JPH032676U - - Google Patents

Info

Publication number
JPH032676U
JPH032676U JP6248889U JP6248889U JPH032676U JP H032676 U JPH032676 U JP H032676U JP 6248889 U JP6248889 U JP 6248889U JP 6248889 U JP6248889 U JP 6248889U JP H032676 U JPH032676 U JP H032676U
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
circuit board
circuit module
flat plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6248889U
Other languages
English (en)
Other versions
JPH0810218Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989062488U priority Critical patent/JPH0810218Y2/ja
Publication of JPH032676U publication Critical patent/JPH032676U/ja
Application granted granted Critical
Publication of JPH0810218Y2 publication Critical patent/JPH0810218Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)

Description

【図面の簡単な説明】
第１図イ〜ロは本考案の一実施例のＤＩＰ混成
集積回路モジユールの製造工程を示す斜視図、第
１図ニはその一工程の側面図、第２図は従来のＤ
ＩＰ混成集積回路モジユールである。 図中、１は回路基板、２ａ〜２ｅは電子部品、
３ａ，３ｂはリード端子、４は樹脂膜、５は接着
剤、６はノズル吸着用平板である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の電子部品を搭載した回路基板の縁部から
    該基板に対して直角に複数のリード端子を導出し
    てなる混成集積回路モジユールにおいて、電子部
    品の上面に平板を接着させて設けたことを特徴と
    する混成集積回路モジユール。
JP1989062488U 1989-05-31 1989-05-31 混成集積回路モジュール Expired - Lifetime JPH0810218Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062488U JPH0810218Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062488U JPH0810218Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュール

Publications (2)

Publication Number Publication Date
JPH032676U true JPH032676U (ja) 1991-01-11
JPH0810218Y2 JPH0810218Y2 (ja) 1996-03-27

Family

ID=31591683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062488U Expired - Lifetime JPH0810218Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュール

Country Status (1)

Country Link
JP (1) JPH0810218Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282772U (ja) * 1985-11-14 1987-05-27
JPS6440574U (ja) * 1987-09-02 1989-03-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282772U (ja) * 1985-11-14 1987-05-27
JPS6440574U (ja) * 1987-09-02 1989-03-10

Also Published As

Publication number Publication date
JPH0810218Y2 (ja) 1996-03-27

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