JPH0339867U - - Google Patents
Info
- Publication number
- JPH0339867U JPH0339867U JP10067689U JP10067689U JPH0339867U JP H0339867 U JPH0339867 U JP H0339867U JP 10067689 U JP10067689 U JP 10067689U JP 10067689 U JP10067689 U JP 10067689U JP H0339867 U JPH0339867 U JP H0339867U
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor laser
- laser module
- ribbon
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000005219 brazing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000013307 optical fiber Substances 0.000 description 1
Description
第１図は本考案の第１実施例による内部結線構
成を示す斜視図である。第２図は本考案の第２の
実施例による内部結線構成を示す斜視図である。
第３図は本考案の第３の実施例による内部結線方
式を示す斜視図である。第４図ａ，ｂは従来の半
導体レーザモジユールの構造を示す平面図および
縦断面図である。第５図は従来の半導体レーザモ
ジユールの内部結線の様子を示す斜視図である。
１……半導体レーザ、２……ヒートシンク、３
……チツプキヤリア、４……ベース、５……フオ
トダイオード、６……サーミスタ、７……レンズ
、８……スライドリング、９……フエルール、１
０……ペルチエ素子、１１……ケース、１２……
ボンデイグパツド、１３……ワイヤ細線、２０…
…光フアイバ、２１……ワイヤ細線、２２……端
子、２３……リボン状リード、２３′……リボン
状リード、４′……ベースの座ぐり、１１′……
ケース側壁、１１″……ケース側壁張出部。
FIG. 1 is a perspective view showing an internal wiring configuration according to a first embodiment of the present invention. FIG. 2 is a perspective view showing an internal wiring configuration according to a second embodiment of the present invention.
FIG. 3 is a perspective view showing an internal wiring system according to a third embodiment of the present invention. FIGS. 4a and 4b are a plan view and a longitudinal sectional view showing the structure of a conventional semiconductor laser module. FIG. 5 is a perspective view showing the internal wiring of a conventional semiconductor laser module. 1... Semiconductor laser, 2... Heat sink, 3
... Chip carrier, 4 ... Base, 5 ... Photo diode, 6 ... Thermistor, 7 ... Lens, 8 ... Slide ring, 9 ... Ferrule, 1
0... Peltier element, 11... Case, 12...
Bonding pad, 13...Wire thin wire, 20...
...Optical fiber, 21... Thin wire, 22... Terminal, 23... Ribbon-shaped lead, 23'... Ribbon-shaped lead, 4'... Base counterbore, 11'...
Case side wall, 11″...Case side wall protrusion.
Claims (1)
ユールにおいて、前記半導体レーザを搭載するベ
ースがペルチエ素子上にマンウトされ、前記ベー
スと前記半導体レーザモジユールのケースまたは
ケースに接地された端子がリボン状リードで結線
され、かつ前記ベース上に設けられたボンデイン
グパツドと前記ケースの信号入力端子がリボン状
リードで結線されていることを特徴とする半導体
レーザモジユール。 (2) 前記ベースと前記リボン状リードの接続部
において、前記ベース上に前記ベースの端部にか
かる座ぐりが設けられ、前記座ぐり内部に前記リ
ボン状リードの先端が装着されてロウ材により融
着固定されていることを特徴とする請求項(1)記
載の半導体レーザモジユール。 (3) 前記ケースの側壁の内側に前記ベースの近
傍に接近するような張出部が設けられ、前記ベー
スと前記張出部および、前記ベース上のボンデイ
ングパツドと前記ケースの端子が前記リボン状リ
ードにより結線されていることを特徴とする登録
請求項(1)記載の半導体レーザモジユール。[Claims for Utility Model Registration] (1) In a semiconductor laser module incorporating a Peltier element, a base on which the semiconductor laser is mounted is mounted on the Peltier element, and a case or case of the base and the semiconductor laser module is provided. A semiconductor laser module characterized in that a grounded terminal is connected with a ribbon-shaped lead, and a bonding pad provided on the base and a signal input terminal of the case are connected with a ribbon-shaped lead. (2) At the connection portion between the base and the ribbon-shaped lead, a counterbore is provided on the base to cover the end of the base, and the tip of the ribbon-shaped lead is mounted inside the counterbore, and the tip of the ribbon-shaped lead is fitted with a brazing material. 2. The semiconductor laser module according to claim 1, wherein the semiconductor laser module is fused and fixed. (3) A projecting portion is provided on the inside of the side wall of the case so as to approach the vicinity of the base, and the base, the projecting portion, the bonding pad on the base, and the terminal of the case are connected to the ribbon. The semiconductor laser module according to claim (1), characterized in that the semiconductor laser module is connected by shaped leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10067689U JPH0339867U (en) | 1989-08-28 | 1989-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10067689U JPH0339867U (en) | 1989-08-28 | 1989-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339867U true JPH0339867U (en) | 1991-04-17 |
Family
ID=31649669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10067689U Pending JPH0339867U (en) | 1989-08-28 | 1989-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339867U (en) |
-
1989
- 1989-08-28 JP JP10067689U patent/JPH0339867U/ja active Pending
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