JPH03112995U - - Google Patents
Info
- Publication number
- JPH03112995U JPH03112995U JP2113290U JP2113290U JPH03112995U JP H03112995 U JPH03112995 U JP H03112995U JP 2113290 U JP2113290 U JP 2113290U JP 2113290 U JP2113290 U JP 2113290U JP H03112995 U JPH03112995 U JP H03112995U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- heat sink
- pin
- cap
- round hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229920006124 polyolefin elastomer Polymers 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案による電子回路モジユールの
一実施例を示す外観図、第２図は第１図の断面Ｃ
Ｃを示す図、第３図は従来の代表的な電子回路モ
ジユールを示す外観図、第４図は第３図の断面Ａ
Ａを示す図、第５図は第３図に示す電子回路モジ
ユールを実装した電子機器の外観図、第６図は第
５図の断面ＢＢを示す図である。
図において１は電子回路モジユール、２はプリ
ント配線板、３は放熱板、４はＩＣ、５はＬＳＩ
、６はキヤツプ、７はピン、８はシヤーシ、９は
開口部、１０はカバー、１１は隔壁、１２は通風
ダクト、１３は放熱フイン、１４は外部ダクト、
１５は冷却空気、１６溝、１７は端部、１８は凹
部、１９は丸穴、２０はサラ穴、２１はハンダフ
イレツト、２２は熱伝導ラバーである。なお各図
中同一符号は同一または相当部分を示す。
Fig. 1 is an external view showing an embodiment of the electronic circuit module according to this invention, and Fig. 2 is a cross section C of Fig. 1.
Figure 3 is an external view of a typical conventional electronic circuit module, Figure 4 is cross section A of Figure 3.
5 is an external view of an electronic device in which the electronic circuit module shown in FIG. 3 is mounted, and FIG. 6 is a view showing cross section BB of FIG. 5. In the figure, 1 is an electronic circuit module, 2 is a printed wiring board, 3 is a heat sink, 4 is an IC, and 5 is an LSI.
, 6 is a cap, 7 is a pin, 8 is a chassis, 9 is an opening, 10 is a cover, 11 is a partition wall, 12 is a ventilation duct, 13 is a heat radiation fin, 14 is an external duct,
15 is cooling air, 16 is a groove, 17 is an end, 18 is a recess, 19 is a round hole, 20 is a counter hole, 21 is a solder fillet, and 22 is a heat conductive rubber. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
部に収納する集積回路を保護する矩形平板状のキ
ヤツプを有し、かつ上記キヤツプの外周にはグリ
ツド状に配置されたピンを有する電子回路部品と
、上記電子回路部品と対向する一面には、上記キ
ヤツプの外形より若干大きな矩形凹部及び上記ピ
ンの太さより若干大きな丸穴を備え、かつ反対面
には上記丸穴を面としたサラ穴を形成するととも
に、上記丸穴に上記電子回路部品のピンが挿入さ
れた金属製で平板状の放熱板と、上記放熱板と上
記電子回路部品とで挟持され、かつ双方に密着す
るように配せられ、さらにポリオレフイン系エラ
ストマーとＡＩ２Ｏ３系フイラーを主成分とする
熱伝導ラバーと、上記ピンが挿入されるとともに
ハンダ付されたスルーホールを備え、かつ上記放
熱板の上記熱伝導ラバーと密着する面と、反対側
の面に接するように配されたプリント配線板とで
構成した事を特徴とする電子回路モジユール。 An electronic circuit which has a rectangular flat external shape, has a rectangular flat cap in the center of one side for protecting an integrated circuit housed inside, and has pins arranged in a grid on the outer periphery of the cap. One side of the component facing the electronic circuit component has a rectangular recess slightly larger than the outer diameter of the cap and a round hole slightly larger than the thickness of the pin, and the opposite side has a countersunk hole with the round hole as a surface. and a flat metal heat sink in which the pin of the electronic circuit component is inserted into the round hole, and the heat sink is sandwiched between the heat sink and the electronic circuit component and is arranged to be in close contact with both. further comprising a thermally conductive rubber mainly composed of a polyolefin elastomer and an AI 2 O 3 filler, and a through hole into which the pin is inserted and soldered, and the thermally conductive rubber of the heat sink. An electronic circuit module comprising a surface that is in close contact with the printed wiring board and a printed wiring board that is placed in contact with the opposite surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113290U JPH03112995U (en) | 1990-03-02 | 1990-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113290U JPH03112995U (en) | 1990-03-02 | 1990-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112995U true JPH03112995U (en) | 1991-11-19 |
Family
ID=31524190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2113290U Pending JPH03112995U (en) | 1990-03-02 | 1990-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112995U (en) |
-
1990
- 1990-03-02 JP JP2113290U patent/JPH03112995U/ja active Pending
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