JPH0344917A - Resist coating spinner - Google Patents

Abstract

PURPOSE:To coat a square substrate with resist in a uniform thickness by engaging the substrate with a recess of a spinner head having a circular end face having a diameter larger than that of the substrate, evacuating it in vacuum, then coating it with the resist and rotating it. CONSTITUTION:A substrate 12 is engaged with a recess 14 of a spinner head 11 having a circular end face having a diameter larger than the diagonal line of a square substrate 12, the air in a groove 15 for sucking in vacuum is sucked to a vacuum. Here, since the depth of the recess 14 is formed in the same as the thickness of the substrate 12, the upper surface of the substrate 12 becomes in the same plane as the end face 13 of the head 11 to form a circular plane. Then, when the substrate 12 is coated with resist and the head 11 is rotated by a rotational shaft 17, it is coated with the resist in uniform thickness on the circular surface by a centrifugal force. The substrate 12 is removed from the recess 14 to obtain the substrate coated with the resist in a uniform thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a resist coating spinner used for spinner coating resist on a rectangular substrate.

<Prior Art> Conventionally, when a resist is spin-coated onto a rectangular substrate using a resist-coating spinner, it is carried out as shown in FIG. That is, as shown in FIG. 3(a), a rectangular substrate 1 is attached to a cylindrical spinner head 2.
The substrate l is placed on the circular end face 3 of the spinner head 2, air is removed from the vacuum suction groove 4, and the substrate l is vacuum suctioned and fixed to the spinner head 2. Then the board! A resist 5 is applied on top and the resist 5 is applied as shown in Fig. 3(b).
) Rotate the spinner head 2 as shown in (). Then, the resist 5 applied to the center of the substrate 1 is stretched toward the outer circumference on the surface of the substrate 1 by the centrifugal force caused by the rotation of the spinner head 2, and is thinly applied onto the substrate 1.

<Problems to be Solved by the Invention> However, when applying the resist to the rectangular substrate 1 using the conventional resist applying spinner, the diameter of the spinner head 2 is the length of each short side of the rectangular substrate I. If the length is shorter than the length of the spinner head 2, the outer peripheral end of the substrate l protrudes outward from the side surface of the spinner head 2. In this case, as shown in Fig. 4, in the case of a rectangular substrate 1, there are parts with different rotation radii at the outer peripheral edge, so the part with the maximum rotation radius a (the diagonal line part) and the part with the minimum rotation radius A (the long part) There is a problem in that the thickness of the applied resist 4 differs between the lines connecting the centers of the sides. Moreover, board 1
Due to the rotation, the thickness of the lenost 4 at the adjacent corners A and H also differs. Resist like this 4
The non-uniformity in the thickness of the resist 4 greatly affects the subsequent exposure and development process, and the non-uniformity in the thickness of the resist 4 causes non-uniformity in resist resolution.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a resist coating spinner that can obtain a uniform Renost film thickness by spinner coating even on a rectangular substrate.

<Means for Solving the Problems> In order to achieve the above object, the present invention provides a resist coating spinner used when applying resist to a rectangular substrate using a spinner, the resist coating spinner having a length longer than the diagonal of the substrate. a spinner head having a circular end face of a diameter; a rectangular recess provided at the center of the circular end face of the spinner head, having the same dimensions as the substrate and the same depth as the thickness of the substrate; The present invention is characterized in that it includes a vacuum suction groove, a part of which is communicated with a vacuum device and is provided on the bottom surface of the recess for vacuum suction of the substrate fitted into the recess onto the bottom surface of the recess.

<Operation> A rectangular substrate is fitted into a rectangular recess provided in the circular end face of the spinner head, which has a diameter longer than the diagonal length of the rectangular substrate, and the vacuum suction groove provided in the bottom of the recess is A vacuum device that is partially connected is driven.

Then, the inside of the vacuum suction groove becomes vacuum, and the substrate is vacuum suctioned to the bottom surface of the recess.

At this time, the dimensions of the recess are the same as those of the rectangular substrate, and the depth of the recess is the same as the thickness of the substrate, so the surface of the substrate vacuum-adsorbed into the recess is integrated with the circular end surface of the spinner head. and form one circular plane. Then, it is as if a circular substrate of the same size as the end surface of the spinner head was set on the end surface of the spinner head.

Therefore, when a resist is applied using a spinner onto a rectangular substrate that is integrated with the circular end face of the spinner head to form one circular plane, the resist is applied to a uniform thickness on the circular plane. .

<Example> Hereinafter, the present invention will be explained in detail with reference to illustrated embodiments.

This invention takes advantage of the fact that when a resist is applied to a circular substrate using a spinner, a nearly uniform Renost film thickness can be obtained within the surface of the substrate. It's something you get. When applying resist to a circular substrate using a spinner, the outer edge of the substrate is at the same distance from the center of rotation, and the substrate is spread evenly in a concentric circle, so the resist becomes uniform in thickness due to centrifugal force. It is thought that this is applied.

FIG. 1 is a schematic perspective view of a resist coating spinner of the present invention. The spinner head 11 is disk-shaped and has a diameter equal to or longer than the length of the diagonal of the rectangular substrate 12. A recessed portion 4 having the same dimensions as the substrate 12 and the same depth as the thickness of the substrate 12 is provided at the center of the circular end surface 13 on one side of the spinner head 11 . A cross-shaped vacuum suction groove 15 is provided along the diagonal of this rectangular recess 14, and an air suction hole 16 is provided in the center of this vacuum suction groove 15. This hole 16 is located in the spinner head 1.
It communicates with a vacuum device such as a vacuum pump (not shown) through a rotating shaft 17 provided at the center of rotation on the other side of the rotating shaft 1 .

A rectangular substrate 12 is fitted into the recess 14 of the spinner head 11 of the resist coating spinner configured as described above. And 115 for vacuum suction by vacuum device.
The substrate 12 is vacuum-adsorbed into the recess 14 by suctioning the air inside. By doing this, the upper surface of the substrate 12 vacuum-adsorbed in the recess 14 is aligned with the circular end surface 1 of the spinner head 11.
3 and form a circular plane. In other words, it is made to appear as if a circular substrate of the same size as the diameter of the spinner head is attached to the spinner head.

In this way, a resist is applied onto the substrate 12 vacuum-adsorbed in the recess 14 of the spinner head 11, and the spinner head 11 is rotated via the rotating shaft 17 as described above.

Then, the resist coated on the substrate 12 is moved onto the substrate 12 by the centrifugal force caused by the rotation of the spinner head 11.
It is stretched out toward the outer periphery on the surface of the substrate I2, and is applied thinly onto the substrate I2.

In that case, as described above, the recess 1 of the spinner head 11
The upper surface of the rectangular substrate 12 fitted into the spinner head 11 forms one circular plane together with the circular end surface i3 of the spinner head 11. In other words, it can be considered that a large circular substrate is set on the spinner head. Therefore, the resist is applied to a uniform thickness on the circular plane by centrifugal force.

In this way, after applying the resist to a uniform film thickness on the circular plane formed by the circular end surface 13 of the spinner head 11 and the upper surface of the substrate 12, the resist is coated with a uniform thickness by taking the substrate 12 out of the recess 14. It is possible to obtain a rectangular substrate coated with

At this time, as shown in FIG. 2, it is very convenient to take out the substrate if a WIt 18 for inserting a bin set is provided on the 13° circular end face of the spinner head LBI. The depth of this groove 18 is set deeper than the depth of the recess 14',
It extends from the outer peripheral end of the spinner head 11' toward the recess 14' to the inside of the edge of the recess 14'. By doing so, after the resist application is completed as described above, the tip of the bottle set can be inserted into the groove I4, the edge of the substrate can be pinched, and the substrate can be easily taken out.

Next, the influence of the depth and dimensions of the upper recess 14 will be described. Using a substrate with a thickness of 0.5 mm, spinner coating was performed using three types of resist coating spinners, each having a depth of 0.3 mm, 0.4 mm, and 0.5 mm in the concave portion (4) of the spinner head 11. As a result, depth 0
, 3 mm, and 0.4 mm, there is no difference in the coating state of the resist, and in either case, the uniformity of the resist film thickness is the same as in the conventional example.

On the other hand, if the depth is 0.5 mm,
The film thickness showed good uniformity. This is because the depth of the recess 14 is the same as the thickness of the substrate 12 when the substrate 12 is set in the spinner head II.
This is considered to be because the circular end surface 13 of the substrate I2 and the upper surface of the substrate I2 are integrated to form a flat surface. Therefore, it can be said that the optimum size of the recess 14 is exactly the same as the size of the substrate 12 so that the surface is flat.

As a specific example in this embodiment, a spinner head 11 with diameter: 60 mm, size of recess 14: 20 x 40 mm2, and depth of recess 14: 0.5 mm is used, and a substrate with size: 20 x 40 mm'' and thickness: 0.5 mm is used in the recess 14. When the resist was applied in the manner described above, a good resist thickness could be obtained.

As described above, the resist coating spinner of this embodiment includes the spinner head 11 having the circular end surface 13 having a diameter larger than the diagonal length of the rectangular substrate 12.
A recess 14 having the same dimensions as the rectangular substrate 12 and the same depth as the thickness of the substrate I2 is provided at the center of the circular end surface 13, and a cross-shaped vacuum suction groove I5 is provided at the bottom of the recess 14. ing. That is, when the rectangular substrate 12 is vacuum-adsorbed into the rectangular recess 14, the upper surface of the substrate 12 and the circular end surface 13 of the spinner head 1.1 come together to form one circular plane. therefore,
By applying a resist onto this circular plane using a spinner, a uniform resist film thickness can be obtained, and a resist film having a uniform thickness can be applied onto the surface of a rectangular substrate using a spinner.

In the above embodiment, a cross-shaped vacuum suction groove 15 is provided along the diagonal line of the bottom surface of the rectangular recess 14;
This invention is not limited to this. In short, it is only necessary that the vacuum suction groove 15 is arranged so that the substrate 2 is reliably suctioned over the entire bottom surface of the recess 14.

<Effects of the Invention> As is clear from the above, the spinner for resist coating of the present invention has a spinner head having a circular end surface with a diameter larger than that of a rectangular substrate, and a spinner head having a circular end surface having a diameter larger than that of a rectangular substrate, and a spinner head having a spinner head having a circular end surface having a diameter larger than that of a rectangular substrate. a rectangular recess with dimensions;
A vacuum suction groove is provided at the bottom of the recess so that the surface of the rectangular substrate fitted into the recess and vacuum suction forms one circular plane with the surface of the spinner head. Therefore, if this resist coating spinner is used, a uniform resist film thickness can be obtained by spinner coating even on a rectangular substrate.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view of an embodiment of the resist coating spinner of the present invention, FIG. 2 is a perspective view of a spinner head of a different embodiment from FIG. 1, and FIG. 3 is a conventional resist coating spinner head. FIG. 4 is an explanatory diagram of the non-uniformity of the resist thickness in a conventional example. 11... Spinner head, 12... Substrate,
13...Circular end face, 14...Concave portion, 15...Vacuum suction groove, 17...Rotating shaft.

Claims (1)

[Claims] (1) A resist coating spinner used when applying resist to a rectangular substrate using a spinner, the spinner head having a circular end face having a diameter longer than the length of a diagonal line of the substrate; and the circular end face of the spinner head. a rectangular recess provided in the center of the substrate, having the same dimensions as the substrate and the same depth as the thickness of the substrate; A resist coating spinner comprising a vacuum suction groove for vacuum suctioning the substrate fitted into the recess onto the bottom surface of the recess.