JPH0369251U - - Google Patents
Info
- Publication number
- JPH0369251U JPH0369251U JP13087389U JP13087389U JPH0369251U JP H0369251 U JPH0369251 U JP H0369251U JP 13087389 U JP13087389 U JP 13087389U JP 13087389 U JP13087389 U JP 13087389U JP H0369251 U JPH0369251 U JP H0369251U
- Authority
- JP
- Japan
- Prior art keywords
- bend
- sealing part
- package
- seal
- close contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のＩＣパツケージの
縦断面図、第２図及び第３図はそれぞれ従来のＩ
Ｃパツケージの縦断面図である。 １……ＩＣパツケージ、２……外部リード、３
……実装用プリント基板。
縦断面図、第２図及び第３図はそれぞれ従来のＩ
Ｃパツケージの縦断面図である。 １……ＩＣパツケージ、２……外部リード、３
……実装用プリント基板。
Claims (1)
- 半導体素子の封止部より外方に水平に導出した
外部リードを下方に曲げ、さらに前記封止部の底
面近くで内方に水平に曲げ実装の際の半田付けの
為のリード部分を前記封止部面と密着させる事を
特徴とする半導体集積回路用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13087389U JPH0369251U (ja) | 1989-11-08 | 1989-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13087389U JPH0369251U (ja) | 1989-11-08 | 1989-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369251U true JPH0369251U (ja) | 1991-07-09 |
Family
ID=31678417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13087389U Pending JPH0369251U (ja) | 1989-11-08 | 1989-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369251U (ja) |
-
1989
- 1989-11-08 JP JP13087389U patent/JPH0369251U/ja active Pending
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