JPS6447059U - - Google Patents
Info
- Publication number
- JPS6447059U JPS6447059U JP14146087U JP14146087U JPS6447059U JP S6447059 U JPS6447059 U JP S6447059U JP 14146087 U JP14146087 U JP 14146087U JP 14146087 U JP14146087 U JP 14146087U JP S6447059 U JPS6447059 U JP S6447059U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- semiconductor element
- internal lead
- noise removing
- removing capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図および第２図はそれぞれ本考案をプラス
チツク・モールド半導体装置に実施した場合の一
実施例を示す断面図およびその一部切開裏面図、
第３図および第４図はそれぞれ本考案をセラミツ
ク封止半導体装置に実施した場合の一実施例を示
す断面図およびその裏面図である。
１…アイランド、２…半導体素子、３…電源（
Ｖｃｃ）内部リード、４…接地（ＧＮＤ）側接続
部、５…電源（Ｖｃｃ）側接続部、６…パスコン
素子、７…接地（ＧＮＤ）内部リード、８…プラ
スチツク・モールド材、９…ボンデイング線、１
０ａ…セラミツク壁部材、１０ｂ…セラミツク下
部封止部材、１０ｃ…セラミツク窓封止部材、１
１…上蓋部材、１２…パスコン素子実装用セラミ
ツク窓。
FIG. 1 and FIG. 2 are a sectional view and a partially cut-away back view of an embodiment of the present invention applied to a plastic molded semiconductor device, respectively;
FIGS. 3 and 4 are a cross-sectional view and a back view, respectively, showing an embodiment of the present invention applied to a ceramic-sealed semiconductor device. 1... Island, 2... Semiconductor element, 3... Power supply (
Vcc) internal lead, 4... Grounding (GND) side connection part, 5... Power supply (Vcc) side connection part, 6... Bypass capacitor element, 7... Grounding (GND) internal lead, 8... Plastic molding material, 9... Bonding wire ,1
0a... Ceramic wall member, 10b... Ceramic lower sealing member, 10c... Ceramic window sealing member, 1
1... Top cover member, 12... Ceramic window for mounting a bypass capacitor element.
Claims (1)
源内部リードおよび接地内部リードを前記半導体
素子とそれぞれ共用して対向配置される電源ノイ
ズ除去用コンデンサ素子と、前記半導体素子およ
び電源ノイズ除去用コンデンサ素子を一体化して
封止する封止部材とを含むことを特徴とする半導
体装置。 a semiconductor element, a power supply noise removing capacitor element disposed facing the semiconductor element and sharing a power supply internal lead and a grounding internal lead with the semiconductor element, and the semiconductor element and the power supply noise removing capacitor element. 1. A semiconductor device comprising: a sealing member that is integrally sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14146087U JPS6447059U (en) | 1987-09-14 | 1987-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14146087U JPS6447059U (en) | 1987-09-14 | 1987-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447059U true JPS6447059U (en) | 1989-03-23 |
Family
ID=31406539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14146087U Pending JPS6447059U (en) | 1987-09-14 | 1987-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447059U (en) |
-
1987
- 1987-09-14 JP JP14146087U patent/JPS6447059U/ja active Pending