JPH032676U - - Google Patents
Info
- Publication number
- JPH032676U JPH032676U JP6248889U JP6248889U JPH032676U JP H032676 U JPH032676 U JP H032676U JP 6248889 U JP6248889 U JP 6248889U JP 6248889 U JP6248889 U JP 6248889U JP H032676 U JPH032676 U JP H032676U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- circuit board
- circuit module
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図イ〜ロは本考案の一実施例のＤＩＰ混成
集積回路モジユールの製造工程を示す斜視図、第
１図ニはその一工程の側面図、第２図は従来のＤ
ＩＰ混成集積回路モジユールである。
図中、１は回路基板、２ａ〜２ｅは電子部品、
３ａ，３ｂはリード端子、４は樹脂膜、５は接着
剤、６はノズル吸着用平板である。
Figures 1A to 1B are perspective views showing the manufacturing process of a DIP hybrid integrated circuit module according to an embodiment of the present invention, Figure 1D is a side view of one of the steps, and Figure 2 is a conventional DIP
It is an IP hybrid integrated circuit module. In the figure, 1 is a circuit board, 2a to 2e are electronic components,
3a and 3b are lead terminals, 4 is a resin film, 5 is an adhesive, and 6 is a flat plate for attracting the nozzle.
Claims (1)
該基板に対して直角に複数のリード端子を導出し
てなる混成集積回路モジユールにおいて、電子部
品の上面に平板を接着させて設けたことを特徴と
する混成集積回路モジユール。 A hybrid integrated circuit module in which a plurality of lead terminals are led out from the edge of a circuit board on which a plurality of electronic components are mounted perpendicular to the circuit board, characterized in that a flat plate is attached to the top surface of the electronic component. Hybrid integrated circuit module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062488U JPH0810218Y2 (en) | 1989-05-31 | 1989-05-31 | Hybrid integrated circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062488U JPH0810218Y2 (en) | 1989-05-31 | 1989-05-31 | Hybrid integrated circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032676U true JPH032676U (en) | 1991-01-11 |
| JPH0810218Y2 JPH0810218Y2 (en) | 1996-03-27 |
Family
ID=31591683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989062488U Expired - Lifetime JPH0810218Y2 (en) | 1989-05-31 | 1989-05-31 | Hybrid integrated circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810218Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6282772U (en) * | 1985-11-14 | 1987-05-27 | ||
| JPS6440574U (en) * | 1987-09-02 | 1989-03-10 |
-
1989
- 1989-05-31 JP JP1989062488U patent/JPH0810218Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6282772U (en) * | 1985-11-14 | 1987-05-27 | ||
| JPS6440574U (en) * | 1987-09-02 | 1989-03-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810218Y2 (en) | 1996-03-27 |