JPH03150B2 - - Google Patents

Info

Publication number
JPH03150B2
JPH03150B2 JP27744386A JP27744386A JPH03150B2 JP H03150 B2 JPH03150 B2 JP H03150B2 JP 27744386 A JP27744386 A JP 27744386A JP 27744386 A JP27744386 A JP 27744386A JP H03150 B2 JPH03150 B2 JP H03150B2
Authority
JP
Japan
Prior art keywords
solder
nozzle
casing
flow
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27744386A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63130261A (ja
Inventor
Teruo Okano
Junichi Onozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP27744386A priority Critical patent/JPS63130261A/ja
Publication of JPS63130261A publication Critical patent/JPS63130261A/ja
Publication of JPH03150B2 publication Critical patent/JPH03150B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP27744386A 1986-11-20 1986-11-20 噴流式はんだ付け装置 Granted JPS63130261A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27744386A JPS63130261A (ja) 1986-11-20 1986-11-20 噴流式はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27744386A JPS63130261A (ja) 1986-11-20 1986-11-20 噴流式はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS63130261A JPS63130261A (ja) 1988-06-02
JPH03150B2 true JPH03150B2 (lt) 1991-01-07

Family

ID=17583641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27744386A Granted JPS63130261A (ja) 1986-11-20 1986-11-20 噴流式はんだ付け装置

Country Status (1)

Country Link
JP (1) JPS63130261A (lt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904300B2 (ja) * 2018-04-20 2021-07-14 オムロン株式会社 噴流式はんだ付け装置

Also Published As

Publication number Publication date
JPS63130261A (ja) 1988-06-02

Similar Documents

Publication Publication Date Title
EP0083680B1 (en) Wavesoldering of chips
US6431431B2 (en) Apparatus and methods for wave soldering
JP5910616B2 (ja) 噴流ノズル及び噴流装置
JP5900713B2 (ja) 噴流ノズル及び噴流装置
JPS63130261A (ja) 噴流式はんだ付け装置
US4208002A (en) Wave soldering system
JPS63130262A (ja) 噴流式はんだ付け装置
JP5660081B2 (ja) 噴流ノズル及び噴流装置
JP2820260B2 (ja) 噴流式はんだ付け装置
JP2757389B2 (ja) 噴流式自動半田付装置
WO2010087341A1 (ja) 噴流はんだ槽
JPS5813470A (ja) 噴流式はんだ槽
JP2023074718A (ja) 噴流式はんだ付け装置
JPH0641722Y2 (ja) 噴流はんだ槽
CN220634944U (zh) 一种水帘喷漆室的水帘形成结构
JPS61137670A (ja) 噴流式はんだ付け装置
JPS6051943B2 (ja) 噴流式はんだ付け装置
JPS63199065A (ja) 噴流式はんだ槽
JPS5976661A (ja) 噴流式はんだ付け装置
JPH0534849Y2 (lt)
KR930008291B1 (ko) 납땜 및 용제(flux) 도포장치
CA2155351C (en) Solder nozzle with gas knife jet
KR200202457Y1 (ko) 피.씨.비 기판 납땜기의 납량조절장치
JP4554748B2 (ja) ろう付け方法およびその装置
JPH0244933Y2 (lt)