JPH0429656U - - Google Patents
Info
- Publication number
- JPH0429656U JPH0429656U JP6813390U JP6813390U JPH0429656U JP H0429656 U JPH0429656 U JP H0429656U JP 6813390 U JP6813390 U JP 6813390U JP 6813390 U JP6813390 U JP 6813390U JP H0429656 U JPH0429656 U JP H0429656U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- plate
- target
- bucking
- introduction part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 1
- 239000012495 reaction gas Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案の一実施例によるスパツタリン
グ装置の縦断面概略構成図、第２図は前記装置に
用いられるターゲツトの平面概略図、第３図は従
来装置の第１図に相当する図、第４図は従来のタ
ーゲツトの第２図に相当する図である。
６……基板ホルダ、９……バツキングプレート
、１１……ターゲツト、１１ａ，１１ｂ，１１ｃ
……ターゲツト部材、１３……ガス導入部。
FIG. 1 is a schematic vertical cross-sectional configuration diagram of a sputtering device according to an embodiment of the present invention, FIG. 2 is a schematic plan view of a target used in the device, and FIG. 3 is a diagram corresponding to FIG. 1 of a conventional device. FIG. 4 is a diagram corresponding to FIG. 2 of a conventional target. 6...Substrate holder, 9...Backing plate, 11...Target, 11a, 11b, 11c
...Target member, 13...Gas introduction part.
Claims (1)
中央部に開孔を有するバツキングプレートと、 前記バツキングプレート上に設けられ、複数の
領域に均等に分割されるとともに、各分割領域が
異なる組成を有する複数のターゲツト部材からそ
れぞれ構成されているリング状のターゲツトと、 前記バツキングプレートの開孔内に設けられた
、反応ガスを導入するためのガス導入部と、 を備えたスパツタリング装置。[Claims for Utility Model Registration]
A bucking plate having an opening in the center; and a plurality of target members provided on the bucking plate and equally divided into a plurality of regions, each divided region having a different composition. A sputtering device comprising: a ring-shaped target; and a gas introduction part for introducing a reaction gas, provided in the opening of the backing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6813390U JPH0429656U (en) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6813390U JPH0429656U (en) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0429656U true JPH0429656U (en) | 1992-03-10 |
Family
ID=31602309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6813390U Pending JPH0429656U (en) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429656U (en) |
-
1990
- 1990-06-27 JP JP6813390U patent/JPH0429656U/ja active Pending