JPH03183794A - stripe plating equipment - Google Patents

Abstract

PURPOSE:To prevent the leakage of a plating soln. from the deformed or stepped part of a strip to be plated by detecting the negative pressure in the space for sucking the injected soln. with a negative pressure sensor and controlling the injection of the soln. in accordance with the detection result. CONSTITUTION:The plating soln. 2 stored in a plating soln. tank 4 is forcedly circulated through an auxiliary tank 6 by a pump 5, and the pressurized soln. 2 is injected from a nozzle 3 to stripe-plate the surface 21 of the strip 20 formed on the masking tape 22. The injected soln. 2 is sucked by a suction pump 8, and recovered in the tank 4 through a recovery port 7. At this time, the negative pressure in the suction space is detected by a negative pressure sensor 12, an automatic control mechanism is actuated when the negative pressure does not reach a specified value, and the pump 5 is slowed or stopped to control the injection of the soln. 2. Consequently, the leakage of the soln. 2 from the connection or deformed part of the strip 20 is prevented, and the quality of a long-sized stripe-plated strip is improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to improving an apparatus for producing stripe plated strips using a plating solution injection method, especially when the strip to be plated has a deformed part or a step at a connecting part. The present invention relates to a stripe plating apparatus configured to prevent leakage of plating solution from the deformed portion or step portion in certain cases.

[Prior art] Electronic component materials such as lead frames for ICs are required to have high reliability, and their bonding surfaces and electrical contacts are plated with expensive precious metals such as gold, or IC# is mounted on them. It is usual to apply solder plating to facilitate wire bonding.

Stripe plating was developed to plate such precious metals, solder, etc. to the minimum necessary range, and to save materials and reduce costs.

In the conventional stripe plating described above, only the surface to be plated of the strip to be plated is left, all other surfaces are blocked from infiltration of the plating solution with a resist agent or masking tape, and then this is immersed in the plating solution. It was common to plate the surface by stirring and spraying an electrolyte onto the surface.

However, in this conventional method, since areas other than the surface to be plated are masked with masking tape, a large amount of masking tape is required compared to the size of the plating surface, which is unavoidably expensive. If a large amount of material is carried out, and if all surfaces other than the surface to be plated are masked are passed through the plating tank or guide rolls, breakage may occur due to cracks at the slit ends of the liquid removal plating strips. Plating solution penetrated through the torn area and caused displacement plating, which could lead to poor appearance.

Therefore, the inventors previously proposed a plating apparatus as shown in FIGS. 3 and 4.

That is, the plating strip 20 is slid in the longitudinal direction while keeping the wide surface vertical, and the plating surface 21 is left and is partially masked to the minimum in a separate masking process using masking tape 22, and then the plating solution is applied. The plating solution 2 stored in the tank 4 is forced to circulate as shown by the arrow in the figure using the pump 5, and is temporarily stored in the auxiliary tank 6, after which the pressurized plating solution is passed through the nozzle 3 onto the plated surface. Inject onto surface 21. On the outer periphery of the nozzle 3, an opening surface is formed which has an interval somewhat wider than the width of the surface to be plated 21 divided by the masking tape 22 of the strip to be plated, or whose inner diameter is sufficiently behind the masking tape 22. A mantle 1 is provided, and a collection lower is formed between the mantle 1 and the nozzle 3 or at the entrance to the liquid tank 4, and is evacuated by a suction pump 8 at the upper part of the plating liquid tank 4 to remove the plating liquid. By creating a negative pressure in the tank 4, the plating solution sprayed onto the surface to be plated 21 is sucked by the recovery lower,
The surplus plating solution 2 is sucked and collected into the plating solution tank 4. The auxiliary tank 6 is provided for stabilizing the pressure for spraying the plating solution and for installing the anode material 10,
The pressurized flocculating liquid 2 is temporarily stored in a pressurized state in the auxiliary 4116 and is injected through the nozzle 3.

In addition, in FIG. 3, the anode material 10 is installed by installing the auxiliary m6 outside the plating solution tank 4 and configuring the opening/closing 119 to have a 1 m opening/closing ability.
Fig. 4 shows an example in which a partition wall 11 is provided in the plating solution tank 4 to narrow the space where negative pressure is created in the plating solution tank 4, and the suction This example shows an example in which a sufficient negative pressure can be obtained even if the suction capacity of the pump 8 is reduced.

[Problem to be solved by the invention] The previously proposed apparatus described above can perform excellent stripe plating and has already been put into practical use and has been well received, but the material to be plated is supplied as a finite length coil. Therefore, when performing continuous work, it is necessary to connect the strips one after another. In this case, no matter how well the connecting portions are connected by abutting or overlapping, the formation of minute irregularities and bends is unavoidable.

Furthermore, in the case of thin strip materials, it is impossible to completely eliminate the occurrence of local deformations 20A as shown in FIG. Such a deformed portion 20A is generated.

If the above-mentioned plating solution injection section is passed through the above-mentioned plating solution injection section while the non-planar connection section or the above-mentioned locally deformed section 2OA exists, the plating solution will be injected in a steady state and a suction action will be performed. As a result, the abnormal part suddenly enters the surface to be plated, which upsets the balance between injection and suction of the plating solution.As a result, the negative pressure becomes insufficient, and the plating is removed from the gap formed by the connection or deformed part. There is a risk that the liquid may leak outside, contaminating the working environment or contaminating the surface of non-plated parts, resulting in problems such as defects or temporary stoppage of work.

An object of the present invention is to solve the problems of the prior art as described above, and to solve the problem that the strip material to be plated has a deformed part or a contact point. It is an object of the present invention to provide a novel stripe plating apparatus which is configured to be able to prevent leakage of plating solution from the deformed portions or stepped portions during plating work even when there is a step difference in the portion.

[Means for Solving the Problems] The present invention includes a nozzle for injecting a plating solution in a plating solution yard toward a plating surface, a jacket that partitions the periphery of the nozzle to form a plating opening surface, and an interior of a plating top. and a suction means for collecting the injected plating solution into the plating tank by applying a negative pressure to the plating tank, and plating the surface to be plated by sliding the strip to be plated on the opening surface of the mantle. A negative pressure sensor capable of detecting the negative pressure in the plating solution suction space is provided, and the negative pressure sensor and the plating solution supply side are configured to be automatically controlled in conjunction with each other, so that the negative pressure in the suction space is lower than a predetermined value. If the pressure fluctuates, the plating solution injection is controlled by reducing or stopping the operation of the supply pump, and when the negative pressure in the suction space returns to the predetermined negative pressure, the operation of the supply pump etc. is automatically controlled. The structure is such that the jetting of the plating liquid from the nozzle can be restored to normal operation by restarting the nozzle.

[Function] When a deformed part or a stepped part of the material to be plated arrives at the plating solution injection surface, the previous planar state suddenly changes, and the gap between the traveling surface of the material to be plated and the contact edge surface of the plating equipment changes. Unexpected gaps appear between the lines.

The generation of this gap results in suction of air through the gap, and the negative pressure in the suction space, which had been in a predetermined negative pressure state, fluctuates and becomes insufficient.

This fluctuating negative pressure can be quickly detected by a negative pressure sensor and automatically linked to the negative pressure sensor. For example, the operation of the supply pump can be automatically reduced or stopped according to the negative pressure fluctuation. By doing so, it is possible to sufficiently prevent the plating solution from flowing out from the gap due to the insufficient negative pressure described above. When such an abnormal part of the strip to be plated passes and the flat part of the material to be plated starts sliding again, the negative pressure caused by the suction pump returns to the predetermined low normal pressure, so the negative pressure sensor It is sufficient to detect this and return the plating injection to a steady state again.

As a result, defects caused by leakage of the plating solution and contamination of the working environment are automatically eliminated, and stable long stripe plated products can be obtained at all times.

[Example] The present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory cross-sectional view showing how stripe plating is performed using the plating apparatus according to the present invention, and FIG. 2 is an enlarged partial explanatory view of the vicinity of the plating surface of the mantle opening in FIG. 1.

In FIGS. 1 and 2, the same reference numerals as those explained in FIGS. 3 and 4 indicate the same configurations.

Reference numeral 20 denotes a plated strip running in the longitudinal direction while maintaining the wide surface vertically as in FIGS. 3 and 4, and 22 denotes the plated surface 2.
This is a masking tape that is partially masked to a minimum except for 1, and is partially masked in a separate masking process.

The plating solution 2 stored in the plating solution tank 4 is forced to circulate as shown by the arrow in the figure by the supply pump 5, and after temporarily being stored in the auxiliary tank 6, the pressurized plating solution is supplied from the nozzle 3. It is sprayed onto the plated material 21.

On the outer periphery of the nozzle 3, there is an opening surface IA whose inner diameter dimension is in sufficient contact with the masking tape 22, although the interval is somewhat wider than the width of the plated object 21 divided by the masking tape 22 of the plating strip as in the conventional example. An outer shell 1 is provided below which collects the sprayed plating solution through a suction channel 7a.
The plating solution tank 4 is evacuated by a suction pump 8 at the upper part of the plating solution tank 4, and when the inside of the plating solution tank 4 is made negative pressure, the plating solution injected onto the surface to be plated 21 is collected. The excess plating solution 2 is sucked by the lower and collected by suction into the plating solution tank 4.

According to the present invention, as shown in FIG. 1, a negative pressure sensor 12 is provided which can detect the negative pressure in the suction space.

The negative pressure sensor 12 is controlled by, for example, microcomputer control, mechanical control, or other automatic control l! For example, it is configured to be interlocked with the supply pump 5 by the top, and the negative pressure sensor 1
2 detects that the negative pressure in the suction space does not reach a predetermined value, the automatic control mechanism is activated to reduce or even stop the operation of the supply pump 5.

The suction space is always maintained at a predetermined negative pressure by the suction pump 8 as long as the smooth strip 20 to be plated slides on the front surface IA of the mantle. However, if the deformed part 20A shown in FIG. A gap is created through which outside air is sucked in, causing the negative pressure in the suction space to fluctuate.

A negative pressure sensor quickly detects this fluctuation in negative pressure and issues an operation command to the supply pump 5. If the negative pressure fluctuations are not too large, it is sufficient to slow down the rotation of the drive motor of the supply pump 5 and reduce the injection pressure of the plating solution. However, if there are large negative pressure fluctuations due to large deformation parts 20A, etc. - temporarily stop the plating solution injection. By making it possible to change the injection of plating solution according to the magnitude of negative pressure fluctuations in this way, the risk of the plating solution flowing out from the gap formed by the deformed portion 2OA, etc., and contaminating the surrounding area or causing defects can be eliminated. .

In addition to controlling the injection of the plating solution by reducing or stopping the rotation speed of the supply pump 5 as described above, it is also possible to mechanically adjust the opening and closing of the valve 13 installed in the middle. Whether to control injection by operation or not,
You can select it as appropriate.

After the deformed portion 20A, the connection step portion, etc. have passed, the negative pressure in the suction space is immediately restored to its original state by the operation of the suction pump 8. If the configuration is such that when the negative pressure sensor 12 detects the return of the negative pressure, the injection of the plating solution is automatically returned to a steady state, deformed parts or stepped parts can be avoided during strip plating of a long strip. Even if there is a problem, the plating solution will not leak out to the outside and cause defects, and continuous plating work can always proceed smoothly and stably.

[Effects of the Invention] As described above, according to the apparatus according to the present invention, there is no fear that the plating solution will leak out when the connecting portion of the strip to be plated, the deformed portion of the strip, etc. pass, and the plating solution This eliminates contamination of the working environment or the occurrence of defects, and after passing through the above-mentioned abnormal areas, continuous plating work can proceed smoothly again.
As a result, the quality of long striped plating strips can be improved, and excellent industrial effects can be exhibited.

[Brief explanation of drawings]

FIG. 1 is an explanatory sectional view showing a specific example of the configuration of the device according to the present invention, FIG. 2 is an explanatory view showing the situation near the frontage of the mantle,
FIGS. 3 and 4 are explanatory sectional views showing two types of configuration examples of the previously proposed plating apparatus. l: mantle, IA: mantle front surface, 2: plating solution, 3: nozzle, 4: plating solution tank, a 0 2 3 0 1 2: supply pump, : auxiliary tank, 2nd recovery port, : suction channel, : Suction pump, : Anode material, : Negative pressure sensor, : Valve, : Plated strip, : Plated surface, : Masking tape.

Claims (1)

[Claims] (1) A nozzle that sprays the plating solution in the plating solution tank toward the plating surface, a jacket that partitions the periphery of the nozzle and forms a plating opening surface, and a negative pressure inside the plating tank that sprays the plating solution. and a suction means for recovering the plating solution into a plating tank, and in an apparatus for plating a surface to be plated by sliding a strip to be plated on an opening surface of the mantle, the negative pressure in the suction space for the plating solution A negative pressure sensor capable of detecting is provided, and the negative pressure sensor and the plating solution supply side are configured to be automatically controlled in conjunction with each other, and the supply pump is activated when the negative pressure in the suction space fluctuates from a predetermined value. On the other hand, when the negative pressure in the suction space returns to a predetermined negative pressure, the operation of the supply pump, etc. is automatically restarted to control the injection of plating solution from the nozzle. A stripe plating device configured to enable the spraying of plating solution to return to normal operation.