 (ja) * 2007-05-22 2008-11-27 Okuno Chemical Industries Co., Ltd. 樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤
JP2012045745A (ja) * 2010-08-25 2012-03-08 Sumitomo Metal Mining Co Ltd 金属化ポリイミドフィルム、およびその評価方法

Also Published As

Publication number Publication date
DE69003981T2 (de) 1994-05-19
EP0391201B1 (en) 1993-10-20
EP0391201A1 (en) 1990-10-10
US4999251A (en) 1991-03-12
DE69003981D1 (de) 1993-11-25
JPH0329864B2 (2) 1991-04-25

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