JPH0481268A - Light beam soldering device - Google Patents

Abstract

PURPOSE:To lessen the thermal influence on circumferential parts by providing a hot wind ejection duct for preheating opposite to the normal heating position of a work to be soldered of the light beam soldering device which solders the work to be soldered by irradiating the work with the light beams. CONSTITUTION:This light beam soldering device irradiates the work 32 to be soldered with the light beams 28 and solders the work by the normal heating with these light beams 28. The hot wind ejection duct 33 for preheating is provided opposite to the normal heating position of the work 32. The work 32 is locally preheated by the hot wind ejected from the hot wind ejection duct 33 toward the work 32 and the normal heating and soldering of the work 32 are executed by the light beams 28 when the work 32 is heated up to the prescribed temp. The local preheating of the parts to be soldered is executed in this way and the thermal influence of the normal heating with the light beams on the circumferential parts is lessened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a light beam soldering device that performs soldering using the heat of a light beam.

(Prior Art) As shown in FIG. 2, a conventional light beam soldering device uses a light source (halogen lamp or xenon lamp) 1
1 and a lamp house (
an optical system 16 consisting of a first plane mirror 13, a second plane mirror 14, and a condensing lens (cylindrical lens) 15 disposed on the opening side of the lamp house 12; A mask (automatic mask) 18 is arranged between the substrate 17 and the substrate 17. An electronic component 19 as a workpiece to be soldered is mounted on the substrate 17.

Then, the light beam emitted from the light source 11 to the surroundings is
Directed downward by reflection on the inner surface of the lamp house 12, split into a plurality of light beams by a plurality of optical systems 16,
The light is focused, the irradiation range is limited by a mask 18, and it is irradiated onto a plurality of parts to be soldered on an electronic component 19, and the heat of the plurality of light beams performs local soldering at a plurality of locations on a single component at once. be exposed.

(Problems to be Solved by the Invention) Conventionally, such soldering with a light beam was performed directly on the workpiece to be soldered that had not been preheated, so the irradiation time of the high-temperature light beam on the workpiece was long; Thermal effect on surrounding areas is large. For example, there are undesirable problems such as heat shock for integrated circuits and the like.

The present invention has been made in view of these points, and provides a light beam solder that can reduce the thermal influence on the surrounding area of the soldered part which is mainly heated by the light beam by performing local preheating. The purpose of this invention is to provide a mounting device.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a light beam soldering apparatus that irradiates a workpiece 32 to be soldered with a light beam 28 and performs soldering (=I only) by main heating by the light beam 28. A hot air blowing duct 33 for preheating is provided opposite the main heating position of the wave soldering work 32.

(Function) The present invention locally preheats the workpiece 32 with hot air jetted toward the workpiece 32 from the hot air jetting duct 33, and when the workpiece 32 is pushed to a predetermined temperature, the light beam 28 is used to heat the workpiece 32. Heat it up and solder it.

(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIG.

As shown in FIG. 1, a light source unit is composed of a light source 21, a lamp house 22 arranged around the light source 21, and a plurality of optical systems 23 arranged on the opening side of the lamp house 22. has been done.

As the light source 21, a halogen lamp, a xenon lamp, a metal halide lamp, or the like is used.

As the lamp house 22, an elliptical reflecting mirror is used.

The optical system 23 includes a plane mirror 24, a segment mirror 25, and a condenser lens 26.

The segment mirror 25 is a block arrangement of a large number of square reflecting mirrors, and converts the shape of the light beam into a uniform square. It is possible to average the energy distribution on the light collection surface.

Furthermore, the irradiation range of the light beam branched and focused by the optical system 23 is controlled by a mask (
(automatic mask) 27. A shutter is provided in the through hole of this mask 27, and the opening is controlled at a necessary time and for a necessary time, and the light beam is transmitted through the hole.

Then, the light beam emitted from the light source 21 to the surroundings is
The light is directed downward by reflection on the inner surface of the lamp house 22, and is turned into a plurality of light beams 28 by a plurality of optical systems 23, and is irradiated to the shutter of the mask 27.

Below this mask 27, there is a substrate 31 and this substrate 31.
Electronic components 32 as workpieces to be soldered mounted on
is transported by a conveyor (not shown).

A tip jetting hole of a hot air jetting duct 33 for preheating attached to the mask 27 is opposed to the main heating position of the electronic component 32 by light beam irradiation. This hot air blowout duct 33 is connected to a hot air supply source (not shown). The hot air supplied from this hot air supply source uses high temperature inert gas such as nitrogen gas.

Then, when the board 31 and the electronic component 32 are carried into the light beam irradiation position, the plurality of soldered parts of the electronic component 32 are connected to the corresponding hot air jet duct 33 before being irradiated with the light beam. Hot air is blown from the tip of the tip to preheat the part to be soldered to about 80 to 150°C.

Then, the shutter of the mask 27 is opened, and the plurality of light beams 28 that have passed through the through holes of the mask 27 are simultaneously irradiated onto the corresponding parts to be soldered. Local reflow soldering at multiple locations on one component is performed at once.

Note that, as in this embodiment, the hot air blowing duct 33 attached to the mask 27 efficiently preheats the plurality of solderable parts of the electronic component 32 locally in a limited space on the top surface of the board. Although this is an effective means, the present invention is not limited to this, and the hot air blowing duct 33 may be provided independently of the mask 27.

〔Effect of the invention〕

According to the present invention, since the hot air jet duct for preheating is provided opposite to the main heating position of the workpiece to be soldered, the part to be soldered to be main heated by the light beam can be locally preheated. It can be heated, and the thermal influence (heat shock, etc.) on the surrounding area due to the main heating of the light beam can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the light beam soldering device of the present invention, and FIG. 2 is a schematic diagram showing a conventional light beam soldering device. 28. Light beam, 32.・Solder workpiece,
33.Hot air blowout duct.

Claims (1)

[Claims] (1) In a light beam soldering device that irradiates a workpiece to be soldered with a light beam and performs soldering by main heating with this light beam, a preheating device is installed opposite to the main heating position of the workpiece to be soldered. A light beam soldering device characterized by being provided with a hot air blowing duct.