JPH0325247U - - Google Patents

Info

Publication number
JPH0325247U
JPH0325247U JP1989085776U JP8577689U JPH0325247U JP H0325247 U JPH0325247 U JP H0325247U JP 1989085776 U JP1989085776 U JP 1989085776U JP 8577689 U JP8577689 U JP 8577689U JP H0325247 U JPH0325247 U JP H0325247U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fin
semiconductor device
ceramic
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989085776U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989085776U priority Critical patent/JPH0325247U/ja
Publication of JPH0325247U publication Critical patent/JPH0325247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示す半導体装置
用パツケージの断面図、第２図はこの考案の他の
実施例を示す半導体装置用パツケージの断面図、
第３図は従来の半導体装置用パツケージの断面図
第４図は従来の他の半導体装置用パツケージの断
面図である。 図において、１は銅製の放熱フイン、２はセラ
ミツクス、３はろう材、４はモリブデン板である
。なお、各図中の同一符号は同一または相当部分
を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属製の放熱フインと半導体チツプを搭載する
    ためのセラミツクスとを固着するタイプの半導体
    装置用パツケージにおいて、前記放熱フインの前
    記セラミツクスが固着される面と反対の面に前記
    放熱フインの膨張係数より小さい金属板を設けた
    ことを特徴とする半導体装置用パツケージ。
JP1989085776U 1989-07-20 1989-07-20 Pending JPH0325247U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989085776U JPH0325247U (ja) 1989-07-20 1989-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989085776U JPH0325247U (ja) 1989-07-20 1989-07-20

Publications (1)

Publication Number Publication Date
JPH0325247U true JPH0325247U (ja) 1991-03-15

Family

ID=31635076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989085776U Pending JPH0325247U (ja) 1989-07-20 1989-07-20

Country Status (1)

Country Link
JP (1) JPH0325247U (ja)

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