JPH0340508B2 - - Google Patents

Info

Publication number
JPH0340508B2
JPH0340508B2 JP61212736A JP21273686A JPH0340508B2 JP H0340508 B2 JPH0340508 B2 JP H0340508B2 JP 61212736 A JP61212736 A JP 61212736A JP 21273686 A JP21273686 A JP 21273686A JP H0340508 B2 JPH0340508 B2 JP H0340508B2
Authority
JP
Japan
Prior art keywords
glass
electrode body
printed wiring
wiring board
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61212736A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6370449A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP61212736A priority Critical patent/JPS6370449A/ja
Publication of JPS6370449A publication Critical patent/JPS6370449A/ja
Publication of JPH0340508B2 publication Critical patent/JPH0340508B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP61212736A 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ Granted JPS6370449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61212736A JPS6370449A (ja) 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61212736A JPS6370449A (ja) 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6370449A JPS6370449A (ja) 1988-03-30
JPH0340508B2 true JPH0340508B2 (2) 1991-06-19

Family

ID=16627581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61212736A Granted JPS6370449A (ja) 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6370449A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4731232B2 (ja) * 2005-07-22 2011-07-20 パナソニック株式会社 電子素子用の表面実装ベース

Also Published As

Publication number Publication date
JPS6370449A (ja) 1988-03-30

Similar Documents

Publication Publication Date Title
US4839713A (en) Package structure for semiconductor device
EP0623241B1 (en) Semiconductor device with terminal lead
JP3836010B2 (ja) 半導体装置
JPH0340508B2 (2)
JPH0334861B2 (2)
JP2002359336A (ja) 半導体装置
JP2782640B2 (ja) 半導体装置の内部接続構造
JPH09191058A (ja) 表面実装型容器
US20040021219A1 (en) Method of mounting integrated circuit die in a package using a solder preform having isolatable portions
JPS62158348A (ja) リ−ドレスパツケ−ジ
JP2705281B2 (ja) 半導体装置の実装構造
JPH0739222Y2 (ja) 表面実装型電子部品
JPS61214548A (ja) テ−プキヤリア
JPH05291739A (ja) 接続用端子及びこれを用いた装置の接続方法
JPH11340373A (ja) 薄小型樹脂封止パッケージ
JP2004140111A (ja) 配線基板
JP2540461B2 (ja) 電子部品用パッケ−ジのリ−ド取り付け構造
JP2853695B2 (ja) チップキャリア及び半導体集積回路装置
JPS63289848A (ja) 電子回路部品用パッケ−ジ
JPH06326153A (ja) チップデバイス
JPS6030118A (ja) 電解コンデンサ
JP2004200416A (ja) 配線基板
JPH08264705A (ja) 半導体装置及びそれを用いた実装構造及び実装方法
JPH0745656A (ja) 半導体装置
JP2004039811A (ja) 配線基板