JPH0325558U - - Google Patents
Info
- Publication number
- JPH0325558U JPH0325558U JP8701389U JP8701389U JPH0325558U JP H0325558 U JPH0325558 U JP H0325558U JP 8701389 U JP8701389 U JP 8701389U JP 8701389 U JP8701389 U JP 8701389U JP H0325558 U JPH0325558 U JP H0325558U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- accommodation holes
- multiple accommodation
- thin film
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004308 accommodation Effects 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は実施例の平面図、第２図は他の実施例
の平面図、第３図はさらに他の実施例の平面図、
第４図はターゲツトの適用例の説明斜視図である
。
１……本体、２……収容孔、３……組成補正用
のペレツト。
FIG. 1 is a plan view of an embodiment, FIG. 2 is a plan view of another embodiment, and FIG. 3 is a plan view of yet another embodiment.
FIG. 4 is an explanatory perspective view of an example of application of the target. 1... Main body, 2... Accommodation hole, 3... Pellet for composition correction.
Claims (1)
るターゲツトであり、平板状に形成された本体に
、組成補正用のペレツトを装着するための収容孔
を複数有し、その複数の収容孔が本体の中心点よ
り等距離の位置に、かつ等間隔で配置されている
ことを特徴とするターゲツト。 This is a target used when forming a thin film using the sputtering method.The main body is formed into a flat plate and has multiple accommodation holes for mounting pellets for composition correction, and the multiple accommodation holes are located at the center point of the main body. Targets characterized by being arranged at more equidistant positions and at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8701389U JPH0325558U (en) | 1989-07-25 | 1989-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8701389U JPH0325558U (en) | 1989-07-25 | 1989-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325558U true JPH0325558U (en) | 1991-03-15 |
Family
ID=31636667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8701389U Pending JPH0325558U (en) | 1989-07-25 | 1989-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325558U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442576A (en) * | 1987-08-10 | 1989-02-14 | Fujitsu Ltd | Composite sputtering target |
-
1989
- 1989-07-25 JP JP8701389U patent/JPH0325558U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442576A (en) * | 1987-08-10 | 1989-02-14 | Fujitsu Ltd | Composite sputtering target |
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