JPH0338643U - - Google Patents
Info
- Publication number
- JPH0338643U JPH0338643U JP1989098836U JP9883689U JPH0338643U JP H0338643 U JPH0338643 U JP H0338643U JP 1989098836 U JP1989098836 U JP 1989098836U JP 9883689 U JP9883689 U JP 9883689U JP H0338643 U JPH0338643 U JP H0338643U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- lead
- view
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は第１図のＡ−Ａ線に沿う断面図、第３図は第
１図のＢ−Ｂ線に沿う断面図、第４図は第２図の
Ｃ−Ｃ線に沿う断面図、第５図は第１図の電子部
品の製造途中でのリードフレームの部分斜視図、
第６図は第１図の電子部品のリード折曲前の斜視
図、第７図は第１図の電子部品の特性測定時の正
面図である。第８図乃至第１０図は本考案の他の
実施例を説明するためのもので、第８図は一部省
略部分を含む斜視図、第９図及び第１０図は第８
図のＤ−Ｄ線に沿う断面図及びリード折曲前の断
面図である。第１１図乃至第１６図は従来の樹脂
モールド型電子部品を説明するためのもので、第
１１図は平面図、第１２図は正面図、第１３図は
製造途中でのリードフレームの部分斜視図、第１
４図はリード折曲前の斜視図、第１５図はリード
折曲時での部分拡大正面図、第１６図はリード形
状不良例を示す正面図である。
２０…電子部品、２１…部品本体、２２，２３
，２４…リード、２５…樹脂外装材。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a cross-sectional view taken along line A-A in Figure 1, Figure 3 is a cross-sectional view taken along line B-B in Figure 1, Figure 4 is a cross-sectional view taken along line C-C in Figure 2, and Figure 4 is a cross-sectional view taken along line C-C in Figure 2. Figure 5 is a partial perspective view of the lead frame in the middle of manufacturing the electronic component in Figure 1;
6 is a perspective view of the electronic component shown in FIG. 1 before lead bending, and FIG. 7 is a front view of the electronic component shown in FIG. 1 when characteristics are measured. 8 to 10 are for explaining other embodiments of the present invention, FIG. 8 is a perspective view with some omitted parts, and FIGS. 9 and 10 are
They are a sectional view taken along the line DD in the figure and a sectional view before lead bending. Figures 11 to 16 are for explaining conventional resin-molded electronic components. Figure 11 is a plan view, Figure 12 is a front view, and Figure 13 is a partial perspective view of a lead frame in the middle of manufacturing. Figure, 1st
4 is a perspective view before bending the lead, FIG. 15 is a partially enlarged front view when the lead is bent, and FIG. 16 is a front view showing an example of a defective lead shape. 20...Electronic component, 21...Component body, 22, 23
, 24...Lead, 25...Resin exterior material.
Claims (1)
続されたリードの一部を樹脂にて被覆しリードの
露出部を樹脂外壁に沿わせた樹脂モールド型電子
部品において、上記樹脂の少くともリードと対向
する部分を凸湾曲させたことを特徴とする樹脂モ
ールド型電子部品。 In a resin-molded electronic component in which the electronic component body and a part of the lead electrically connected to the electronic component body are covered with a resin, and the exposed portion of the lead is aligned with the outer resin wall, at least the above-mentioned resin is placed opposite to the lead. A resin molded electronic component characterized by a convexly curved portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989098836U JPH0338643U (en) | 1989-08-23 | 1989-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989098836U JPH0338643U (en) | 1989-08-23 | 1989-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338643U true JPH0338643U (en) | 1991-04-15 |
Family
ID=31647915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989098836U Pending JPH0338643U (en) | 1989-08-23 | 1989-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338643U (en) |
-
1989
- 1989-08-23 JP JP1989098836U patent/JPH0338643U/ja active Pending