JPH03148111A - Developing device for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE:To prevent a developer from going around to the rear surface of a semiconductor substrate by increasing the area of the base larger than that to the substrate, providing a step equivalent to or higher than the thickness of the substrate on the periphery, and supporting the substrate in the base. CONSTITUTION:A developer is dropped from a nozzle 6 to a semiconductor substrate 1 vacuum sucked to a chuck 3, the chuck 3 is rotated at a low speed while placing the developer by using its surface tension to develop it. In this case, since the chuck 3 is smaller than the substrate 1 in a conventional developing device, the developer 9 frequently goes round to the rear surface of the substrate 1. In this developing device, the chuck 3 is increased larger than the substrate 1, a step equivalent to the thickness of the substrate 1 is formed, and the substrate 1 is contained and supported in the chuck 3. Thus, it can prevent the developer from going around to the rear surface of the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing semiconductor devices, and particularly to a developing apparatus used in a photoresist patterning process.

[Conventional technology]

Conventionally, in a developing device used for manufacturing semiconductor devices, a semiconductor supporting base (hereinafter referred to as a chuck) 3 has a smaller size than a semiconductor substrate 1, as shown in FIG.

[Problem to be solved by the invention]

Conventionally, photoresist patterning used in semiconductor device manufacturing involves depositing a photoresist film on both surfaces of a semiconductor substrate, and printing and transferring the photomask pattern through a photomask using a grating exposure process to transfer the photomask pattern to the photoresist on the semiconductor substrate. A photoresist pattern is formed by baking the film and separating it into light-exposed areas and non-exposed areas through a development process. Since the chuck 3 used in this development process is smaller than the semiconductor substrate 1, when the developer is injected or jetted onto the semiconductor substrate l and the development is performed at low speed rotation, the developer 9 is transferred to the semiconductor substrate as shown in FIG. board l
This often occurs, and the developing solution adhering to the back surface causes problems in subsequent processes, resulting in a decline in the yield and quality of semiconductor devices.

An object of the present invention is to provide a developing device that can prevent developer from seeping into the back surface of a semiconductor substrate.

[Means to solve the problem]

The developing device of the present invention includes a chuck that prints a photomask pattern by vacuum suction and rotates a semiconductor substrate to which a transferred photoresist film is attached, and a developer that applies a developer to form a pattern on the photoresist film on the semiconductor substrate. In a developing device having an injection or jetting nozzle, the chuck is larger than the semiconductor substrate, and the semiconductor substrate is supported within the chuck by providing a chuck with a step equal to or greater than the thickness of the semiconductor substrate around the chuck. It is characterized by According to the present invention, it is possible to prevent the developer from spilling onto the back surface, and moreover, it is possible to stably develop the entire surface of the semiconductor substrate.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a cross-sectional view of a developing device for explaining an embodiment of the present invention, and FIG. 2 is a plan view of a semiconductor substrate placed on a chuck portion of the developing device shown in FIG. The developing device of this embodiment burns a photomask pattern onto a photoresist film (not shown) attached to the surface of a semiconductor substrate 1 by vacuum suctioning the semiconductor substrate 1 after the transfer and using a pulse motor 2. A rotatable chamber 3, a lower lid 5 with a drain port 4, a nozzle 6 for injecting or spouting developer, and a nozzle 7 for jetting or spouting pure water for washing with water after development. The developer is dropped from a nozzle 6 onto the semiconductor substrate l vacuum-adsorbed by the chuck 3, and the chuck 3 is rotated at low speed using surface tension to reach the case on which the developer is placed. Then, perform development processing. At this time, in the conventional developing device, since the chuck 3 is smaller than the semiconductor substrate 1, the developer 9 often flows around to the back surface of the semiconductor substrate 1 as shown in FIG. In the apparatus, the chuck 3 is enlarged more than the semiconductor substrate 1 as shown in FIG. 2, and a step equal to the thickness of the semiconductor substrate 1 is provided as shown in FIG. This prevents the developer from seeping into the back surface of the semiconductor substrate l.

FIG. 4 is an exploded view of a chuck portion for explaining another embodiment of the present invention. In the developing device of this embodiment, the chuck 30 has a concave surface shape, the wafer I is attracted to the concave bottom surface, and a sufficient amount of developer is stored to perform the development process. This has the advantage that it is possible to solve the conventional problem of poor surface wettability due to a developer having a low surface tension, and to enable stable development for wafer planning.

〔Effect of the invention〕

As explained above, the present invention allows the chuck to be larger than the semiconductor substrate and to accommodate and support the semiconductor substrate within the chuck by providing a step equal to or greater than the thickness of the semiconductor substrate. It is possible to prevent the liquid from penetrating into the back surface of the semiconductor substrate, and by carrying out the development process with a sufficient amount of developer in the chuck, there is an effect that stable development can be performed on the entire surface of the semiconductor substrate.

As a result, it is possible to prevent a decrease in semiconductor yield caused by dirt on the back side and dirt on the next process equipment, improve the reproducibility of the development process, and make a significant contribution to improving the quality of semiconductor products. .

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a developing device according to an embodiment of the present invention, FIG. 2 is a plan view of the chuck portion of FIG. 1, FIG. 3 is a cross-sectional view of the chuck portion of a conventional developing device, and FIG. FIG. 7 is a cross-sectional view of a chuck part according to another embodiment of the present invention. In addition, in the figure, 1...semiconductor substrate, 2...pulse motor 13...chuck, 4...drain port, 5... ...Lower lid, 6...Developer jet nozzle, 7...Pure water nozzle, 8...Top lid,
9...Developer.

Claims (1)

[Claims] A developing device for manufacturing semiconductor devices comprising a base body for vacuum-chucking and rotating a semiconductor substrate to which a photoresist film on which a photomask pattern has been printed and transferred is attached, and a nozzle for supplying a developer to the photoresist film on the semiconductor substrate. , a developing device for manufacturing a semiconductor device, characterized in that the area of the base is larger than the area of the semiconductor substrate, and a step is provided around the periphery that is equal to or more than the thickness of the semiconductor substrate, and the semiconductor substrate is supported within the base. Device.