JPH03250636A - Wire bonding method - Google Patents

Abstract

PURPOSE:To minimize incorrect operations, reduce operating time of wire bonding, and smooth the operation by attaching the identification mark to a bonding pad side of chip, and an outside lead out terminal of a package. CONSTITUTION:A mark 3 showing No. is made on a bonding pad 2 of a semiconductor chip 1. Another mark 5 showing No. is also made on the tip of an inner lead of a lead frame 4. A wire bonding device is designed to mate these No.s, read these No.s automatically, and store bonding coordinates, and performs wire bonding with bonding wire 6. As the 'No.'5 is made on the bonding pad 2 of the semiconductor chip 1 and the tip of the inner lead of the lead frame 4, it is possible to prevent incorrect input and reduce input time of bonding coordinates by automatic reading.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a technique for wire bonding using a wire bonding device between a connection electrode on a semiconductor chip and an external lead terminal of a package using a bonding wire.

[Conventional technology]

After a semiconductor chip is housed in a package, in order to make the chip function, it is necessary to extend its internal wiring to the outside of the package. Wire bonding using methods such as thermocompression bonding and ultrasonic bonding is one of the connection methods. For wire bonding, a microcomputer is used to find the correspondence between the connection electrode (pumping point) on the chip and the external lead-out terminal (consisted of a lead frame, etc.) on the chip, that is, the bonding position, and automatically perform wire bonding. A wire bonding device is used to bond the wire.

During wire bonding in the assembly process of general semiconductor devices, -tan t, i! It is possible to perform wire bonding one after another using the different bonding positions (bonding coordinates), but when trying to wire bond a new product or an experimental product, because there is no data, conventional Therefore, the bonding coordinates were manually entered into a computer, memorized, and wire bonded.

Examples of literature that describes wire bonding technology and wire bonding equipment include:
Examples include Electronic Materials J 1983 special issue P140-145.

[Problem to be solved by the invention]

However, in the above-mentioned conventional technology, as the number of bins and products become more diverse, manually inputting the bonding coordinates is prone to erroneous inputs and takes a lot of time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a technique that can prevent erroneous inputs and shorten the time required to input bonding coordinates even when increasing the number of bins and products.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

In the present invention, the same mark, for example, a floor, is attached to both the bonding band side of the chip and the external extraction terminal (lead) side of the pancage.

[Effect]

This clarifies the correspondence between bands and leads, and by using a wire bonding device that automatically reads these widths and memorizes the coordinates, incorrect input can be prevented and the time required to input bonding coordinates can be shortened. Therefore, the correspondence between the leads and the bands can be established using the device or visually without a layout. This is especially effective when releasing new products, increasing the number of bottles, and increasing the variety of products.

〔Example〕

Next, embodiments of the present invention will be described based on the drawings.

As shown in FIG. 1, an arbitrary mark 3 is placed on the bonding band 2 of the semiconductor chip 1. Lead frame 4
A mark 5 consisting of an m is also placed at the tip of the inner lead. The wire bonding apparatus automatically reads these items in correspondence, stores the bonding coordinates, and performs wire bonding using the bonding wire 6.

FIG. 2 shows an example of a resin-sealed semiconductor device in which the assembled product after wire bonding is placed in a mold and resin is molded.

In FIG. 2, 7 is a resin sealing portion.

The semiconductor chip 1 is made of, for example, a silicon single-crystal substrate, and a large number of circuit elements are formed within this chip using well-known techniques to provide one circuit function. A concrete example of a circuit element is, for example, a transistor (MOS), and these circuit elements form, for example, a logic circuit and a memory circuit function.

The lead frame 4 is made of Kovar alloy, for example.

The bonding wire 6 is made of, for example, an Au wire. According to the embodiment of the present invention, the bonding pad 2 of the semiconductor chip 1 and the tip of the inner lead of the lead frame 4 are
``m''5 is included to prevent erroneous inputs and reduce the time required to enter bonding coordinates through automatic reading.Also, even without a layout (PB-LAYOUT), the wire bonding equipment or visual inspection can , the bonding band 2 and the lead frame 4 can be matched, and the mark 5 is attached, so that the wire bonding device has fewer malfunctions, input time is shortened, and wire bonding work time is shortened. , smoothness is achieved, which is particularly advantageous when increasing the number of bins.

Although the invention made by the present inventor has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above examples and can be modified in various ways without departing from the gist thereof. Nor.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

As described above, according to the present invention, even when the number of bins increases and the number of food items increases, there is no malfunction of the wire bonding device, the input time is shortened, and it is possible to provide a technology that is extremely significant in practice. did it.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the invention, and FIG. 2 is a partially sectional perspective view showing an embodiment of the invention. 1... Semiconductor chip, 2... Bonding pad,
3...Nl (standard 11k), 4...Lead frame (terminal for external extraction of the package), 5...Suite (
mark), 6... bonding wire, 7... resin sealing part. Figure Figure

Claims (1)

[Claims] 1. When wire bonding is performed using a bonding wire between a connection electrode on a semiconductor chip and an external lead-out terminal of a package using a wire bonding device, the connection electrode on the semiconductor chip to be wire-bonded; and the corresponding external lead-out terminals of the package are each marked with the same mark indicating the order of bonding, and wire bonding is performed by matching the connection electrodes on the semiconductor chip with the external lead-out terminals of the package. A wire bonding method characterized by: 2. The wire bonding method according to claim 1, wherein the mark consists of a number code.