JPH0316345U

JPH0316345U -

Info

Publication number: JPH0316345U
Application number: JP7662889U
Authority: JP
Priority date: 1989-06-28
Filing date: 1989-06-28
Publication date: 1991-02-19

Description

[Brief explanation of the drawing]

第１図は本考案第一実施例の光半導体装置にお
いてワイヤーボンド作業の状態を示す斜視図、第
２図は同じくその断面図、第３図は本考案第二実
施例の光半導体装置においてワイヤーボンド作業
の状態を示す斜視図、第４図は同じくその断面図
第５図は従来の光半導体装置の外観斜視図、第６
，７図は従来の光半導体装置の断面図である。１……光半導体素子、２……外装ケース、３…
…搭載用リード端子、４ａ……結線用治具、５…
…ボンデイングワイヤー、６，７，８……結線用
リード端子、９……傾斜面、１０……凹部。 FIG. 1 is a perspective view showing the state of wire bonding in the optical semiconductor device according to the first embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. FIG. 4 is a sectional view showing the state of bonding work; FIG. 5 is a perspective view of the external appearance of a conventional optical semiconductor device;
, 7 are cross-sectional views of conventional optical semiconductor devices. 1... Optical semiconductor element, 2... Exterior case, 3...
...Lead terminal for mounting, 4a...Jig for connection, 5...
... Bonding wire, 6, 7, 8 ... Lead terminal for connection, 9 ... Inclined surface, 10 ... Recess.

Claims

[Scope of Claim for Utility Model Registration] 1. An optical semiconductor element, an exterior case housing the optical semiconductor element, a mounting lead terminal on which the optical semiconductor element is mounted, and a bonding wire connected to the optical semiconductor element using a connection jig. In the optical semiconductor device, the mounting lead terminal and the wiring lead terminal are integrally fixed to the outer case, and the wiring jig is attached to the inner side wall of the outer case. An optical semiconductor device characterized by being provided with an inclined surface for avoiding a connection jig. 2. An optical semiconductor element, an exterior case housing the optical semiconductor element, a mounting lead terminal on which the optical semiconductor element is mounted, and a connection lead terminal that is connected to the optical semiconductor element via a bonding wire using a connection jig. In the optical semiconductor device, the mounting lead terminal and the wiring lead terminal are integrally fixed to the exterior case, and the wiring jig-avoiding device is provided on the inner side wall of the exterior case to avoid the wiring jig. An optical semiconductor device characterized by being provided with a recess.