JPH03215921A - Chip type solid electrolytic capacitor - Google Patents
Chip type solid electrolytic capacitorInfo
- Publication number
- JPH03215921A JPH03215921A JP2011364A JP1136490A JPH03215921A JP H03215921 A JPH03215921 A JP H03215921A JP 2011364 A JP2011364 A JP 2011364A JP 1136490 A JP1136490 A JP 1136490A JP H03215921 A JPH03215921 A JP H03215921A
- Authority
- JP
- Japan
- Prior art keywords
- solid electrolytic
- electrolytic capacitor
- type solid
- chip
- electrode terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器等のプリント配線基板へ実装されるチ
ップ型固体電解コンデンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip-type solid electrolytic capacitor mounted on a printed wiring board of electronic equipment or the like.
従来の技術
従来のこの種のチップ型固体電解コンデンサは、第2図
および第3図に示すように、コンデンサ素子(図示せず
)を内蔵する角形状の固体電解コンデンサ本体1と、前
記コンデンサ素子より導出され、かつ前記固体電解コン
デンサ本体1の側面から底面に沿って折曲された電極端
子2とを備えた構成となっており、このチップ型固体電
解コンデンサを電子機器等のプリント配線基板へ実装す
る場合は、第4図に示すように、角形状の固体電解コン
デンサ本体1の底面に位置する電極端子2をプリント配
線基板3に接触させ、かつ半田付け4を施すことにより
、プリント配線基板3への平面実装を行っていた。BACKGROUND OF THE INVENTION A conventional chip-type solid electrolytic capacitor of this type, as shown in FIGS. 2 and 3, includes a rectangular solid electrolytic capacitor body 1 containing a capacitor element (not shown), and a rectangular solid electrolytic capacitor body 1 containing a capacitor element (not shown). The chip-type solid electrolytic capacitor is attached to a printed wiring board of an electronic device, etc. When mounting, as shown in FIG. 4, the electrode terminals 2 located on the bottom of the rectangular solid electrolytic capacitor body 1 are brought into contact with the printed wiring board 3 and soldered 4 to the printed wiring board. 3 was used for flat surface mounting.
発明が解決しようとする課題
しかしながら、上記従来の構成では、コンデンサ素子よ
り導出された電極端子2の形状が、固体電解コンデンサ
本体1の側面から底面に沿って折曲されているのみであ
るため、電子機器等のプリント配線基板3へのパターン
設計の自由度が制約され、その結果、目標とする設計が
できなかったり、無理が生じた設計になる場合があると
いう問題点を有していた。Problems to be Solved by the Invention However, in the conventional configuration described above, the shape of the electrode terminal 2 led out from the capacitor element is only bent along the side surface and the bottom surface of the solid electrolytic capacitor body 1. The degree of freedom in designing a pattern on the printed wiring board 3 of an electronic device or the like is restricted, and as a result, a problem arises in that a targeted design may not be possible or the design may be unreasonable.
また多品種の生産による品揃えは、生産コストの上昇に
つながるもので、したがって新商品の開発にはある程度
時間がかかってしまうという不利な面を有するものであ
った。In addition, the production of a wide variety of products leads to an increase in production costs, which has the disadvantage that it takes a certain amount of time to develop new products.
本発明はこのような問題点を解決するもので、電子機器
等のプリント配線基板への実装が複数の面で行えるチッ
プ型固体電解コンデンサを提供することを目的とするも
のである。The present invention solves these problems and aims to provide a chip-type solid electrolytic capacitor that can be mounted on a printed wiring board of an electronic device or the like on multiple surfaces.
課題を解決するだめの手段
上記課題を解決するために本発明のチップ型固体電解コ
ンデンサは、コンデンサ素子を内蔵する角形状の固体電
解コンデンサ本体と、前記コンデンサ素子より導出され
、かつ前記固体電解コンデンザ本体の側面から底面に沿
って折曲された電極端子とを備え、この電極端子に、前
記固体電解コンデンサ本体の側面から相隣る側面に沿っ
て折曲された別個の電極端子を付加したものである。Means for Solving the Problems In order to solve the above problems, a chip-type solid electrolytic capacitor of the present invention includes a rectangular solid electrolytic capacitor body containing a capacitor element, a solid electrolytic capacitor body derived from the capacitor element, and a solid electrolytic capacitor body derived from the capacitor element. An electrode terminal that is bent along the side surface of the solid electrolytic capacitor body along the bottom surface, and a separate electrode terminal that is bent along the adjacent side surface from the side surface of the solid electrolytic capacitor body is added to this electrode terminal. It is.
作用
上記構成によれば、現行のコンデンサ素子より導出され
、かつ角形状固体電解コンデンサ本体の側面から底面に
沿って折曲された電極端子に、前記固体電解コンデンザ
本体の側面から相隣る側面に沿って折曲された別個の電
極端子をイ」加しているため、このチップ型固体電解コ
ンデンサを電子機器等のプリンl・配線基板へ実装する
場合は、固体電解コンデンサ本体の側面から底面に沿っ
て折曲された電極端子をプリン1・配線基板に接触させ
て半田付けを行うことにより、現行の平面実装が行える
ばかりでなく、固体電解コンデンザ本体の側面から相隣
る側面に沿って折曲された別個の電極端子を使用し、こ
の別個の電極端子をプリンl・配線基板に接触させて半
田付けを行うことにより、このチップ型固体電解コンデ
ンサの立て実装を行うことができる。このように本発明
のチップ型固体電解コンデンサは複数の面で実装するこ
とができるため、1つのチップ型固体電解コンデンサの
みで、目標とする電子機器等のプリント配線基板へのパ
ターン設計も容易に行うことができ、またその生産も電
極端子の形状を多少変更するだけで実施が可能であるた
め、新商品の開発時間を大幅に短縮することができると
ともに、生産コストの低価格化がはかれ、しかもこのチ
ップ型固体電解コンデンサは、現行の平面実装のみでな
く、立て実装も行えるため、プリント配線基板における
パターンの低面積化がはかれて、従来よりも設計自由度
を大幅に向上させることができるものである。Effects According to the above configuration, the electrode terminal is derived from the current capacitor element and is bent from the side surface of the square solid electrolytic capacitor body along the bottom surface, and the electrode terminal is bent from the side surface of the solid electrolytic capacitor body to the adjacent side surface. Since separate electrode terminals are added that are bent along the sides, when mounting this chip type solid electrolytic capacitor on a printed circuit board or wiring board of electronic equipment, etc., it is necessary to By contacting the electrode terminals bent along the line 1 and the wiring board and soldering them, not only can the current flat surface mounting be performed, but also the electrode terminals can be bent along the sides of the solid electrolytic capacitor body. This chip-type solid electrolytic capacitor can be mounted vertically by using bent separate electrode terminals and by bringing the separate electrode terminals into contact with the printer/wiring board and performing soldering. In this way, the chip-type solid electrolytic capacitor of the present invention can be mounted on multiple surfaces, so it is easy to design a pattern on a printed wiring board of a target electronic device, etc. using only one chip-type solid electrolytic capacitor. Moreover, since it can be produced by simply changing the shape of the electrode terminal, it is possible to significantly shorten the development time for new products and reduce production costs. Furthermore, this chip-type solid electrolytic capacitor can be mounted not only on the current plane but also vertically, allowing for a smaller pattern area on the printed wiring board and greatly improving the degree of design freedom than before. It is something that can be done.
実施例
以下、本発明の一実施例を第1図にもとづいて説明する
。この第1図において、11は角形状の固体電解コンデ
ンサ本体で、この固体電解コンデンサ本体11は内部に
コンデンサ素子(図示せず)を内蔵している。そしてこ
のコンデンサ素子からは電極端子12が導出され、かつ
この電極端子12の先端部は前記固体電解コンデンサ本
体11の側面から底面に沿って折曲されている。13は
前記電極端子12に付加した別個の電極端子で、この別
個の電極端子13は前記固体電解コンデンサ本体11の
側面から相隣る側面に沿って折曲さている。EXAMPLE Hereinafter, an example of the present invention will be described based on FIG. In FIG. 1, reference numeral 11 denotes a rectangular solid electrolytic capacitor body, and this solid electrolytic capacitor body 11 has a capacitor element (not shown) built therein. An electrode terminal 12 is led out from this capacitor element, and the tip of this electrode terminal 12 is bent along the side surface and the bottom surface of the solid electrolytic capacitor body 11. Reference numeral 13 denotes a separate electrode terminal added to the electrode terminal 12, and this separate electrode terminal 13 is bent along a side surface adjacent to the side surface of the solid electrolytic capacitor body 11.
上記構成におけるチップ型固体電解コンデンサを電子機
器等のプリント配線基板へ実装する場合は、固体電解コ
ンデンサ本体11の側面から底面に沿って折曲された電
極端子12をプリント配線基板に接触させて半田付けを
行うことにより、現行の平面実装を行うことができる。When mounting the chip-type solid electrolytic capacitor with the above configuration on a printed wiring board of electronic equipment, etc., the electrode terminal 12 bent from the side surface to the bottom of the solid electrolytic capacitor body 11 is brought into contact with the printed wiring board and soldered. By attaching it, the current planar mounting can be performed.
また固体電解コンデンサ本体11の側面から相隣る側面
に沿って折曲された別個の電極端子13を使用し、この
別個の電極端子をプリント配線基板に接触させて半田付
けを行うことにより、このチップ型固体電解コンデンサ
の立て実装を行うことができる。In addition, by using separate electrode terminals 13 bent from one side of the solid electrolytic capacitor main body 11 along the adjacent side surfaces, and by bringing the separate electrode terminals into contact with the printed wiring board and soldering, this can be done. Chip-type solid electrolytic capacitors can be mounted vertically.
一例として、長さX幅×高さ寸法が7.3 X 4.3
X2.8(nun)のチップ型固体電解コンデンサを平
面実装した場合においては、底面積は約31mm”であ
ったが、本発明の一実施例のように立て実装を行った場
合の底面積は約20M2の実装面積となり、40%前後
の実装面積の低減が可能となった。As an example, the length x width x height dimensions are 7.3 x 4.3
When a x2.8 (nun) chip type solid electrolytic capacitor is mounted on a flat surface, the bottom area is approximately 31 mm, but when mounted vertically as in an embodiment of the present invention, the bottom area is The mounting area is approximately 20M2, making it possible to reduce the mounting area by approximately 40%.
発明の効果
以上のように、本発明のチップ型固体電解コンデンサは
、コンデンサ素子より導出され、かつ角形状の固体電解
コンデンサ本体の側面から底面に沿って折曲された電極
端子に、前記固体電解コンデンサ本体の側面から相隣る
側面に沿って折曲された別個の電極端子をイ」加してい
るため、このチップ型固体電解コンデンサを電子機器等
のプリント配線基板へ実装する場合は、一つの電極端子
と、別個の電極端子を使い分けることにより、チップ型
固体電解コンデンザの平面実装と立て実装を容易に行う
ことができる。Effects of the Invention As described above, the chip-type solid electrolytic capacitor of the present invention has the solid electrolytic Since separate electrode terminals are added that are bent from one side of the capacitor body to the next to the next, when mounting this chip-type solid electrolytic capacitor on a printed wiring board for electronic equipment, etc. By selectively using two electrode terminals and separate electrode terminals, the chip-type solid electrolytic capacitor can be easily mounted on a plane or vertically.
すなわち、本発明のチップ型固体電解コンデンサは、複
数の面で実装することができるため、1つのチップ型固
体電解コンデンサのみで、目標とする電子機器等のプリ
ント配線基板へのバクーン設計も容易に行うことができ
、またその生産も電極端子の形状を多少変更するだけで
実施が可能であるため、新商品の開発時間を大幅に短縮
することができるとともに、生産コストの低価格化がは
かれ、しかもこのチップ型固体電解コンデンサは、現行
の平面実装のみでなく、立て実装も行えるため、プリン
ト配線基板におけるパターンの低面積化がはかれて、従
来よりも設計自由度を大幅に向上させることができるも
のである。In other words, since the chip-type solid electrolytic capacitor of the present invention can be mounted on multiple surfaces, it is easy to design a package onto a printed wiring board of a target electronic device, etc. using only one chip-type solid electrolytic capacitor. Moreover, since it can be produced by simply changing the shape of the electrode terminal, it is possible to significantly shorten the development time for new products and reduce production costs. Furthermore, this chip-type solid electrolytic capacitor can be mounted not only on the current plane but also vertically, allowing for a smaller pattern area on the printed wiring board and greatly improving the degree of design freedom than before. It is something that can be done.
第1図は本発明の一実施例を示すチップ型固体電解コン
デンサの斜視図、第2図は従来例を示すチップ状固体電
解コンデンサの斜視図、第3図は同コンデンサの正面断
面図、第4図は同コンデンサのプリント配線基板への実
装状態を示す斜視図である。
11・・・・・・固体電解コンデンザ本体、12・・・
・・・電極端子、13・・・・・・別個の電極端子。FIG. 1 is a perspective view of a chip-type solid electrolytic capacitor showing an embodiment of the present invention, FIG. 2 is a perspective view of a chip-type solid electrolytic capacitor showing a conventional example, and FIG. 3 is a front sectional view of the same capacitor. FIG. 4 is a perspective view showing how the capacitor is mounted on a printed wiring board. 11... Solid electrolytic capacitor body, 12...
... Electrode terminal, 13 ... Separate electrode terminal.
Claims (1)
サ本体と、前記コンデンサ素子より導出され、かつ前記
固体電解コンデンサ本体の側面から底面に沿って折曲さ
れた電極端子とを備え、この電極端子に、前記固体電解
コンデンサ本体の側面から相隣る側面に沿って折曲され
た別個の電極端子を付加したことを特徴とするチップ型
固体電解コンデンサ。A square solid electrolytic capacitor body having a built-in capacitor element, and an electrode terminal led out from the capacitor element and bent along the bottom surface from the side surface of the solid electrolytic capacitor body, and the electrode terminal is provided with the A chip-type solid electrolytic capacitor characterized by the addition of separate electrode terminals that are bent along adjacent sides of the solid electrolytic capacitor body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011364A JPH03215921A (en) | 1990-01-19 | 1990-01-19 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011364A JPH03215921A (en) | 1990-01-19 | 1990-01-19 | Chip type solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03215921A true JPH03215921A (en) | 1991-09-20 |
Family
ID=11775975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011364A Pending JPH03215921A (en) | 1990-01-19 | 1990-01-19 | Chip type solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03215921A (en) |
-
1990
- 1990-01-19 JP JP2011364A patent/JPH03215921A/en active Pending
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