JPH0339864U - - Google Patents

Info

Publication number
JPH0339864U
JPH0339864U JP1989100465U JP10046589U JPH0339864U JP H0339864 U JPH0339864 U JP H0339864U JP 1989100465 U JP1989100465 U JP 1989100465U JP 10046589 U JP10046589 U JP 10046589U JP H0339864 U JPH0339864 U JP H0339864U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode array
substrate
types
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989100465U
Other languages
Japanese (ja)
Other versions
JPH0726852Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989100465U priority Critical patent/JPH0726852Y2/en
Publication of JPH0339864U publication Critical patent/JPH0339864U/ja
Application granted granted Critical
Publication of JPH0726852Y2 publication Critical patent/JPH0726852Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の部分正面図、第２
図はウエハ検査に用いられるウエハに発光ダイオ
ードアレイが形成された状態の部分正面図、第３
図はチツプ検査時の位置合せカーソルと認識パタ
ーンとの関係を示す図であり、第３図ａは位置合
せカーソルの構成を示す図、第３図ｂは検査装置
の操作開始及び停止時の関係を示す図、第３図ｃ
は操作継続時の関係を示す図、第４図はウエハ検
査用の認識パターンに対する位置合せカーソルの
検出状態を示す図、第５図は本考案の他の実施例
の部分正面図、第６図および第７図は認識パター
ンが組み込まれていない従来の発光ダイオードア
レイの正面図、第８図および第９図は認識パター
ンが組み込まれた従来例の発光ダイオードアレイ
の正面図である。 図中、５……発光ダイオードアレイ、６……基
板、７……発光ダイオード、９……ボンデイング
パツド、１０，１１……認識パターンである。 Figure 1 is a partial front view of one embodiment of the present invention;
The figure is a partial front view of a wafer used for wafer inspection with a light emitting diode array formed on it.
The figures show the relationship between the positioning cursor and the recognition pattern during chip inspection. Figure 3a shows the configuration of the positioning cursor, and Figure 3b shows the relationship when starting and stopping the operation of the inspection device. Figure 3 c
4 is a diagram showing the detection state of the alignment cursor with respect to the recognition pattern for wafer inspection, FIG. 5 is a partial front view of another embodiment of the present invention, and FIG. 6 is a diagram showing the relationship when the operation is continued. 7 is a front view of a conventional light emitting diode array in which a recognition pattern is not incorporated, and FIGS. 8 and 9 are front views of a conventional light emitting diode array in which a recognition pattern is incorporated. In the figure, 5...Light emitting diode array, 6...Substrate, 7...Light emitting diode, 9...Bonding pad, 10, 11...Recognition pattern.

Claims (1)

【実用新案登録請求の範囲】 １ 基板表面に直線的に複数の発光ダイオードを
整列配設し、各発光ダイオードからボンデイング
パツドを延出形成した発光ダイオードアレイにお
いて、上記ボンデイングパツドのうち基板端側の
複数のボンデイングパツドを、検査装置により互
いに区別してパターン認識可能な複数種の認識パ
ターンとして形成したことを特徴とする発光ダイ
オードアレイ。 ２ 複数種の認識パターンは、各種類毎に発光ダ
イオードの整列方向と直交する側に１対として設
けたことを特徴とする請求項１記載の発光ダイオ
ードアレイ。[Claims for Utility Model Registration] 1. In a light emitting diode array in which a plurality of light emitting diodes are linearly arranged on the surface of a substrate and a bonding pad is formed extending from each light emitting diode, one of the bonding pads is located at the edge of the substrate. A light emitting diode array characterized in that a plurality of side bonding pads are formed as a plurality of types of recognition patterns that can be distinguished from each other and recognized by an inspection device. 2. The light emitting diode array according to claim 1, wherein the plurality of types of recognition patterns are provided as a pair on a side perpendicular to the alignment direction of the light emitting diodes for each type.
JP1989100465U 1989-08-30 1989-08-30 Light emitting diode array Expired - Fee Related JPH0726852Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989100465U JPH0726852Y2 (en) 1989-08-30 1989-08-30 Light emitting diode array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989100465U JPH0726852Y2 (en) 1989-08-30 1989-08-30 Light emitting diode array

Publications (2)

Publication Number Publication Date
JPH0339864U true JPH0339864U (en) 1991-04-17
JPH0726852Y2 JPH0726852Y2 (en) 1995-06-14

Family

ID=31649472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989100465U Expired - Fee Related JPH0726852Y2 (en) 1989-08-30 1989-08-30 Light emitting diode array

Country Status (1)

Country Link
JP (1) JPH0726852Y2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996729A (en) * 1982-11-26 1984-06-04 Hitachi Ltd Method for measuring positional accuracy of photomask and the like
JPS59143159A (en) * 1983-02-07 1984-08-16 Mitsubishi Electric Corp Pattern overlapping method for photoengraving process
JPS6229138A (en) * 1985-07-31 1987-02-07 Oki Electric Ind Co Ltd Marking and alignment mark thereof
JPS62170655U (en) * 1986-04-18 1987-10-29
JPS6490527A (en) * 1987-10-01 1989-04-07 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996729A (en) * 1982-11-26 1984-06-04 Hitachi Ltd Method for measuring positional accuracy of photomask and the like
JPS59143159A (en) * 1983-02-07 1984-08-16 Mitsubishi Electric Corp Pattern overlapping method for photoengraving process
JPS6229138A (en) * 1985-07-31 1987-02-07 Oki Electric Ind Co Ltd Marking and alignment mark thereof
JPS62170655U (en) * 1986-04-18 1987-10-29
JPS6490527A (en) * 1987-10-01 1989-04-07 Fujitsu Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPH0726852Y2 (en) 1995-06-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees