JPH032674U - - Google Patents

Info

Publication number
JPH032674U
JPH032674U JP6297689U JP6297689U JPH032674U JP H032674 U JPH032674 U JP H032674U JP 6297689 U JP6297689 U JP 6297689U JP 6297689 U JP6297689 U JP 6297689U JP H032674 U JPH032674 U JP H032674U
Authority
JP
Japan
Prior art keywords
layers
insulating material
metal substrate
conductor circuit
material layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6297689U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6297689U priority Critical patent/JPH032674U/ja
Publication of JPH032674U publication Critical patent/JPH032674U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係る多層プリント
配線板の構造を示す段面図である。 １１……金属基板、１２，１４……絶縁層（絶
縁材料層）、１３，１５……導電回路（導電回路
層）、１６……バイアホール。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属基板上に印刷によつて交互に多層に形成さ
    れた絶縁材料層並びに導体回路層を備え、上記多
    層に形成された絶縁材料層並びに導体回路層が上
    記金属基板の溶融点以下の温度で焼成れているこ
    とを特徴とする多層プリント配線板。
JP6297689U 1989-05-30 1989-05-30 Pending JPH032674U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6297689U JPH032674U (ja) 1989-05-30 1989-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6297689U JPH032674U (ja) 1989-05-30 1989-05-30

Publications (1)

Publication Number Publication Date
JPH032674U true JPH032674U (ja) 1991-01-11

Family

ID=31592615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6297689U Pending JPH032674U (ja) 1989-05-30 1989-05-30

Country Status (1)

Country Link
JP (1) JPH032674U (ja)

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