JPH0367462U - - Google Patents

Info

Publication number
JPH0367462U
JPH0367462U JP1989128383U JP12838389U JPH0367462U JP H0367462 U JPH0367462 U JP H0367462U JP 1989128383 U JP1989128383 U JP 1989128383U JP 12838389 U JP12838389 U JP 12838389U JP H0367462 U JPH0367462 U JP H0367462U
Authority
JP
Japan
Prior art keywords
light
emitting chip
light emitting
bonded
lead member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989128383U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128383U priority Critical patent/JPH0367462U/ja
Publication of JPH0367462U publication Critical patent/JPH0367462U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は本考案の具体的な一実施例に係る可変
色ＬＥＤを示した縦断面図。第２図は第１図の可
変色ＬＥＤの発光チツプが載置され接合されたリ
ードフレームを示した縦断面図。第３図は第２図
におけるリードフレームを発光チツプ側から見た
平面図。第４図ａはＧａＮ青色発光チツプを示し
た縦断面図。第４図ｂはＧａＡｓ赤色発光チツプ
を示した縦断面図。第４図ｃはＧａＰ緑色発光チ
ツプを示した縦断面図である。 １０……可変色発光ダイオード（可変色ＬＥＤ
）、１１，１５，２１，２５……リード部材、１
３，２３……平坦部、１４，２４……反射部、１
６，１８，２６……発光チツプ、１７，２７……
金線、１９……レンズ部材、２０……リードフレ
ーム。

Claims (1)

  1. 【実用新案登録請求の範囲】 複数種類の発光チツプがリードフレームに接合
    され樹脂成形された可変色発光ダイオードにおい
    て、 同一面上に正負一対の電極部が形成され、光の
    三原色のうち一色を発光する第１の発光チツプと
    、 前記リードフレームの端面で前記第１の発光チ
    ツプが接合される平坦部を有し、その平坦部にお
    いて、前記第１の発光チツプによつて架橋される
    第１及び第２のリード部材と、 前記第１のリード部材の平坦部に下面が接合さ
    れ、上下両面上に正又は負の電極部が形成され、
    光の三原色のうち他の一色を発光する第２の発光
    チツプと、 前記第２のリード部材の平坦部に下面が接合さ
    れ、上下両面上に正又は負の電極部が形成され、
    光の三原色のうち他の一色を発光する第３の発光
    チツプと、 前記第２の発光チツプの上面に形成された電極
    部とワイヤボンデイングされる第３のリード部材
    と、 前記第３の発光チツプの上面に形成された電極
    部とワイヤボンデイングされる第４のリード部材
    と を備えたことを特徴とする可変色発光ダイオード
    。
JP1989128383U 1989-10-31 1989-10-31 Pending JPH0367462U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128383U JPH0367462U (ja) 1989-10-31 1989-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128383U JPH0367462U (ja) 1989-10-31 1989-10-31

Publications (1)

Publication Number Publication Date
JPH0367462U true JPH0367462U (ja) 1991-07-01

Family

ID=31676091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128383U Pending JPH0367462U (ja) 1989-10-31 1989-10-31

Country Status (1)

Country Link
JP (1) JPH0367462U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363635A (ja) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd 発光ダイオード

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049652B2 (ja) * 1981-04-18 1985-11-02 橋本フオ−ミング工業株式会社 合成樹脂成形品の製造方法
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049652B2 (ja) * 1981-04-18 1985-11-02 橋本フオ−ミング工業株式会社 合成樹脂成形品の製造方法
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363635A (ja) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd 発光ダイオード

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