JPH0330450U - - Google Patents
Info
- Publication number
- JPH0330450U JPH0330450U JP1989091167U JP9116789U JPH0330450U JP H0330450 U JPH0330450 U JP H0330450U JP 1989091167 U JP1989091167 U JP 1989091167U JP 9116789 U JP9116789 U JP 9116789U JP H0330450 U JPH0330450 U JP H0330450U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- tip
- lead wire
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は本考案実施例の発光ダイオードランプ
の断面図、第２図はそのリード線の正面図、第３
図は従来の発光ダイオードリード線の要部側面図
である。
の断面図、第２図はそのリード線の正面図、第３
図は従来の発光ダイオードリード線の要部側面図
である。
Claims (1)
- 先端部近傍に側面から突出する舌片部を設けた
リード線と、該リード線の先端部頂面及び舌片部
頂面に各々載置固着された発光ダイオードと、そ
のリード線先端部及び発光ダイオードを覆う透光
性の樹脂とを具備した事を特徴とする発光ダイオ
ードランプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091167U JPH0330450U (ja) | 1989-08-01 | 1989-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091167U JPH0330450U (ja) | 1989-08-01 | 1989-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330450U true JPH0330450U (ja) | 1991-03-26 |
Family
ID=31640665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989091167U Pending JPH0330450U (ja) | 1989-08-01 | 1989-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330450U (ja) |
-
1989
- 1989-08-01 JP JP1989091167U patent/JPH0330450U/ja active Pending