JPH0336520Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a gas jet type high-frequency electrode applied to plasma CVD equipment, plasma etching equipment, and others.

(Prior Art) Conventionally, as this type of electrode, the inside of the enlarged head at the tip of the electrode main body connected to a high frequency power source is formed into a gas chamber connected to a gas passage extending through the main body. A type in which a gas ejection plate is attached to the front opening is known.

(Problem to be solved by the invention) However, in this case, the plate is, for example, the first
As shown in the diagram, that is, plate material a has a diameter of 1.0 to 0.7 mm.
In general, a method is used in which a large number of holes b of approximately 100 mm are made by drilling.In such a method, the sizes of the holes b are uneven, and electric discharge tends to concentrate in the large holes.In order to eliminate this inconvenience, , pore size
It is conceivable to set the diameter to about 0.3 to 0.5 mm, but this would be laborious and expensive, and furthermore, with such a type, if there is contamination in the gas system, the hole pattern would be projected onto the substrate side. It comes with inconveniences such as winning.

(Means for Solving the Problems) The purpose of the present invention is to obtain an electrode that does not have such inconveniences. A gas chamber is formed that is connected to a gas passage extending through the interior, and a gas ejection plate is provided at the front opening of the gas chamber, and the plate is constructed of a porous metal plate made of a sintered metal plate or a foamed metal plate. It is characterized by

(Function) In this case, since the porous metal plate constituting the plate has a pore diameter of about 100 Å to 100 μ, there is no concentration of discharge, and the porosity is, for example, 94 to 96%, resulting in large conductance. The pressure loss that tends to occur is small, and the pores are made up of a series of pores that are generated during the manufacturing of the porous metal plate, and the pores are in random directions, so there is no pattern of pores on the substrate even due to gaseous contamination. No projection occurs.

(Example) An example of implementing the present invention will be explained with reference to attached drawings. Figures 2 and 3 show an example of this. 1 is a cylindrical electrode body, 2 is an external high-frequency power source connected to this body, and the body 1 has a huge head 3 at its tip. The interior thereof is formed into a gas chamber 5 connected to the central gas passage 4 extending through the interior of the main body 1, and a gas ejection plate 6 is provided at the opening on the entire surface thereof. In the drawing, reference numeral 7 indicates an earth shield whose outer periphery is grounded, and reference numeral 8 indicates an intermediate plate that divides the inside of the gas chamber 5 into two chambers 5a and 5b, front and rear, which communicate with each other. The reactive gas supplied to the gas passage 4 from a gas source external to it is thus distributed through the rear chamber 5a and then through the holes in the plate 8 and led to the front chamber 5b. The plate 6
so as to be guided forward through it.

Although the above is not particularly different from the conventional one, according to the present invention, the plate 6 is made of a sintered metal plate or a foamed metal plate (for example, Sumitomo Electric's Selmet) with numerous pores such as Ni, Cr, Al. In this case, the pore diameter is, for example, about 100 Å to 100 μm, and the porosity is generally about 94 to 96%.

Gas ejection plate 6 is made of such a porous metal plate.
With this structure, the reactive gas introduced from the gas passage 4 is ejected from the pores opening in random directions in the porous metal plate to the substrate, which eliminates the inconvenience of projecting the hole pattern onto the substrate. Since there are no large holes required for drilling, there is no concentration of electric discharge, and the conductance is relatively large, so pressure loss is small.

(Effect of the invention) As described above, according to the invention, the gas ejection plate on the entire surface of the gas chamber is made of a porous metal plate, and the holes are formed in the gas ejection plate of the porous metal plate by conventional drilling. Since the pores are smaller and the direction of the pores is random than that of a porous metal plate, there is no concentration of discharge and the pressure loss is small. It is easy to process as the gas ejection plate can be made by cutting the plate into appropriate dimensions.
It has the advantage of being available at a low price.

[Brief explanation of drawings]

Fig. 1 is a front view of the gas ejection plate portion of the conventional example, Fig. 2 is a cutaway side view of an example of the electrode of the present invention, and Fig. 3
The figure is its front view. 1... Electrode body, 2... High frequency power supply, 3... Enlarged head, 4... Gas passage, 5... Gas chamber, 6... Gas ejection plate.

Claims (1)

[Scope of utility model registration request] The inside of the huge head of the tip of the electrode body connected to a high-frequency power source is formed into a gas chamber connected to a gas passage extending through the body, and a gas ejection plate is provided at the front opening of the body,
A gas injection type high frequency electrode characterized in that the plate is constituted by a porous metal plate made of a sintered metal plate or a foamed metal plate.