JPH0326544B2 - - Google Patents

Info

Publication number
JPH0326544B2
JPH0326544B2 JP59242118A JP24211884A JPH0326544B2 JP H0326544 B2 JPH0326544 B2 JP H0326544B2 JP 59242118 A JP59242118 A JP 59242118A JP 24211884 A JP24211884 A JP 24211884A JP H0326544 B2 JPH0326544 B2 JP H0326544B2
Authority
JP
Japan
Prior art keywords
semiconductor component
cap
semiconductor
input
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59242118A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61120451A (ja
Inventor
Yukio Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59242118A priority Critical patent/JPS61120451A/ja
Priority to FR8513819A priority patent/FR2570383B1/fr
Publication of JPS61120451A publication Critical patent/JPS61120451A/ja
Publication of JPH0326544B2 publication Critical patent/JPH0326544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59242118A 1984-09-20 1984-11-16 半導体容器 Granted JPS61120451A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59242118A JPS61120451A (ja) 1984-11-16 1984-11-16 半導体容器
FR8513819A FR2570383B1 (fr) 1984-09-20 1985-09-18 Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59242118A JPS61120451A (ja) 1984-11-16 1984-11-16 半導体容器

Publications (2)

Publication Number Publication Date
JPS61120451A JPS61120451A (ja) 1986-06-07
JPH0326544B2 true JPH0326544B2 (fr) 1991-04-11

Family

ID=17084561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59242118A Granted JPS61120451A (ja) 1984-09-20 1984-11-16 半導体容器

Country Status (1)

Country Link
JP (1) JPS61120451A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH05129482A (ja) * 1991-08-27 1993-05-25 Kyocera Corp 電子部品収納用パツケージ
JP4715049B2 (ja) * 2001-07-03 2011-07-06 株式会社デンソー 鋏め装置の着座検出機構及びその検出方法
JP4696621B2 (ja) * 2005-03-22 2011-06-08 ソニー株式会社 半導体装置

Also Published As

Publication number Publication date
JPS61120451A (ja) 1986-06-07

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