JPH0361998B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket for a test device for a burn-in test carried out during the manufacturing process of an IC.

[Conventional technology and its problems]

Conventionally, various types of ICs have been manufactured, and there are burn-in and burn-in products suitable for each type.
IC sockets for testing are in practical use.

However, the burn-in process of an IC with a large number of bumps densely arranged on one surface, which is the subject of this application,
IC sockets for testing have not yet been put into practical use.

[Means for solving problems]

The present invention solves the above-mentioned problems and provides an IC socket for burn-in testing of ICs provided with a large number of bumps. An IC socket comprising a floating plate that can be mounted and pressed upward, and a cover plate that places an IC to be inspected on the floating plate with the IC to be inspected sandwiched between the floating plate and the floating plate. IC positioning means is provided, and when the cover plate is pressed, the plurality of bumps on the sandwiched IC are pressed and lowered to contact the tips of the respective spring probes via the floating plate. be.

Further, the tip of the spring probe is provided so as to be located in a through hole formed in the floating plate corresponding to the bump of the IC when the cover plate is not pressed.

[Effect]

If the IC is placed in a fixed position by the positioning means on the floating plate as described above, when the cover plate is pressed, the tip of the spring probe will come out of the through hole formed at the position corresponding to the bump of the IC. As it protrudes, all bumps are accurately aligned and contact the probe tip.

In addition, since the tip of the probe is retracted into the through hole when it is not pressed, it also has the effect of protecting the tip of the probe.

〔Example〕

FIG. 1 is a longitudinal sectional view of the IC socket of the present invention.
FIG. 2 is an enlarged sectional view of a portion of the floating plate in a raised state.

A plurality of spring probes 2 are vertically implanted in the main body 1 at predetermined positions so as to pass through the main body. There are 4
The horizontal direction is held by a book guide pin 3, and a floating plate 4 that is slidable in the vertical direction is provided, and is normally pressed against a stopper 3a at the upper end of the guide pin 3 by a spring 5. A through hole 4c is formed in the floating plate 4 at a position corresponding to the spring probe 2, and the tip of the probe is loosely fitted into the through hole. Further, a recess 4a having a shape matching the outer shape of the IC 6 placed thereon is provided on the upper surface of the floating plate 4 to provide a positioning function for the IC. This IC6 is placed above this IC6.
A cover plate 7 having a lower surface in close contact with the upper surface of the IC 6 is placed, the IC 6 is held between the cover plate 7 and the floating plate 4 by a pressing member 8, and the floating plate 4 is pressed in the direction of the main body 1. It is preferable that the cover plate 7 also serves as a heat sink. As shown in the second figure, since the IC 6 is provided with a bump 6a as a connection terminal, the upper open end of the through hole 4c of the floating plate 4 is provided with a recess 4b that engages with the bump 6a. hand,
At this portion, the tip of the spring probe 2 and the bump 6a come into contact. The spring probe 2 includes a receptacle 2-1, a probe 2-2 slidably held inside the receptacle 2-1, and a spring 2 pushing the probe 2-2 upward.
-3, and the tip of the probe 2-2 is pressed by a built-in spring 2-3 so that the tip and the bump 6a come into contact with a constant pressing force.

〔Effect of the invention〕

As described above, according to the present invention, the IC can be aligned by simply inserting the IC into the recess on the top surface of the floating plate with the bumps facing downward, and the IC can be aligned using the cover plate.
If you push in the spring probe, all the bumps will come into contact with the spring probe, and the cover plate itself will function as a heat sink, so the IC will not be damaged due to overheating.
and damage can be prevented.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of the IC socket of the present invention, and FIG. 2 is an enlarged sectional view of a portion of the IC socket with the floating plate raised. 1...Main body, 2...Spring probe, 3...
...Guide pin, 4...Floating plate,
4a... recess (positioning means), 4c... through hole,
6...IC, 6a...bump, 7...cover plate,
8... Pressing member.

Claims (1)

[Claims] 1. A main body provided with a plurality of spring probes;
A floating plate that is mounted on this main body so as to be able to move up and down and is pressed upward, and an IC to be inspected on this floating plate.
In the IC socket, the floating plate is provided with means for positioning the IC, and when the cover plate is pressed, the
An IC socket characterized in that the bumps of the IC come into contact with the tips of the corresponding spring probes via the floating plate that is pressed and lowered. 2. A main body equipped with a plurality of spring probes,
A floating plate that is mounted on this main body so as to be able to move up and down and is pressed upward, and an IC to be inspected on this floating plate.
In an IC socket equipped with a cover plate that is placed across the IC socket, when the cover plate is not pressed, the tip of the spring probe is inserted into the through hole formed in the floating plate corresponding to the bump of the IC. An IC socket characterized by being provided so as to be located at.