JPH0362608A - Adhering method for element to stem for surface acoustic wave element - Google Patents

Abstract

PURPOSE:To attain ease of positioning and to prevent an adhesives from overflowing from the surrounding of a surface acoustic wave element when the surface acoustic wave element is adhered to a stem main body by providing plural positioning holes to the surface of the stem main body. CONSTITUTION:In the case of adhering a surface acoustic wave element 5 onto a stem main body 1 for a surface acoustic wave element, at first deciding the adhering position of the element 5 by using two positioning holes 8 formed to an element adhesive section 7, an adhesives 9 is packed to each hole 8. In such a case, the adhesives 9 is packed to be swollen to the lower part 80 in the two stages provided to each hole 8. Then the element 5 is placed to prescribed position to adhere the element 5 to the stem. In this case, the adhesives 9 does not overflow on the surface of the main body 1 but stays at the upper part 81 of the hole 8. That is >=2 holes 8 are provided to the surface of the main body 1 and each hole 8 is formed to be a concentric step, then the adhesion position of the element 5 is easily decided and the adhesives does not overflow from the surrounding of the element 5 and the element is adhered without tight limit of adhesives applying quantity.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching an element to a stem for a surface acoustic wave element, and more specifically, a method for drilling a positioning hole in the adhesive surface of the stem for a surface acoustic wave element. However, it is an attempt to simplify the work when positioning an element using an optical sensor or the like.

Conventionally, as shown in FIG. 1, a stem for a surface acoustic wave element is provided with a nail pin insertion hole for inserting a nail pin 2 into a stem body 1 having an arbitrary shape such as a disc shape or a rectangular shape. A nail pin 2 is inserted into the stem body 1, and the stem body 1 is sealed with an insulating material 4 such as glass, and a surface acoustic wave element 5 is bonded to a predetermined position of the stem body 1 with an adhesive.

However, in such conventional stems for surface acoustic wave devices, the device adhesion surface is smooth and no positioning marks are formed, making it difficult to bond the surface acoustic wave device 5. Ta. Furthermore, the surface acoustic wave element 5 is attached to the stem body l using an adhesive, but as mentioned above, since the element adhesion surface is smooth, the solvent of the adhesive may spread around the element 5 during attachment. There were times when it overflowed.

Such overflow of the solvent 6 may impair the durability of the surface acoustic wave device stem and, by extension, the surface acoustic wave device, and may also adversely affect the characteristics of the surface acoustic wave device 5.

On the other hand, it is extremely difficult to control the amount of adhesive applied so that the solvent 6 does not overflow from the element 5.

The present invention has been made in view of the above-mentioned points, and it is possible to easily position the surface acoustic wave device when bonding it to the stem body for the surface acoustic wave device, and in addition, it prevents the adhesive from overflowing from around the surface acoustic wave device. The aim is to prevent this from happening, and its feature is that the element adhesion surface of the stem body has a stepped shape in which at least two sets of positioning holes are concentrically drilled for positioning the element. a step of filling the positioning hole of the surface acoustic wave element stem with an adhesive so that the lower part of the stepped shape is slightly raised; a step of scanning the positioning hole with a sensor to determine the bonding position of the element; The point is that it includes the process of pasting.

An embodiment of the present invention will be described based on the drawings.

FIG. 2 is a perspective view of an example of a stem for a surface acoustic wave device, and FIG. 3 is a cross-sectional view taken along line AA' in FIG. 2. In the figure, the same reference numerals as in FIG. show.

As is clear from this drawing, the stem for a surface acoustic wave device used in the present invention is provided with a crimping flange 10 at the peripheral edge of a rectangular stem body 1, and this crimping flange 10 has a crimping protrusion. 11 is formed by coining process.

A nail pin insertion hole 3 for inserting the nail pin 2 is formed in the upper part of the stem body 1, and the nail pin 2 is sealed in the insertion hole 3 with an insulating material 4.

An element adhesive part 7 for pasting the element 5 is provided below the nail pin insertion hole 3, and at least two positioning sixes 8 for positioning the element 5 are provided in the element adhesive part 7. It is set up.

As is clear from FIG. 3, the positioning 68 is formed concentrically in two stages. This positioning six 8 also serves as a mark for determining the adhesion position of the element 5 using an optical sensor or the like, so at least two sets are required, and preferably they are arranged regularly. .

According to the method for attaching an element to a stem for a surface acoustic wave element according to the present invention, when attaching the surface acoustic wave element 5 to the stem body l for a surface acoustic wave element, first, a After determining the element bonding position using the positioning device 68, the positioning device 8 is filled with adhesive 9.

The adhesive 9 is filled in the lower part 80 of the stepped hole so as to bulge (FIG. 4a), and then the element 5 is placed in a predetermined position and the element 5 is bonded to the stem. At this time, the adhesive 9 does not overflow onto the surface of the stem body 1, but remains in the upper part 81 of the positioning 68 (FIG. 4b).

As explained above, according to the method of attaching an element to a stem for a surface acoustic wave element of the present invention, two sets of positioning holes are provided on the surface of the stem body, and the holes are formed in a concentric stepped shape. Therefore, not only can the adhesion position of the surface acoustic wave element be easily determined, but also the positioning hole can be used to fill the hole with adhesive and adhere the element, which is extremely convenient. be.

Furthermore, since this positioning hole has a stepped shape, there is no need to worry about the adhesive overflowing into the stem body during bonding, so there is the advantage that devices can be bonded without having to strictly control the amount of adhesive applied. .

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional stem for a surface acoustic wave device, FIG. 2 is a perspective view of an embodiment of a stem for a surface acoustic wave device according to the present invention, and FIG. 3 is a line A-A in FIG. The cross-sectional view and FIG. 4 are explanatory diagrams for explaining the method of bonding an element to the stem for a surface acoustic wave element of the present invention. Engineering: Stem body, 2: Nail bin, 3: Nail pin insertion hole, 4: Insulating material, 5: Element, 8:
...Positioning hole, 9...Adhesive.

Claims (1)

[Claims] At least two or more positioning holes are concentrically drilled in a stepped shape for positioning the element on the element bonding surface of the stem body.The positioning holes of the stem for a surface acoustic wave element have a stepped shape. For a surface acoustic wave device, the method includes the steps of: filling the adhesive so as to slightly bulge the lower part of the surface acoustic wave device; scanning the positioning hole with a sensor to determine the bonding position of the device; and bonding the device. How to attach the element to the stem.