JPH0375542U - - Google Patents

Info

Publication number
JPH0375542U
JPH0375542U JP1989137555U JP13755589U JPH0375542U JP H0375542 U JPH0375542 U JP H0375542U JP 1989137555 U JP1989137555 U JP 1989137555U JP 13755589 U JP13755589 U JP 13755589U JP H0375542 U JPH0375542 U JP H0375542U
Authority
JP
Japan
Prior art keywords
glass plate
sealed
optical device
package
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989137555U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989137555U priority Critical patent/JPH0375542U/ja
Publication of JPH0375542U publication Critical patent/JPH0375542U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
本考案の参考例の断面図、第３図は従来のセラミ
ツクパツケージの断面図である。 １……半導体光素子チツプ、２……リードフレ
ーム、２Ａ……セラミツクパツケージ、３……ボ
ンデイング配線、４……透明エポキシ樹脂、４Ａ
……エポキシ樹脂、４Ｂ……キヤツプガラス、５
……ガラス板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 光素子表面にガラス板を直接搭載して封止し、
    前記ガラス板が搭載されていない前記光素子表面
    の残りの領域を樹脂で封したことを特徴とする光
    素子用パツケージ。
JP1989137555U 1989-11-27 1989-11-27 Pending JPH0375542U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989137555U JPH0375542U (ja) 1989-11-27 1989-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989137555U JPH0375542U (ja) 1989-11-27 1989-11-27

Publications (1)

Publication Number Publication Date
JPH0375542U true JPH0375542U (ja) 1991-07-29

Family

ID=31684707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989137555U Pending JPH0375542U (ja) 1989-11-27 1989-11-27

Country Status (1)

Country Link
JP (1) JPH0375542U (ja)

Similar Documents

Publication Publication Date Title
JPS61144650U (ja)
JPH01140850U (ja)
JPH0270450U (ja)
JPS6364046U (ja)
JPS61182036U (ja)
JPH0263544U (ja)
JPH0375539U (ja)
JPS60153538U (ja) 半導体素子
JPH0267658U (ja)
JPH0313748U (ja)
JPH0385673U (ja)
JPH0256450U (ja)
JPH01121956U (ja)
JPS6439643U (ja)
JPS6430854U (ja)
JPH0385648U (ja)
JPH0195767U (ja)
JPS6268246U (ja)
JPH01121953U (ja)
JPH0270446U (ja)
JPH0252443U (ja)
JPH01104720U (ja)
JPH0279046U (ja)
JPH0247053U (ja)
JPS6447066U (ja)