JPH033938B2 - - Google Patents

Info

Publication number
JPH033938B2
JPH033938B2 JP59000276A JP27684A JPH033938B2 JP H033938 B2 JPH033938 B2 JP H033938B2 JP 59000276 A JP59000276 A JP 59000276A JP 27684 A JP27684 A JP 27684A JP H033938 B2 JPH033938 B2 JP H033938B2
Authority
JP
Japan
Prior art keywords
bonding
carrier
holding mechanism
axis
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59000276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60144941A (ja
Inventor
Hideaki Myoshi
Tadashi Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP59000276A priority Critical patent/JPS60144941A/ja
Publication of JPS60144941A publication Critical patent/JPS60144941A/ja
Publication of JPH033938B2 publication Critical patent/JPH033938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59000276A 1984-01-06 1984-01-06 ワイヤボンデイング装置 Granted JPS60144941A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59000276A JPS60144941A (ja) 1984-01-06 1984-01-06 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59000276A JPS60144941A (ja) 1984-01-06 1984-01-06 ワイヤボンデイング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3150285A Division JPS60242625A (ja) 1985-02-21 1985-02-21 Ｉｃ担持体の移送装置

Publications (2)

Publication Number Publication Date
JPS60144941A JPS60144941A (ja) 1985-07-31
JPH033938B2 true JPH033938B2 (id) 1991-01-21

Family

ID=11469376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59000276A Granted JPS60144941A (ja) 1984-01-06 1984-01-06 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60144941A (id)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340011A (en) * 1992-12-09 1994-08-23 Lsi Logic Corporation Adjustable height work holder for bonding semiconductor dies

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749244A (en) * 1980-09-09 1982-03-23 Nec Corp Automatic supersonic bonder

Also Published As

Publication number Publication date
JPS60144941A (ja) 1985-07-31

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