JPH0325016B2 - - Google Patents

Info

Publication number
JPH0325016B2
JPH0325016B2 JP59156633A JP15663384A JPH0325016B2 JP H0325016 B2 JPH0325016 B2 JP H0325016B2 JP 59156633 A JP59156633 A JP 59156633A JP 15663384 A JP15663384 A JP 15663384A JP H0325016 B2 JPH0325016 B2 JP H0325016B2
Authority
JP
Japan
Prior art keywords
chip
pasting
sheet
shielding sheet
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59156633A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156419A (ja
Inventor
Naoki Sugao
Noboru Onozato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59156633A priority Critical patent/JPS6156419A/ja
Publication of JPS6156419A publication Critical patent/JPS6156419A/ja
Publication of JPH0325016B2 publication Critical patent/JPH0325016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59156633A 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置 Granted JPS6156419A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59156633A JPS6156419A (ja) 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59156633A JPS6156419A (ja) 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置

Publications (2)

Publication Number Publication Date
JPS6156419A JPS6156419A (ja) 1986-03-22
JPH0325016B2 true JPH0325016B2 (2) 1991-04-04

Family

ID=15631941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59156633A Granted JPS6156419A (ja) 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置

Country Status (1)

Country Link
JP (1) JPS6156419A (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
EP0290501B1 (en) * 1986-09-26 1993-03-10 General Electric Company Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US6281044B1 (en) 1995-07-31 2001-08-28 Micron Technology, Inc. Method and system for fabricating semiconductor components
TW315491B (en) * 1995-07-31 1997-09-11 Micron Technology Inc Apparatus for applying adhesive tape for semiconductor packages

Also Published As

Publication number Publication date
JPS6156419A (ja) 1986-03-22

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