JPS6364048U - - Google Patents

Info

Publication number
JPS6364048U
JPS6364048U JP15682686U JP15682686U JPS6364048U JP S6364048 U JPS6364048 U JP S6364048U JP 15682686 U JP15682686 U JP 15682686U JP 15682686 U JP15682686 U JP 15682686U JP S6364048 U JPS6364048 U JP S6364048U
Authority
JP
Japan
Prior art keywords
substrate
ceramic
ceramic substrate
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15682686U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15682686U priority Critical patent/JPS6364048U/ja
Publication of JPS6364048U publication Critical patent/JPS6364048U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案による半導体素子搭載用基板の
一実施例を示す構成図、第２図は基板の従来例を
示す構成図である。 １……セラミツク基板ａ、２ａ……銅板ａ、２
ｂ……銅板ｂ、３……銅基板、５……セラミツク
基板ｂ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 金属基板上に接合された複数枚の材質の異
    なるセラミツク基板と、これらセラミツク基板面
    上に接合された金属部材とからなることを特徴と
    する半導体素子搭載用基板。 (2) 実用新案登録請求の範囲第(1)項記載の基板
    において、セラミツク基板がアルミナ（Ａｌ２Ｏ
    ３）からなるセラミツク基板と窒化アルミニウム
    （ＡｌＮ）からなるセラミツク基板とであること
    を特徴とする半導体素子搭載用基板。
JP15682686U 1986-10-14 1986-10-14 Pending JPS6364048U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15682686U JPS6364048U (ja) 1986-10-14 1986-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15682686U JPS6364048U (ja) 1986-10-14 1986-10-14

Publications (1)

Publication Number Publication Date
JPS6364048U true JPS6364048U (ja) 1988-04-27

Family

ID=31078812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15682686U Pending JPS6364048U (ja) 1986-10-14 1986-10-14

Country Status (1)

Country Link
JP (1) JPS6364048U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210781A (ja) * 1988-06-29 1990-01-16 Komatsu Ltd 多段電子クーラー

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210781A (ja) * 1988-06-29 1990-01-16 Komatsu Ltd 多段電子クーラー

Similar Documents

Publication Publication Date Title
JPS6364048U (ja)
JPS6024566U (ja) セラミツク印刷版
JPH0336137U (ja)
JPH0388354U (ja)
JPS62180944U (ja)
JPS6365294U (ja)
JPS5820536U (ja) 半導体装置
JPS6375044U (ja)
JPS5929048U (ja) 半導体部品の放熱器取付構造
JPS60101741U (ja) セラミツク放熱基板
JPS58168135U (ja) 半導体装置
JPS61199043U (ja)
JPS6298227U (ja)
JPH0325247U (ja)
JPS6289179U (ja)
JPS60118239U (ja) 基板支持具
JPS60156754U (ja) ヒ−トシンク
JPS6127260U (ja) 半導体圧力センサ
JPS6120395U (ja) 陶器置物を釉裏銀彩にて製作する方法
JPH0282035U (ja)
JPH0388353U (ja)
JPS58125418U (ja) セラミツクフイルタ−の実装構造
JPH0458347U (ja)
JPS6078142U (ja) 集積回路装置
JPS5878667U (ja) 複合半導体装置