JPH0359637U - - Google Patents
Info
- Publication number
- JPH0359637U JPH0359637U JP11981089U JP11981089U JPH0359637U JP H0359637 U JPH0359637 U JP H0359637U JP 11981089 U JP11981089 U JP 11981089U JP 11981089 U JP11981089 U JP 11981089U JP H0359637 U JPH0359637 U JP H0359637U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- measurement
- chip
- metal stage
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例を示す電気特性測定
装置の断面図、第２図は従来の半導体チツプの電
気特性測定装置の要部断面図である。
１……リング状のテープ吸着用ノズル、２……
測定用金属ステージ、３……電子冷却機能素子、
４……突き上げ針、５……測定用端子、６……ブ
ローノズル、７……半導体チツプ、８……ウエハ
分割用粘着テープ。
FIG. 1 is a sectional view of an electrical property measuring device showing an embodiment of the present invention, and FIG. 2 is a sectional view of a main part of a conventional semiconductor chip electrical property measuring device. 1... Ring-shaped tape suction nozzle, 2...
Metal stage for measurement, 3...electronic cooling functional element,
4... Push-up needle, 5... Measuring terminal, 6... Blow nozzle, 7... Semiconductor chip, 8... Adhesive tape for wafer division.
Claims (1)
辺を該テープの裏面から個々に吸着して固定する
リング状のテープ吸着ノズルと、前記リング状の
テープ吸着ノズルの中心位置に配置される半導体
チツプの特性測定用金属ステージと、前記測定用
金属ステージの裏面に密着して設けられる電子冷
却機能素子と、前記測定用金属ステージと電子冷
却機能素子の中心部を貫通する突き上げ針とから
成る半導体チツプの固定冷却機構と、前記ウエハ
分割用粘着テープの半導体チツプ貼付面側に配設
されるチツプ特性測定端子およびチツプ表面結露
防止用のブローノズルとから成る半導体チツプの
電気特性測定機構とを含むことを特徴とする半導
体チツプの電気特性測定装置。 Characteristics of a ring-shaped tape suction nozzle that individually suctions and fixes the periphery of semiconductor chips on a wafer dividing adhesive tape from the back side of the tape, and a semiconductor chip placed at the center of the ring-shaped tape suction nozzle. Fixing of a semiconductor chip consisting of a metal stage for measurement, an electronic cooling function element provided in close contact with the back surface of the metal stage for measurement, and a push-up needle penetrating the center of the metal stage for measurement and the electronic cooling function element. It is characterized by comprising a cooling mechanism, and a semiconductor chip electrical characteristic measuring mechanism comprising a chip characteristic measuring terminal disposed on the semiconductor chip sticking side of the wafer dividing adhesive tape and a blow nozzle for preventing dew condensation on the chip surface. A device for measuring the electrical characteristics of semiconductor chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11981089U JPH0359637U (en) | 1989-10-13 | 1989-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11981089U JPH0359637U (en) | 1989-10-13 | 1989-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359637U true JPH0359637U (en) | 1991-06-12 |
Family
ID=31667908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11981089U Pending JPH0359637U (en) | 1989-10-13 | 1989-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359637U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006209762A (en) * | 2005-01-24 | 2006-08-10 | Thomson Licensing | Presence-based access control |
-
1989
- 1989-10-13 JP JP11981089U patent/JPH0359637U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006209762A (en) * | 2005-01-24 | 2006-08-10 | Thomson Licensing | Presence-based access control |
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