JPS646041U - - Google Patents

Info

Publication number
JPS646041U
JPS646041U JP1987099366U JP9936687U JPS646041U JP S646041 U JPS646041 U JP S646041U JP 1987099366 U JP1987099366 U JP 1987099366U JP 9936687 U JP9936687 U JP 9936687U JP S646041 U JPS646041 U JP S646041U
Authority
JP
Japan
Prior art keywords
electrode body
chip
lead frame
lead wire
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987099366U
Other languages
English (en)
Other versions
JPH0546271Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987099366U priority Critical patent/JPH0546271Y2/ja
Publication of JPS646041U publication Critical patent/JPS646041U/ja
Application granted granted Critical
Publication of JPH0546271Y2 publication Critical patent/JPH0546271Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案による絶縁物封止型半導体装置
の実施例を示す斜視図、第２図は第１図に示す実
施例に使用するチツプ状部材の他の実施例を示す
断面図、第３図は第１図の実施例を応用した樹脂
封止型複合ＩＣを示す平面図、第４図は従来例を
示す斜視図、第５図はネイルヘツドボンデイング
法によるリード細線の接続方法を示す工程図であ
り、第５図Ａはリード細線の先端部にボールを形
成する状態、第５図Ｂは第一の電極体に第一のボ
ンデイング部を形成する状態、第５図Ｃはキヤピ
ラリを移動する状態、第５図Ｄは第二の電極体に
第二のボンデイング部を形成する状態、第５図Ｅ
はリード細線を切断する状態を示す。 １……支持電極体、２……配線電極体（第一の
電極体）、３……配線電極体（第三の電極体）、
４……パワートランジスタチツプ（エミツタ電極
は第一の電極体）、６……チツプ状部材、６ａ…
…シリコン層、６ｂ……絶縁層、６ｃ……金属層
。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 第一の電極体と第二の電極体との間にリー
    ドフレームの一部である第三の電極体が介在し、
    該第三の電極体を跨いでリード細線が前記第一の
    電極体と第二の電極体とを接続しており、前記第
    三の電極体の一方の主面にはチツプ状部材が載置
    され、前記第三の電極体とは反対側となる前記チ
    ツプ状部材の主面は前記第三の電極体と電気的に
    絶縁されており、前記リード細線と前記第三の電
    極体が交差する位置において、前記チツプ状部材
    の前記主面が前記リード細線と前記第三の電極体
    の間に位置することを特徴とする絶縁物封止型半
    導体装置。 (2) 前記チツプ状部材は前記リード細線の直下
    に、前記リードフレームに半導体チツプを固着す
    る工程と同一の工程内において固着されたもので
    ある実用新案登録請求の範囲第(1)項記載の絶縁
    物封止型半導体装置。 (3) 前記チツプ状部材はシリコンチツプであり
    、該シリンコンチツプは、シリコン層と、前記リ
    ード細線側に絶縁層として前記シリコン層に形成
    されたシリコン酸化膜と、前記第三の電極体側に
    金属層として前記シリコン層に付着されたニツケ
    ル層とを有し、該ニツケル層は前記リードフレー
    ムの表面に固着された実用新案登録請求の範囲第
    (1)項記載の絶縁物封止型半導体装置。 (4) 前記第一の電極体と前記第二の電極体は、
    リードフレーム、該リードフレームに固着された
    回路基板上に形成された電極又は前記リードフレ
    ーム若しくは前記回路基板上に固着された半導体
    チツプ等の電子素子の電極である実用新案登録請
    求の範囲第(1)項記載の絶縁物封止型半導体装置
    。
JP1987099366U 1987-06-30 1987-06-30 Expired - Lifetime JPH0546271Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987099366U JPH0546271Y2 (ja) 1987-06-30 1987-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987099366U JPH0546271Y2 (ja) 1987-06-30 1987-06-30

Publications (2)

Publication Number Publication Date
JPS646041U true JPS646041U (ja) 1989-01-13
JPH0546271Y2 JPH0546271Y2 (ja) 1993-12-03

Family

ID=31326458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987099366U Expired - Lifetime JPH0546271Y2 (ja) 1987-06-30 1987-06-30

Country Status (1)

Country Link
JP (1) JPH0546271Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
WO2021060161A1 (ja) * 2019-09-27 2021-04-01 株式会社村田製作所 モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210845A (ja) * 1984-04-05 1985-10-23 Toshiba Corp 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210845A (ja) * 1984-04-05 1985-10-23 Toshiba Corp 樹脂封止型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
WO2021060161A1 (ja) * 2019-09-27 2021-04-01 株式会社村田製作所 モジュール

Also Published As

Publication number Publication date
JPH0546271Y2 (ja) 1993-12-03

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