JPH0361392U - - Google Patents
Info
- Publication number
- JPH0361392U JPH0361392U JP12146789U JP12146789U JPH0361392U JP H0361392 U JPH0361392 U JP H0361392U JP 12146789 U JP12146789 U JP 12146789U JP 12146789 U JP12146789 U JP 12146789U JP H0361392 U JPH0361392 U JP H0361392U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- cover
- shield coating
- conductive layer
- outer insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係るシールド被覆
付印刷配線板を示す斜視図、第２図ａ，ｂ，ｃは
各々第１図Ａ−Ａ，Ｂ−Ｂ，Ｃ−Ｃ線に沿う拡大
断面図である。
１……基板、２……パターン、３……ランド部
、４……内部絶縁層、５……シールド被覆、７…
…外部絶縁層、８……シルク印刷。
Fig. 1 is a perspective view showing a printed wiring board with a shield coating according to an embodiment of the present invention, and Fig. 2 a, b, and c are taken along lines A-A, B-B, and C-C in Fig. 1, respectively. It is an enlarged sectional view. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Pattern, 3...Land portion, 4...Internal insulating layer, 5...Shield coating, 7...
...Outer insulation layer, 8...Silk printing.
Claims (1)
してなる印刷配線板において、上記導電層を覆つ
て形成した内部絶縁層と、該内部絶縁層上を覆つ
て形成したシールド被覆と、該シールド被覆を更
に覆つて形成した外部絶縁層と、該外部絶縁層上
に施した導電層のパターンと同一形状のシルク印
刷とを備えることを特徴とするシールド被覆付印
刷配線板。 A printed wiring board comprising a conductive layer having a predetermined pattern formed on a substrate, an internal insulating layer formed to cover the conductive layer, a shield coating formed to cover the internal insulating layer, and the shield coating. 1. A printed wiring board with a shield coating, comprising: an outer insulating layer formed to further cover the outer insulating layer; and a silk-screen print having the same shape as a pattern of a conductive layer applied on the outer insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12146789U JPH0361392U (en) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12146789U JPH0361392U (en) | 1989-10-17 | 1989-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361392U true JPH0361392U (en) | 1991-06-17 |
Family
ID=31669500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12146789U Pending JPH0361392U (en) | 1989-10-17 | 1989-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361392U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006299520A (en) * | 2005-04-15 | 2006-11-02 | Wako Engineering Corp | Common ditch lid opening and closing device |
-
1989
- 1989-10-17 JP JP12146789U patent/JPH0361392U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006299520A (en) * | 2005-04-15 | 2006-11-02 | Wako Engineering Corp | Common ditch lid opening and closing device |