JPH0310548U - - Google Patents

Info

Publication number
JPH0310548U
JPH0310548U JP1989071921U JP7192189U JPH0310548U JP H0310548 U JPH0310548 U JP H0310548U JP 1989071921 U JP1989071921 U JP 1989071921U JP 7192189 U JP7192189 U JP 7192189U JP H0310548 U JPH0310548 U JP H0310548U
Authority
JP
Japan
Prior art keywords
semiconductor chip
lid
semiconductor
cooling
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989071921U
Other languages
English (en)
Other versions
JPH0648868Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989071921U priority Critical patent/JPH0648868Y2/ja
Publication of JPH0310548U publication Critical patent/JPH0310548U/ja
Application granted granted Critical
Publication of JPH0648868Y2 publication Critical patent/JPH0648868Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図は本考案に係る冷却構造を説明する原理
図、第２図は境界層を説明する模式図、第３図は
本考案に係る冷却構造の断面図Ａと蓋部内部の平
面図Ｂ、である。 図において、５，１２……配線基板、６……半
導体チツプ、７……流入口、８……流出口、９，
１４……蓋部、１０……鋸歯状の突起、１３……
隔壁、である。

Claims (1)

  1. 【実用新案登録請求の範囲】 配線基板５上にマトリツクス状に装着してある
    複数の半導体チツプ６を格納するパツケージの蓋
    部９に冷媒の流入口７と流出口８とが設けてあり
    、配列している前記半導体チツプ６に対して冷媒
    を一定方向に循環して冷却する構造体において、 半導体チツプ６に近接し、流路を介して対向す
    る蓋部９の天井部にそれぞれ鋸歯状の突起１０を
    設けることを特徴とする半導体装置の冷却構造。
JP1989071921U 1989-06-20 1989-06-20 半導体装置の冷却構造 Expired - Lifetime JPH0648868Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPH0310548U true JPH0310548U (ja) 1991-01-31
JPH0648868Y2 JPH0648868Y2 (ja) 1994-12-12

Family

ID=31609388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071921U Expired - Lifetime JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPH0648868Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012091044A1 (ja) * 2010-12-27 2012-07-05 株式会社ザイキューブ 半導体デバイス・電子部品の実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012091044A1 (ja) * 2010-12-27 2012-07-05 株式会社ザイキューブ 半導体デバイス・電子部品の実装構造

Also Published As

Publication number Publication date
JPH0648868Y2 (ja) 1994-12-12

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