JPH0361353B2 - - Google Patents

Info

Publication number: JPH0361353B2
Authority: JP; Japan
Prior art keywords: paste; substrate; circuit; bonding; powder
Prior art date: 1986-09-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP23280586A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6387791A (ja

Inventor

Takashi Shoji

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Holdings Corp

Original Assignee

Showa Denko KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-09-30

Filing date

1986-09-30

Publication date

1991-09-19

1986-09-30 Application filed by Showa Denko KK filed Critical Showa Denko KK

1986-09-30 Priority to JP23280586A priority Critical patent/JPS6387791A/ja

1988-04-19 Publication of JPS6387791A publication Critical patent/JPS6387791A/ja

1991-09-19 Publication of JPH0361353B2 publication Critical patent/JPH0361353B2/ja

Status Granted legal-status Critical Current

Links

239000000758 substrate Substances 0.000 claims description 30
238000000034 method Methods 0.000 claims description 22
229910052802 copper Inorganic materials 0.000 claims description 21
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 19
239000000843 powder Substances 0.000 claims description 18
239000000853 adhesive Substances 0.000 claims description 17
230000001070 adhesive effect Effects 0.000 claims description 17
238000004519 manufacturing process Methods 0.000 claims description 14
238000010438 heat treatment Methods 0.000 claims description 12
239000012298 atmosphere Substances 0.000 claims description 8
239000002131 composite material Substances 0.000 claims description 6
239000002245 particle Substances 0.000 claims description 5
229910052709 silver Inorganic materials 0.000 claims description 4
238000005551 mechanical alloying Methods 0.000 claims description 3
229910052758 niobium Inorganic materials 0.000 claims description 3
229910052719 titanium Inorganic materials 0.000 claims description 3
230000015572 biosynthetic process Effects 0.000 claims description 2
238000007650 screen-printing Methods 0.000 claims description 2
229910052726 zirconium Inorganic materials 0.000 claims description 2
239000010949 copper Substances 0.000 description 25
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
239000010410 layer Substances 0.000 description 16
238000007747 plating Methods 0.000 description 12
229910000679 solder Inorganic materials 0.000 description 11
238000005476 soldering Methods 0.000 description 9
229910052751 metal Inorganic materials 0.000 description 8
239000002184 metal Substances 0.000 description 8
239000012790 adhesive layer Substances 0.000 description 7
239000000203 mixture Substances 0.000 description 5
238000007639 printing Methods 0.000 description 5
238000005238 degreasing Methods 0.000 description 4
238000010304 firing Methods 0.000 description 4
230000017525 heat dissipation Effects 0.000 description 4
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
239000000919 ceramic Substances 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
239000004519 grease Substances 0.000 description 3
239000003960 organic solvent Substances 0.000 description 3
DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 2
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
239000001856 Ethyl cellulose Substances 0.000 description 2
ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
229910010413 TiO 2 Inorganic materials 0.000 description 2
239000011230 binding agent Substances 0.000 description 2
239000004020 conductor Substances 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000001035 drying Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
229920001249 ethyl cellulose Polymers 0.000 description 2
235000019325 ethyl cellulose Nutrition 0.000 description 2
239000001257 hydrogen Substances 0.000 description 2
229910052739 hydrogen Inorganic materials 0.000 description 2
229910052750 molybdenum Inorganic materials 0.000 description 2
239000010970 precious metal Substances 0.000 description 2
230000035939 shock Effects 0.000 description 2
239000000126 substance Substances 0.000 description 2
229910052721 tungsten Inorganic materials 0.000 description 2
OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
229910017309 Mo—Mn Inorganic materials 0.000 description 1
KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
239000012190 activator Substances 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
238000002788 crimping Methods 0.000 description 1
230000018044 dehydration Effects 0.000 description 1
238000006297 dehydration reaction Methods 0.000 description 1
SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
239000002270 dispersing agent Substances 0.000 description 1
239000000839 emulsion Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
239000011256 inorganic filler Substances 0.000 description 1
229910003475 inorganic filler Inorganic materials 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
229910000510 noble metal Inorganic materials 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
238000010298 pulverizing process Methods 0.000 description 1
230000005855 radiation Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
238000003756 stirring Methods 0.000 description 1
239000002344 surface layer Substances 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
229940116411 terpineol Drugs 0.000 description 1
KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
238000003466 welding Methods 0.000 description 1

Landscapes

Parts Printed On Printed Circuit Boards (AREA)
Insulated Metal Substrates For Printed Circuits (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Manufacturing Of Printed Wiring (AREA)
Conductive Materials (AREA)

JP23280586A 1986-09-30 1986-09-30 高放熱性回路基板の製造方法 Granted JPS6387791A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP23280586A JPS6387791A (ja)	1986-09-30	1986-09-30	高放熱性回路基板の製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP23280586A JPS6387791A (ja)	1986-09-30	1986-09-30	高放熱性回路基板の製造方法

Publications (2)

Publication Number	Publication Date
JPS6387791A JPS6387791A (ja)	1988-04-19
JPH0361353B2 true JPH0361353B2 (fr)	1991-09-19

Family

ID=16945043

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP23280586A Granted JPS6387791A (ja)	1986-09-30	1986-09-30	高放熱性回路基板の製造方法

Country Status (1)

Country	Link
JP (1)	JPS6387791A (fr)

1986
- 1986-09-30 JP JP23280586A patent/JPS6387791A/ja active Granted

Also Published As

Publication number	Publication date
JPS6387791A (ja)	1988-04-19

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