JPH036862U - - Google Patents
Info
- Publication number
- JPH036862U JPH036862U JP6565889U JP6565889U JPH036862U JP H036862 U JPH036862 U JP H036862U JP 6565889 U JP6565889 U JP 6565889U JP 6565889 U JP6565889 U JP 6565889U JP H036862 U JPH036862 U JP H036862U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- diamond film
- patterning
- synthesis
- dissipation board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は従来の放熱基板の一実施例を示す平面
図、第２図は本考案に用いるダイヤモンド膜のパ
ターニング合成を説明する工程断面図、第３図は
マイクロ波プラズマＣＶＤ法の概略説明図、第４
図は本考案に用いるダイヤモンド膜のメタライズ
の工程を説明する工程断面図、第５図は放熱基板
性能比較実験の概略説明平面図である。
１……放熱パターン、２……発熱の多い電気素
子、３……端子、４……基板、５……フオトレジ
スト、６……砥粒と溶媒の混合液、７……Ｔｉと
Ａｕからなる金属膜、８……原料ガス、９……石
英製反応室、１０……マイクロ波発振器、１１…
…導波管、１２……真空排気系、１３……放熱基
板、１４……放熱パターン、１５……ヒートシン
ク、１６……シートヒーター。
Fig. 1 is a plan view showing an example of a conventional heat dissipation substrate, Fig. 2 is a process cross-sectional view explaining the patterning synthesis of the diamond film used in the present invention, and Fig. 3 is a schematic explanatory diagram of the microwave plasma CVD method. , 4th
The figure is a cross-sectional view illustrating the process of metallizing the diamond film used in the present invention, and FIG. 1... Heat dissipation pattern, 2... Electric element that generates a lot of heat, 3... Terminal, 4... Substrate, 5... Photoresist, 6... Mixed liquid of abrasive grains and solvent, 7... Made of Ti and Au. Metal film, 8... Source gas, 9... Quartz reaction chamber, 10... Microwave oscillator, 11...
... Waveguide, 12 ... Vacuum exhaust system, 13 ... Heat radiation board, 14 ... Heat radiation pattern, 15 ... Heat sink, 16 ... Sheet heater.
Claims (1)
放熱基板表面にパターニング合成により熱伝導率
の良いダイヤモンド膜を形成したことを特徴とす
る放熱基板。 (2) 前記ダイヤモンド膜をメタライズしたこと
を特徴とする請求項１記載の放熱基板。[Claims for Utility Model Registration] (1) A heat dissipation board on which an electric element is mounted, characterized in that a diamond film with good thermal conductivity is formed on the surface of the heat dissipation board by patterning synthesis. (2) The heat dissipation substrate according to claim 1, wherein the diamond film is metallized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565889U JPH036862U (en) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565889U JPH036862U (en) | 1989-06-05 | 1989-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036862U true JPH036862U (en) | 1991-01-23 |
Family
ID=31597682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6565889U Pending JPH036862U (en) | 1989-06-05 | 1989-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036862U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014170834A (en) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | Heat radiation structure of power semiconductor and audio device using the same |
-
1989
- 1989-06-05 JP JP6565889U patent/JPH036862U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014170834A (en) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | Heat radiation structure of power semiconductor and audio device using the same |
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