JPH0247054U - - Google Patents

Info

Publication number
JPH0247054U
JPH0247054U JP1988126174U JP12617488U JPH0247054U JP H0247054 U JPH0247054 U JP H0247054U JP 1988126174 U JP1988126174 U JP 1988126174U JP 12617488 U JP12617488 U JP 12617488U JP H0247054 U JPH0247054 U JP H0247054U
Authority
JP
Japan
Prior art keywords
semiconductor elements
housing semiconductor
package
registration request
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988126174U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988126174U priority Critical patent/JPH0247054U/ja
Publication of JPH0247054U publication Critical patent/JPH0247054U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Description

【図面の簡単な説明】
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……基体、２……蓋体、３……容器、８……
金属層、９……金属放熱体、９ａ……コバール金
属板、９ｂ……銅板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を収容するセラミツク製容器の外表
    面の金属層上にコバール金属板の両主面に銅板を
    接合させた複合金属体をロウ付けしたことを特徴
    とする半導体素子収納用パツケージ。
JP1988126174U 1988-09-26 1988-09-26 Pending JPH0247054U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988126174U JPH0247054U (ja) 1988-09-26 1988-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988126174U JPH0247054U (ja) 1988-09-26 1988-09-26

Publications (1)

Publication Number Publication Date
JPH0247054U true JPH0247054U (ja) 1990-03-30

Family

ID=31377447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988126174U Pending JPH0247054U (ja) 1988-09-26 1988-09-26

Country Status (1)

Country Link
JP (1) JPH0247054U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740870A (ja) * 1993-04-01 1995-02-10 Hidetoshi Nishiyama 作業用保護カバーの係止具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027151A (ja) * 1983-07-25 1985-02-12 Sumitomo Electric Ind Ltd 半導体素子搭載用複合金属条

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027151A (ja) * 1983-07-25 1985-02-12 Sumitomo Electric Ind Ltd 半導体素子搭載用複合金属条

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740870A (ja) * 1993-04-01 1995-02-10 Hidetoshi Nishiyama 作業用保護カバーの係止具

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