JPH0328755U - - Google Patents

Info

Publication number
JPH0328755U
JPH0328755U JP1989088725U JP8872589U JPH0328755U JP H0328755 U JPH0328755 U JP H0328755U JP 1989088725 U JP1989088725 U JP 1989088725U JP 8872589 U JP8872589 U JP 8872589U JP H0328755 U JPH0328755 U JP H0328755U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
lead frame
mounting piece
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989088725U
Other languages
English (en)
Other versions
JPH0648875Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989088725U priority Critical patent/JPH0648875Y2/ja
Publication of JPH0328755U publication Critical patent/JPH0328755U/ja
Application granted granted Critical
Publication of JPH0648875Y2 publication Critical patent/JPH0648875Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案第一実施例の半導体装置の横断
平面図、第２図は同じくその縦断側面図、第３図
は本考案第二実施例の半導体装置の横断平面図、
第４図は同じくその縦断側面図、第５図は同じく
そのプリント配線板の裏面側から視た図、第６図
は本考案の他の実施例の半導体装置の横断平面図
、第７図は同じくその縦断側面図、第８図は従来
の半導体装置の横断平面図、第９図は同じくその
縦断側面図、第１０図は他の従来例を示す横断平
面図、第１１図は同じくその縦断側面図である。 １０……半導体素子、１１……載置片、１２，
１３，１４，１５……リード端子、１６……リー
ドフレーム、１７，１８，１９……電子部品、２
０……回路パターン、２１……プリント配線板、
２２……絶縁封止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と、該半導体素子が搭載される載置
    片と外部に入出力する複数のリード端子とを有す
    るリードフレームと、電子部品が搭載される回路
    パターンが形成されたプリント配線板とを備え、
    前記リードフレームとプリント配線板とが絶縁封
    止樹脂により樹脂封止され、前記プリント配線板
    が載置片とリードフレームとを中継するよう配さ
    れたことを特徴とする半導体装置。
JP1989088725U 1989-07-27 1989-07-27 半導体装置 Expired - Fee Related JPH0648875Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989088725U JPH0648875Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989088725U JPH0648875Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH0328755U true JPH0328755U (ja) 1991-03-22
JPH0648875Y2 JPH0648875Y2 (ja) 1994-12-12

Family

ID=31638321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989088725U Expired - Fee Related JPH0648875Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Country Status (1)

Country Link
JP (1) JPH0648875Y2 (ja)

Also Published As

Publication number Publication date
JPH0648875Y2 (ja) 1994-12-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees