JPH0361342U - - Google Patents

Info

Publication number
JPH0361342U
JPH0361342U JP12274889U JP12274889U JPH0361342U JP H0361342 U JPH0361342 U JP H0361342U JP 12274889 U JP12274889 U JP 12274889U JP 12274889 U JP12274889 U JP 12274889U JP H0361342 U JPH0361342 U JP H0361342U
Authority
JP
Japan
Prior art keywords
polycrystalline silicon
silicon wiring
semiconductor substrate
connection structure
diffusion region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12274889U
Other languages
English (en)
Other versions
JP2556672Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12274889U priority Critical patent/JP2556672Y2/ja
Publication of JPH0361342U publication Critical patent/JPH0361342U/ja
Application granted granted Critical
Publication of JP2556672Y2 publication Critical patent/JP2556672Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体装置の接続構造を示す
断面図、第２図は従来の半導体装置の接続構造を
示す平面図、第３図乃至第５図は、第２図のＸ−
Ｙ線断面図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 一導電型の半導体基板の一主面上に設けら
    れた多結晶シリコン配線と、 上記半導体基板の一主面に上記多結晶シリコン配
    線と交差して埋設され信号の入出力線となる逆導
    電型の拡散領域とを備え、上記多結晶シリコン配
    線と上記拡散領域とが交差部で接続されてなる半
    導体装置の接続構造に於いて、 上記半導体基板は、上記多結晶シリコン配線の端
    部に沿つて上記拡散領域に達する溝部を有し、 上記多結晶シリコン配線上から上記半導体基板の
    溝部内に亘る高融点金属膜を上記交差部に選択的
    に被着したことを特徴とする半導体装置の接続構
    造。 (2) 上記高融点金属膜はタングステンを主成分
    とすることを特徴とする請求項第１項記載の半導
    体装置の接続構造。
JP12274889U 1989-10-19 1989-10-19 半導体装置の接続構造 Expired - Fee Related JP2556672Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12274889U JP2556672Y2 (ja) 1989-10-19 1989-10-19 半導体装置の接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12274889U JP2556672Y2 (ja) 1989-10-19 1989-10-19 半導体装置の接続構造

Publications (2)

Publication Number Publication Date
JPH0361342U true JPH0361342U (ja) 1991-06-17
JP2556672Y2 JP2556672Y2 (ja) 1997-12-08

Family

ID=31670741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12274889U Expired - Fee Related JP2556672Y2 (ja) 1989-10-19 1989-10-19 半導体装置の接続構造

Country Status (1)

Country Link
JP (1) JP2556672Y2 (ja)

Also Published As

Publication number Publication date
JP2556672Y2 (ja) 1997-12-08

Similar Documents

Publication Publication Date Title
JPH0361342U (ja)
JPS60125726U (ja) 化合物半導体ミラ−ウエハ
JPS5858361U (ja) 半導体装置
JPH031548U (ja)
JPH0233457U (ja)
JPS6183328U (ja)
JPS6411557U (ja)
JPS62170638U (ja)
JPS58158455U (ja) 半導体装置
JPS63119246U (ja)
JPH02116739U (ja)
JPH0455143U (ja)
JPH0231154U (ja)
JPH02146850U (ja)
JPS6278747U (ja)
JPH01112060U (ja)
JPS6379639U (ja)
JPH0339841U (ja)
JPS60125747U (ja) コンデンサ
JPS62104445U (ja)
JPS61102039U (ja)
JPH01169041U (ja)
JPH0184452U (ja)
JPS59208857A (ja) 半導体装置
JPS6390855U (ja)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees