JPH038432U - - Google Patents
Info
- Publication number
- JPH038432U JPH038432U JP6830589U JP6830589U JPH038432U JP H038432 U JPH038432 U JP H038432U JP 6830589 U JP6830589 U JP 6830589U JP 6830589 U JP6830589 U JP 6830589U JP H038432 U JPH038432 U JP H038432U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- peeling
- spatula
- detecting
- crystal wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 claims description 3
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 3
- 239000012498 ultrapure water Substances 0.000 claims description 3
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Description
第１図は本考案の一実施例の平面図であり、第
２図は側面図、第３図は第２図の一部を拡大側面
図である。第４図は第１図に示す剥離装置でウエ
ーハが正常に剥離されたときのロードセル７で検
出した剥離負荷変動を示すグラフ、第４図はウエ
ーハが割れたときの剥離負荷変動を示すグラフで
ある。
１：ウエーハ（単結晶ウエーハ）、２：プレー
ト（プレート）３：ターンテーブル（ターンテー
ブル）、４：剥離用ヘラ（剥離用ヘラ）、５：超
純水シヤワー（超純水シヤワー）、６：３軸ロボ
ツト（３軸ロボツト）、７：ロードセル（ロード
セル）、８……温度センサー（温度センサ）、９
：シユート、１０：フオトセンサー、１１：カセ
ツト、１２：フラツトノズル、１３：フオトセン
サー、１４：エアシリンダー、１５：駆動用モー
ター、１６：カセツト昇降用モーター。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a side view, and FIG. 3 is an enlarged side view of a portion of FIG. 2. Figure 4 is a graph showing peeling load fluctuations detected by the load cell 7 when the wafer is normally peeled off by the peeling device shown in Figure 1, and Figure 4 is a graph showing peeling load fluctuations when the wafer is broken. be. 1: Wafer (single crystal wafer), 2: Plate (plate), 3: Turntable (turntable), 4: Peeling spatula (peeling spatula), 5: Ultrapure water shower (ultrapure water shower), 6: 3-axis robot (3-axis robot), 7: Load cell (load cell), 8...Temperature sensor (temperature sensor), 9
: Shoot, 10: Photo sensor, 11: Cassette, 12: Flat nozzle, 13: Photo sensor, 14: Air cylinder, 15: Drive motor, 16: Cassette lifting motor.
補正 平１．８．２９
図面の簡単な説明を次のように補正する。
明細書第９頁第１７行の「第４図」を「第５図
」と訂正する。Amendment 1.8.29 Hei 1. The brief description of the drawing is amended as follows. "Fig. 4" on page 9, line 17 of the specification is corrected to "Fig. 5."
Claims (1)
て保持する傾斜したターンテーブルと、３軸ロボ
ツトに取り付けられ該プレートの上方にてＸＹＺ
方向に移動可能な剥離用ヘラと、該ヘラに作用す
る剥離負荷を検出するロードセルと、前記プレー
トの上面に向けられた超純水シヤワーと、該プレ
ートの表面温度を検出する温度センサーを有する
ことを特徴とする単結晶ウエーハの剥離装置。 A tilted turntable on which a plate with a single crystal wafer bonded to it is placed and held;
A peeling spatula movable in a direction, a load cell for detecting a peeling load acting on the spatula, an ultrapure water shower directed toward the top surface of the plate, and a temperature sensor for detecting the surface temperature of the plate. A single-crystal wafer peeling device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830589U JPH038432U (en) | 1989-06-12 | 1989-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830589U JPH038432U (en) | 1989-06-12 | 1989-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH038432U true JPH038432U (en) | 1991-01-28 |
Family
ID=31602626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6830589U Pending JPH038432U (en) | 1989-06-12 | 1989-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH038432U (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53117378A (en) * | 1977-03-23 | 1978-10-13 | Nec Corp | Assembling device of semiconductor device |
| JPS5874040A (en) * | 1981-09-04 | 1983-05-04 | エムイーエムシー エレクトロニック マテリアルズ，インコーポレーテッド | Method and device for controlling temperature for polishing wafer |
| JPS61127142A (en) * | 1984-11-26 | 1986-06-14 | Sankyo Seiki Mfg Co Ltd | Device for exfoliation of wafer |
| JPS6388828A (en) * | 1986-10-01 | 1988-04-19 | Hitachi Electronics Eng Co Ltd | Steam seasoning system |
| JPS6392038A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Chip feeding method |
| JPH0193126A (en) * | 1987-10-03 | 1989-04-12 | Takahiro Oishi | Process of releasing semiconductor wafer from plate |
-
1989
- 1989-06-12 JP JP6830589U patent/JPH038432U/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53117378A (en) * | 1977-03-23 | 1978-10-13 | Nec Corp | Assembling device of semiconductor device |
| JPS5874040A (en) * | 1981-09-04 | 1983-05-04 | エムイーエムシー エレクトロニック マテリアルズ，インコーポレーテッド | Method and device for controlling temperature for polishing wafer |
| JPS61127142A (en) * | 1984-11-26 | 1986-06-14 | Sankyo Seiki Mfg Co Ltd | Device for exfoliation of wafer |
| JPS6388828A (en) * | 1986-10-01 | 1988-04-19 | Hitachi Electronics Eng Co Ltd | Steam seasoning system |
| JPS6392038A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Chip feeding method |
| JPH0193126A (en) * | 1987-10-03 | 1989-04-12 | Takahiro Oishi | Process of releasing semiconductor wafer from plate |