JPH03210965A - Light beam type soldering device - Google Patents

Abstract

PURPOSE:To safely progress soldering operations by providing irradiation region regulating block bodies which is protruded on the optical path of the light beam from the support and confine the irradiation range of the light beams emitted from light sources to the terminal part areas of the electronic parts to be soldered. CONSTITUTION:The irradiation region regulating block bodies 10 remove the ray fluxes except the part passing through the inside of light transmission windows 10a opened in the block bodies in the light beam emitted from the light source units 3 and shield the ray fluxes deviated from the lighting windows by the block bodies on the way of the optical path, thereby preventing these deviated ray fluxes from arriving at a printed wiring board 1 side. The mounting positions of the block bodies to the support, such as mount nozzle 5, the mounting angles and the size of the light shielding windows are previously adequately determined. All the light beams past the light transmission windows of the block bodies at the time of soldering are projected only to the terminal parts of the electronic parts to be soldered. The undue irradiation for the adjacent packaged electronic parts with the light beams is prevented in this way and the soldering operations are safely carried out.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to light beam soldering in which reflow soldering is performed by irradiating a light beam onto external connection terminals of flat packaged electronic components mounted on a printed wiring board. Regarding equipment.

[Prior Art] The above-mentioned light beam soldering device combines a plurality of light source units each having a light source lamp placed at the primary focus position of a concave reflector, and directs the emitted light beam from the light source units to a printed wiring board. Flat package type I mounted on top
Japanese Patent Application Laid-Open No. 61-14036 discloses a method for reflow soldering by irradiating external connection terminals of electronic components such as C.
It is known from Publication No. 8.

Next, the conventional configuration of the above-mentioned light beam soldering apparatus is shown in FIG. This is an external connection terminal drawn out laterally from the package of component 2. On the other hand, the soldering device includes a plurality of light source units 3 (only two left and right light source units are shown in the figure) arranged above and around an electronic component 2, and a guide that supports the light source units 3. The main components include an arm 4 and a mount nozzle 5 that adsorbs the electronic component 2 package from above using vacuum pressure and mounts and holds it in a predetermined position on the printed wiring board 1.The light source unit 3 is mounted inside the lamp house. It consists of an elliptical concave reflecting mirror 6 provided in the mirror 6, and a light source lamp 7 placed at the primary focal point of the reflecting mirror 6. Note that 8 is a vacuum pump connected to the mount nozzle 5 described above.

In this configuration, in order to solder the electronic component 2 to the printed wiring board 1, solder paste is applied to the soldering block of the printed wiring board 1 in advance, and on the other hand, the light source unit is soldered according to the external size of the electronic component 2. The mounting position and irradiation angle of the light source unit 3 are set so that the light beam 9 emitted from the mount nozzle 5 is focused on the position of the external connection terminal 2a. It is mounted and held at a predetermined position on the printed wiring board 1, and the light source lamp 7 is turned on in this state.

As a result, the light beam 9 emitted from the light source unit 3 irradiates the external connection terminal 2a of the electronic component 2, heats the core portion, and performs reflow soldering.

[Problem to be solved by the invention]

By the way, if the light beam type soldering apparatus having the above-mentioned structure is used as it is, the following problems will occur during soldering. That is, as shown in FIG. 5, if another electronic component 20 has already been mounted in the vicinity of the electronic component 2 to be soldered, the beam bundle of the light beam 9 emitted from the light source unit 3 will be A mounted electronic component 20 whose portion is adjacent to the electronic component 2 may also be partially irradiated. In particular, when electronic components are mounted at a high density and the adjacent mounted electronic components 20 are tall, such interference between light beams is likely to occur.
When the elements of the mounted electronic component 20 are irradiated with the light beam 9, their temperature increases, resulting in deterioration of the characteristics of the product.

The present invention has been made in consideration of the above points, and by additionally equipping simple components, it is possible to prevent adverse thermal effects caused by the light beam on mounted electronic components located close to the electronic components to be soldered. without affecting
An object of the present invention is to provide a light beam soldering device that enables safe soldering.

[Means to solve the problem]

The above l! In order to solve this problem, in the light beam soldering apparatus of the present invention, a support shaft for mounting and holding an electronic component in a predetermined position on a printed wiring board is provided with a support shaft extending from the support shaft onto the optical path of the light beam. An irradiation area regulating block is provided to limit the irradiation range of the light beam emitted from the light source to the terminal area of the electronic component to be soldered.

[Effect]

In the above configuration, the irradiation area regulating block has the same function as a field stop in an optical system, and the light beam emitted from the light source unit is a bundle of rays passing through the transparent window opened in the block. Otherwise, the light beams that have left the light-transmitting window are blocked by a block in the middle of the optical path, and do not reach the printed wiring board side. Therefore, by properly determining the mounting position and angle of the block relative to the spindle of the mount nozzle, as well as the size of the light-transmitting window, the light beam passing through the light-transmitting window of the block during soldering can be All of the light beams are irradiated only onto the terminals of the electronic components to be soldered, and the mounted electronic components adjacent to the electronic components can be safely protected by being prevented from being unduly irradiated with the light beam.

【Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a configuration diagram of an embodiment of the present invention, FIG. 2 is a plan view of the irradiation area regulating block body in FIG. 1, and FIG. The same members corresponding to those in FIG. 5 are given the same reference numerals.

That is, according to the present invention, the mount nozzle 5 (electronic component 2
An irradiation area regulating block 10 is newly additionally installed on the axis of the spindle for mounting and holding the irradiation area at a predetermined position on the printed wiring board 2. This block body 10 includes a light beam 9 emitted from the light source unit 3 toward the printed wiring board 1.
The block body 10 is attached to extend laterally from the mount nozzle 5 so as to cross the optical path of the light beam 9, and the block body 10 has a light-transmitting element that restricts the passage range of the light beam 9, similar to the function of a field stop in the optical system. Window 10a is open. The illustrated example is a flat package type component in which the external connection terminals 2a are drawn out from the left and right sides of the package as the electronic component 2. The transparent window 10a is open. In addition, the installation position of the block body 10, the translucent window 10
The size of a is determined in accordance with the size of the electronic component 2.

Electronic components to be soldered from now on in the configuration 2
When the light source lamp 7 of the light source unit 3 is turned on in this state, the light beam 9 emitted from the light source unit 3 passes through the block body 10. Only the light beams that have passed through the optical window 10a are irradiated toward the terminals 2a of the electronic component 2, and the other light beams that have left the transmission window 10a are blocked by the peripheral frame portion of the block body 10.

Therefore, even if mounted electronic components 20 are located close to the electronic component 2 as shown in FIG. 1, the light beam 9 will not irradiate these mounted electronic components 20. , reflow soldering of the electronic component 2 can be safely performed without thermally affecting the surrounding mounted electronic components 20. The block body 10 also prevents the light beam 9 from being irradiated onto the package of the electronic component 2 itself.

FIG. 3 shows an applied embodiment of the present invention regarding an irradiation area regulating block body, in which the block body 10 is attached to the mount nozzle 5 via a hinge bin 5a, and the mounting posture is as shown in the solid line with this bin 5a as the center. and the position indicated by the chain line. According to this embodiment, by changing the mounting orientation of the block body 10, the irradiation range of the light beam can be adjusted over a wide range.

(Effects of the Invention) As described above, according to the present invention, with respect to the support shaft that holds the electronic component in a predetermined position on the printed wiring board, the light beam extends from the support shaft onto the optical path of the light beam and is emitted from the light source. By installing an irradiation area restriction block that limits the irradiation range of the light beam to the terminal area of the electronic component to be soldered,
Even if other electronic components are already mounted in the vicinity of the electronic components to be soldered on the printed wiring board, the soldering work can be carried out safely without adverse thermal effects on these mounted electronic components. You can proceed to

[Brief Description of the Drawings] Fig. 1 is a configuration diagram of an embodiment of the present invention, Fig. 2 is a plan view of the irradiation area regulating block body in Fig. 1, and Fig. 3 is a diagram of an embodiment different from Fig. 2. 4 is an overall schematic diagram of a conventional light beam soldering device, and FIG. 5 is an explanatory diagram of the soldering operation of FIG. 4. In FIG. 0, l; printed wiring board; 2: Electronic components, 2a: External connection terminal, 3: Light source unit, 5: Mount nozzle (spindle), 9: Light beam, 10: Irradiation area regulation professional Fig. 1 10σ Cap 2 Fig. 3

Claims (1)

[Claims] 1) In a light beam soldering machine that performs reflow soldering by irradiating a light beam onto the external connection terminals of flat packaged electronic components mounted on a printed wiring board, electronic components are held in a predetermined position on the printed wiring board. An irradiation area regulating block is provided on the support shaft, extending from the support shaft onto the optical path of the light beam, and limiting the irradiation range of the light beam emitted from the light source to the terminal area of the electronic component to be soldered. Features a light beam soldering device.