JPH031542U - - Google Patents
Info
- Publication number
- JPH031542U JPH031542U JP6043489U JP6043489U JPH031542U JP H031542 U JPH031542 U JP H031542U JP 6043489 U JP6043489 U JP 6043489U JP 6043489 U JP6043489 U JP 6043489U JP H031542 U JPH031542 U JP H031542U
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- semiconductor device
- refrigerant
- branch
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000003507 refrigerant Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案による半導体素子の冷却構造の
実施例を示す断面図、第２図は従来の半導体素子
の冷却構造を示す断面図である。
図において、１０は電子基板、１１は半導体素
子、１２は熱伝導弾性体、１３，１４，１５はク
ーリングプレート、１６は冷媒供給流路、１７（
１７ａ〜１７ｅ）は分岐流路、１８は冷媒帰還流
路、１９（１９ａ〜１９ｅ）はノズル、２０は噴
射口、２１は冷媒入口、２２は冷媒出口、２３は
封止栓、２４はガスケツトである。
FIG. 1 is a sectional view showing an embodiment of a cooling structure for a semiconductor device according to the present invention, and FIG. 2 is a sectional view showing a conventional cooling structure for a semiconductor device. In the figure, 10 is an electronic board, 11 is a semiconductor element, 12 is a thermally conductive elastic body, 13, 14, and 15 are cooling plates, 16 is a coolant supply channel, and 17 (
17a to 17e) are branch flow paths, 18 is a refrigerant return flow path, 19 (19a to 19e) is a nozzle, 20 is an injection port, 21 is a refrigerant inlet, 22 is a refrigerant outlet, 23 is a sealing plug, and 24 is a gasket. be.
Claims (1)
設するとともに、電子基板１０上に搭載される各
半導体素子１１に対して、冷媒供給流路１６から
分岐する分岐流路１７を形成し、この分岐流路１
７内に設置されるノズル１９を通して冷媒の噴流
を半導体素子１１に衝突させて冷却する半導体素
子の冷却構造において、 各分岐流路１７の流路長を、各分岐流路１７の
入口部の流速に比例して可変させたことを特徴と
する半導体素子の冷却構造。[Claims for Utility Model Registration] A refrigerant supply flow path 16 and a refrigerant return flow path 18 are provided together, and branched from the refrigerant supply flow path 16 for each semiconductor element 11 mounted on the electronic board 10. A branch flow path 17 is formed, and this branch flow path 1
In a semiconductor device cooling structure in which a jet of refrigerant collides with the semiconductor device 11 through a nozzle 19 installed in the semiconductor device 7, the length of each branch channel 17 is determined by the flow velocity at the inlet of each branch channel 17. A cooling structure for a semiconductor device characterized by being variable in proportion to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6043489U JPH031542U (en) | 1989-05-26 | 1989-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6043489U JPH031542U (en) | 1989-05-26 | 1989-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031542U true JPH031542U (en) | 1991-01-09 |
Family
ID=31587794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6043489U Pending JPH031542U (en) | 1989-05-26 | 1989-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031542U (en) |
-
1989
- 1989-05-26 JP JP6043489U patent/JPH031542U/ja active Pending
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