JPH0362716A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH0362716A JPH0362716A JP19879089A JP19879089A JPH0362716A JP H0362716 A JPH0362716 A JP H0362716A JP 19879089 A JP19879089 A JP 19879089A JP 19879089 A JP19879089 A JP 19879089A JP H0362716 A JPH0362716 A JP H0362716A
- Authority
- JP
- Japan
- Prior art keywords
- base
- cap
- electrode
- surface wave
- wave element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title abstract description 6
- 239000003990 capacitor Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000000605 extraction Methods 0.000 claims description 15
- 239000003989 dielectric material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract 1
- 241000195940 Bryophyta Species 0.000 description 4
- 235000011929 mousse Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 231100000735 select agent Toxicity 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面波デバイス、特に表面実装に対応可能な表
面波デバイスに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface wave device, and particularly to a surface wave device that is compatible with surface mounting.
従来、表面実装に対応可能な表面波デバイスとして、第
６図に示すように、平板状のベース５０上に予め引出電
極５１を形成しておき、このベース５０上に表面波素子
５２を接着固定し、表面波素子５２の電極５３とベース
５０の引出電極５１とをワイヤボンディングにて接続す
るとともに、ベース５０の表面に表面波素子５２を覆う
箱型のキャップ５４を接着固定することにより、表面波
素子５２の周囲を密封したものがある。この場合には、
ベース５０の裏面に引出電極５１を引き出すことにより
、表面実装に対応できる。Conventionally, as a surface wave device compatible with surface mounting, as shown in FIG. 6, an extraction electrode 51 is formed in advance on a flat base 50, and a surface wave element 52 is adhesively fixed on this base 50. The electrode 53 of the surface wave element 52 and the extraction electrode 51 of the base 50 are connected by wire bonding, and a box-shaped cap 54 covering the surface wave element 52 is adhesively fixed to the surface of the base 50. There is one in which the periphery of the wave element 52 is sealed. In this case,
By drawing out the lead electrode 51 on the back surface of the base 50, surface mounting can be supported.
ところが、上記表面波デバイスの場合には、キャップ５
４をベース５０」二の引出電極５１にも接着しなければ
ならないため、絶縁体であるキャップ５４と金属膜から
なる引出電極５１との接着性が悪く、気密封止が困難で
あるという問題があった。However, in the case of the above surface wave device, the cap 5
4 to the base 50'' and the second extraction electrode 51, there is a problem that the adhesion between the cap 54, which is an insulator, and the extraction electrode 51, which is made of a metal film, is poor and it is difficult to achieve an airtight seal. there were.
そこで、本発明の目的は、」二記の問題点を解消した表
面実装可能な表面波デバイスを提供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a surface-mountable surface wave device that solves the above two problems.
上記目的を達成するため、本発明は、表面波素子かムー
ス上に固定され、表面波素子の電極とムース上の引出電
極とが電気的に接続されるとともに、ムース上に表面波
素子を覆うキャップが封着される表面波デバイスにおい
て、上記ヘースが誘電体でｊｔ４威されるとともに、キ
ャップがベースと同一材料で構成され、表面波素子の電
極と接続されたヘース上面の引出電極はキャップ封着部
より内側に形成され、該引出電極をコンデンサ電極とす
るとともに、ヘース下面の上記コンデンサ電極と対向す
る部位にコンデンサ電極が形成されていることを特徴と
するものである。In order to achieve the above object, the present invention provides a method for fixing a surface wave element on a mousse, electrically connecting an electrode of the surface wave element and an extraction electrode on the mousse, and covering the surface wave element on the mousse. In a surface wave device to which a cap is sealed, the heath is sealed with a dielectric material, the cap is made of the same material as the base, and the extraction electrode on the top surface of the heath connected to the electrode of the surface wave element is sealed with the cap. The capacitor electrode is formed inside the attachment part, and the extraction electrode is a capacitor electrode, and the capacitor electrode is formed at a portion of the lower surface of the heath facing the capacitor electrode.
即ち、誘電体よりなるヘース上面のキャップ封着部より
内側に、表面波素子と接続される引出電極を形成し、こ
の引出電極をコンデンサ電極とし、このコンデンサ電極
と対向するヘース下面にもコンデンサ電極を設しすたの
で、表面波素子を静電容量を介して外部に交流的に接続
できる。これにより、コンデンザ内蔵型の表面波デバイ
スを得るごとができ、本表面波デバイスを発振回路に適
用した場合、外付けのＤ Ｃカット用コンデンザが不要
となり、回路を簡素化できる。また、キャップを引出電
極上ムこ接着する必要がなく、しかもキャップとヘース
とが同一材質よりなるので、気密封止を行うための接着
剤の選定が容易で、がっ温度変化による気密性の劣化を
防止できる。That is, an extraction electrode connected to the surface wave element is formed inside the cap sealing part on the upper surface of the heath made of dielectric material, and this extraction electrode is used as a capacitor electrode, and a capacitor electrode is also formed on the lower surface of the heath opposite to this capacitor electrode. , the surface wave element can be connected to the outside via capacitance in an alternating current manner. As a result, it is possible to obtain a surface wave device with a built-in capacitor, and when this surface wave device is applied to an oscillation circuit, an external DC cut capacitor is not required, and the circuit can be simplified. In addition, there is no need to glue the cap over the extraction electrode, and since the cap and the heath are made of the same material, it is easy to select an adhesive for airtight sealing, and the airtightness can be improved due to temperature changes. Deterioration can be prevented.
第１図〜第５図は本発明の一例である】ボート型の表面
波デバイスを示す。この表面波デバイスは、ヘースｌと
、表面波素子１０と、キャップ２ｏとで構成されている
。1 to 5 show a boat-type surface wave device, which is an example of the present invention. This surface wave device is composed of a headl, a surface wave element 10, and a cap 2o.
ヘース１は例えばアルくナセラミンク等の所望の誘電率
を有する平板で構成されており、その上面対称位置には
２個の方形のコンデンサ電極２゜３がスバ・ンクリング
、蒸Ｍ′！Ｊにて形成されている。The base 1 is composed of a flat plate having a desired dielectric constant, such as Al or Naceramink, and two rectangular capacitor electrodes 2゜3 are arranged symmetrically on the upper surface thereof. It is formed by J.
ヘース１の長辺側端面の対角位置には人、出力用端子電
極４，５が形成されており、これら端子型極４，５と導
通した方形のコンデンサ電極６，７がムース１下面の上
記コンデンサ電極２，３と対向した位置に形成されてい
る。そのため、コンデンサ電極２，６および３，７間に
は静電容量ＣＣ２（第４図参照）が構成される。Terminal electrodes 4 and 5 for output are formed at diagonal positions on the end face of the long side of the head 1, and rectangular capacitor electrodes 6 and 7 electrically connected to these terminal type poles 4 and 5 are formed on the bottom surface of the mousse 1. It is formed at a position facing the capacitor electrodes 2 and 3. Therefore, a capacitance CC2 (see FIG. 4) is formed between the capacitor electrodes 2, 6 and 3, 7.
表面波素子１０は公知の１ポート型ＳＡＷ素子であり、
第３図に示すように、ニオブ酸リチウム単結晶等の圧電
基板１１の上面両端部に電極パッド１２゜１３が形成さ
れ、これら電極パッド１２．１３は引回し電極１２ａ、
１３ａを介して対向方向へ突出した櫛歯電極１２ｂ、
１３ｂと接続されている。上記櫛歯電極１２ｂ１３ｂの
両側には反射電極１４が独立して形成されている。」二
記表面波素子１０は、その電極形成面を上に向けてヘー
ス１の中央部上面にグイボンドされている。そして、表
面波素子１０の電極パッド１２１３はそれぞれポンディ
ングワイヤ１５．１６によってヘース１のコンデンサ電
極２．３と接続されている。The surface wave element 10 is a known one-port SAW element,
As shown in FIG. 3, electrode pads 12, 13 are formed on both ends of the upper surface of a piezoelectric substrate 11 made of lithium niobate single crystal, etc., and these electrode pads 12, 13 are connected to the routing electrode 12a,
a comb-teeth electrode 12b protruding in the opposite direction via 13a;
13b. Reflective electrodes 14 are independently formed on both sides of the comb-teeth electrodes 12b13b. 2. The surface wave element 10 is bonded to the upper surface of the central portion of the head 1 with its electrode forming surface facing upward. The electrode pads 1213 of the surface wave element 10 are connected to the capacitor electrodes 2.3 of the heath 1 by bonding wires 15.16, respectively.
キャップ２０はヘースｌと全く同一材料によって一面が
開口した箱型に形成されたものであり、その開口部が上
記ヘース１の」二面のキャップ封着部８に、接着剤２１
によってコンデンサ電極２．３および表面波素子１０を
取り囲むように封着され、キャップ２０内部が密封され
ている。特に、キャップ２０とヘース１とが同−ｔｉＡ
料よりなるので、両者の接着性が良く、既存の接着剤２
１で簡単に気密封止できるとともに、温度変化ムこよっ
てヘース１とキャップ２０とが膨張した場合でも、両者
の線膨張係数が同しであるから、接着部にクランク等が
入らず、気密性が劣化しない。The cap 20 is made of the same material as the heath 1 and is formed into a box shape with an opening on one side.
The cap 20 is sealed so as to surround the capacitor electrode 2.3 and the surface acoustic wave element 10, and the inside of the cap 20 is sealed. In particular, the cap 20 and the head 1 are the same -tiA
Because it is made of adhesive, it has good adhesion between the two, and it can be used with existing adhesives 2.
1 can be easily hermetically sealed, and even if the heath 1 and cap 20 expand due to temperature changes, since the linear expansion coefficients of both are the same, cranks etc. will not get into the bonded part, ensuring airtightness. does not deteriorate.
上記のように構成することにより、第５図に示されるよ
うな等価回路を有するコンデンサ内蔵型表面波デバイス
が得られる。By configuring as described above, a capacitor built-in surface wave device having an equivalent circuit as shown in FIG. 5 can be obtained.
上記ヘース１として、例えば誘電率ε−３０００程度の
誘電体基板を使用すれば、コンデンサＣＣ２の容量は、
１００ Ｍｌｌ□付近で使用されているＳＡＷ発振回路
のＤＣカント用コンデンサとほぼ同等の１００ＯＰＦ程
度を得ることができる。したがって、本発明の表面波デ
バイスをＳＡＷ発振回路に適用すれば、従来外付？Ｊさ
れていたＤＣカント用コンデンサが不要となり、回路を
簡素化できる。If, for example, a dielectric substrate with a dielectric constant of about ε-3000 is used as the above-mentioned heath 1, the capacitance of the capacitor CC2 will be:
It is possible to obtain about 100 OPF, which is almost equivalent to the DC cant capacitor of the SAW oscillation circuit used in the vicinity of 100 Mll□. Therefore, if the surface wave device of the present invention is applied to a SAW oscillator circuit, it will be possible to replace the conventional external device. The DC cant capacitor used in J is no longer necessary, and the circuit can be simplified.
なお、」二記実施例では１ボート型の表面波デバイスに
ついて説明したが、他の形式の表面波デバイスにも適用
できる。また、ヘースに設けられるコンデンサ電極は、
２対以上設けてもよい。In the second embodiment, a one-boat type surface wave device has been described, but the present invention can also be applied to other types of surface wave devices. In addition, the capacitor electrode provided on the heath is
Two or more pairs may be provided.
（発明の効果〕
以上の説明で明らかなように、本発明によれば誘電体よ
りなるヘース」二面にキャップを引出電極と接触せずに
封着したので、気密封止が簡単で、接着剤の選定が容易
となる。(Effects of the Invention) As is clear from the above explanation, according to the present invention, since the cap is sealed on two sides of the dielectric heath without contacting the extraction electrode, hermetic sealing is easy and adhesive This makes it easier to select agents.
また、キャップとヘースとが同一材料よりなるので、温
度変化によって両者が熱膨張しても、気密性が全く劣化
せず、信頼性の高い表面波デバイスを得ることができる
。Moreover, since the cap and the heath are made of the same material, even if they expand thermally due to temperature changes, the airtightness does not deteriorate at all, making it possible to obtain a highly reliable surface acoustic wave device.
さらに、ヘース上下面に引出電極を兼ねるコンデンサ電
極を設けることにより、表面波素子を静電容量を介して
外部に交流的δこ接続できるので、小型のコンデンサ内
蔵型表面波デバイスを得ることができる。Furthermore, by providing capacitor electrodes that also serve as extraction electrodes on the top and bottom surfaces of the heath, the surface wave element can be connected to the outside via capacitance in an AC manner, making it possible to obtain a small surface wave device with a built-in capacitor. .
第１図は本発明にかかる表面波デバイスの一例の分解斜
視図、第２図はヘースの下面側の斜視図、第３図は表面
波素子の斜視図、第４図は第１図のＴＶ−ＴＶ線断面図
、第５図は等価回路図、第６図は従来例の分解斜視図で
ある。
１・・・ヘース、２３６．７・・・コンデンリ“電極、
８・・・キャップ封着部、１０ 表面波素子、１５．
１６・・・ボンディングワイヤ、２０・・・キャップ、
２１・・・接着剤。FIG. 1 is an exploded perspective view of an example of the surface wave device according to the present invention, FIG. 2 is a perspective view of the bottom side of the heath, FIG. 3 is a perspective view of the surface wave element, and FIG. 4 is the TV of FIG. 1. -TV sectional view, FIG. 5 is an equivalent circuit diagram, and FIG. 6 is an exploded perspective view of a conventional example. 1...Heas, 236.7...Condenri "electrode,"
8... Cap sealing part, 10 Surface wave element, 15.
16... Bonding wire, 20... Cap,
21...Adhesive.
Claims (1)
とベース上の引出電極とが電気的に接続されるとともに
、ベース上に表面波素子を覆うキャップが封着される表
面波デバイスにおいて、上記ベースが誘電体で構成され
るとともに、キャップがベースと同一材料で構成され、
表面波素子の電極と接続されたベース上面の引出電極は
キャップ封着部より内側に形成され、該引出電極をコン
デンサ電極とするとともに、ベース下面の上記コンデン
サ電極と対向する部位にコンデンサ電極が形成されてい
ることを特徴とする表面波デバイス。In a surface wave device in which a surface wave element is fixed on a base, an electrode of the surface wave element and an extraction electrode on the base are electrically connected, and a cap covering the surface wave element is sealed on the base, The base is made of a dielectric material, and the cap is made of the same material as the base,
An extraction electrode on the top surface of the base connected to the electrode of the surface wave element is formed inside the cap sealing part, and the extraction electrode is used as a capacitor electrode, and a capacitor electrode is formed on the bottom surface of the base at a portion facing the capacitor electrode. A surface wave device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19879089A JPH0362716A (en) | 1989-07-31 | 1989-07-31 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19879089A JPH0362716A (en) | 1989-07-31 | 1989-07-31 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0362716A true JPH0362716A (en) | 1991-03-18 |
Family
ID=16396952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19879089A Pending JPH0362716A (en) | 1989-07-31 | 1989-07-31 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0362716A (en) |
-
1989
- 1989-07-31 JP JP19879089A patent/JPH0362716A/en active Pending
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